Typeset from the PDF of the official document — headings, motions and recorded votes are detected automatically, so spacing may differ from the original. The official copy governs.
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• Owner Introductions • Project Site Location • Roadside View Renderings • Exterior Point of View Renderings • High Quality Exterior Visualizations • Project Site Exterior Renderings • Site Phasing and Scope of Work Plans • Landscaping Approach • Making Memory Chips- Semiconductor Manufacturing Process Video • Site Plan Application Checklist • Appendix • Exterior Building Elevations • Campus Building Materials Palette • Supporting Site Planning Diagrams • Proposed Variances • Permitting Drawing List Project Yankee Planning Board Presentation - October 08, 2025 2 Micron New York Project Introduction Katie Birchenough 3 Founded on Headquartered in ~ 52,000 October 5, 1978 Boise, Idaho, USA team members worldwide China Xi’an Assembly/test
Japan Hiroshima Fab
United States Taiwan Boise, ID Manassas, VA Taichung Clay, NY Mexico Taoyuan DRAM, NAND and NOR Fab and assembly/test DRAM * Guadalajara India Singapore *Gujarat Singapore Fab and assembly/test Malaysia NAND Muar Manufacturing sites Penang R&D integrated with MFG Assembly/test DRAM, NAND and NOR * Coming soon 4 The CHIPS Act Reshoring Semiconductor Manufacturing • The CHIPS Act prioritizes leading edge technology, including Dynamic Random-Access Memory (DRAM), often used in computer coding.
• The US currently produces only 1% of global DRAM all of which is produced by Micron.
• In contrast, South Korea has a 44% global market share in memory.
• Micron's US-based investments will increase US DRAM production by 12 % over the next two decades.
• Micron has received CHIPS funding and is therefore deemed a critical project for economic and national security in the US.
• Micron must meet certain construction and operation milestones to receive the CHIPS funding.
5 Micron’s Site Selection of Clay, NY • Minimum of 1,000 acres of contiguous land and shaped to accommodate the required layout.
• Relatively flat topography and geotechnical makeup required to support Fab buildings.
Micron New York • Zoned or able to be zoned for industrial use.
• Within 20 miles of a highway and other transportation avenues for people and materials.
• Adequate natural gas and electricity supply including high reliability and carbon-free electricity.
• Adequate water supply and access to wastewater treatment.
• Availability of a specialized workforce.
6 Status of Environmental Review and Permitting • Micron's project is currently undergoing a joint federal and state environmental review.
• Micron and the lead agencies (CPO and OCIDA) are working to finalize the EIS.
• Once the EIS is finalized and OCIDA has issued its Findings and Determination (CPO has issued its Record of Decision), Micron will need to receive permits and approvals necessary to begin tree clearing:
o NYS Wetland Permit (DEC) o NYS Incidental Take Permit (DEC) o Clean Water Act 401 Certification (DEC) o MS4/ SWPPP (Town of Clay/ DEC) o Federal Incidental Take Statement (USFWS) o Federal Wetland Permit (USACE) o Site Plan Approval, Zoning Variances 7 Construction Planning Jeffrey Maidment 8 Site Master Plan 9 10 Site Master Plan – Phase 1 Town of Cicero Town of Clay Rail Spur NYS Route 31 11 12 13 Micron Fab Construction Video in Idaho Memory made in America: Micron’s Idaho fab takes shape | Micron Technology 14
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Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 16
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Viewpoint of campus shows new landscaping with 15-year projected growth. Image represents full site build out of all phases. Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 18
Viewpoint of campus shows new landscaping with 15-year projected growth. Image represents full site build out of all phases. Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 19
Viewpoint of campus shows new landscaping with 15-year projected growth. Image represents full site build out of all phases. Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 20
Viewpoint of campus shows new landscaping with 15-year projected growth. Image represents full site build out of all phases. Fence line shown in foreground with WWT and CUB building beyond. Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 21
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 22
23 SOUTH FAÇADE OF PROBE AND ADMIN BUILDINGS
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Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 38 CAMPUS – ALL PHASES
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 39 CAMPUS – PHASE 1
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• OVERALL LANDSCAPING APPROACH • 1 – MAIN ENTRANCE • 2 – SECONDARY ENTRANCE • 3 – FRONT YARD • 4 – PARKING LOT • 5 – ADMIN BUILDING DROP-OFF AND ENTRY PLAZA • PLANTING DETAILS • PLANTING SCHEDULE 41
Note: Plan renderings, details and plant schedules are for conceptual representation and site plan approval only. Final landscape architecture design and details will be provided with engineering permit drawings and issued for construction plans, in accordance with Town of Clay, Town of Cicero, Onondaga County and State of New York.
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• Entry design will incorporate a large concrete retaining wall on left side of main entrance to make a statement. The wall will be nestled into grade/berms. This will echo the walls at the drop-off.
• A cohesive signage strategy based on Micron’s signage standards will be seamlessly incorporated into the landscape design.
• Micron light bars (L2) will be installed on the backside of each wall. The “M” landmark will be installed in the middle of the entry median, and the monument logo identity (S2) will be in the open lawn to the right of the entrance. • Provide a sequential arrival experience with native plantings that open to views of the FOH buildings, and clear sight lines for vehicles. • Native grasses and perennial focused landscapes will dominate edges with a manicured lawn in the foreground. • Bioswales/dry swales will be located along the entry drive to act as snow collection and stormwater collection areas. The edges will be planted with pollinator plants. • Incorporate multi-model entrance with mixed-use trail (walkers, bikers). Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 43
• Secondary entry will be a scaled down version of main entry.
Landscape will have identical approach with the exception of no hardscape. A cohesive signage strategy based on Micron’s signage standards will be seamlessly incorporated into the landscape design. • Micron light bars (L2) will be installed on the backside of each wall. The “M” landmark will be installed in the middle of the entry median, and the monument logo identity (S2) will be in the open lawn to the right of the entrance. • Provide a sequential arrival experience with native plantings that open to views of the FOH buildings, and clear sight lines for vehicles. • Bioswales/dry swales will be located along the entry drive to act as snow collection and stormwater collection areas. The edges will be planted with pollinator plants. Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 44 3 – FRONT YARD
• Conserve existing trees where feasible. • Provide native plantings consistent to local recommendations and availability. • Consider conserving existing landscapes and providing enhancements such as revegetation or reforestation. • Select species for wet/dry site tolerance, salt tolerance, etc., drought tolerance. • Screen and beautify views from the Admin building. Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 45 4 – PARKING LOT
• Provide (1) native tree planting and (3) native shrub plantings per 10 parking spaces. • Integrate E.V. charging stations into landscape. • Seasonal snow storage is accommodated within native planting beds. • Screen and beautify views from the Admin building. Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 46 5 – ADMIN BUILDING DROP-OFF AND ENTRY PLAZA Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 47
Note: Plan renderings, details and plant schedules are for conceptual representation and site plan approval only. Final landscape architecture design and details will be provided with engineering permit drawings and issued for construction plans, in accordance with Town of Clay, Town of Cicero, Onondaga County and State of New York. Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 48
• Project planting schedule includes the following areas: • Stormwater Management Area • Dense Screening • Floodplain Forest • Bioretention • Front Perimeter Landscape • Young Forest and Shrublands Transition • Project planting schedule includes the following seed mixes: • Wet Meadow • Emergent Wetland • Floodplain Forest • Upland • Young, Shrublands Old Field • Full planting schedule has been submitted with the Site Plan Application. See sheet PMT_B00_L0_0205. Note: Plan renderings, details and plant schedules are for conceptual representation and site plan approval only. Final landscape architecture design and details will be provided with engineering permit drawings and issued for construction plans, in accordance with Town of Clay, Town of Cicero, Onondaga County and State of New York. Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 49
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Making Memory Chips - Semiconductor Manufacturing Process Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 51
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• EXTERIOR BUILDING ELEVATIONS • CAMPUS BUILDING MATERIAL PALETTE • SUPPORTING SITE PLANNING DIAGRAMS • PROPOSED VARIANCES • PERMITTING DRAWING LIST 54
• OVERALL BUILDING DIMENSIONS
• ADMIN • PROBE • FAB • CUB • HPM • WWT 55
NOTE: BUILDING HEIGHTS ARE MEASURED FROM GRADE TO THE LEVEL OF THE HIGHEST
BUILDING.
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 56 ADMIN BUILDING – NORTH AND SOUTH ELEVATIONS
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 57 ADMIN BUILDING – EAST AND WEST ELEVATIONS
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 58 PROBE BUILDING – NORTH AND SOUTH ELEVATIONS
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 59 PROBE BUILDING – EAST AND WEST ELEVATIONS, GARAGE LINK ELEVATION
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 60 FAB BUILDING – EAST ELEVATIONS
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 61 FAB BUILDING – WEST ELEVATIONS
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 62 FAB BUILDING – NORTH AND SOUTH ELEVATIONS
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 63 CUB BUILDING – EAST AND WEST ELEVATIONS – MOD 1
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 64 CUB BUILDING – NORTH AND SOUTH ELEVATIONS – MOD 1
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 65 CUB BUILDING – NORTH, EAST, AND WEST ELEVATIONS – MOD 2
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 66 HPM BUILDING – EAST AND WEST ELEVATIONS
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 67 HPM BUILDING – NORTH AND SOUTH ELEVATIONS
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 68 WWT BUILDING – NORTH AND SOUTH ELEVATIONS
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METAL PANEL CURTAIN WALL INSULATED PRECAST IMP (Insulated Metal Panel) RAINSCREEN SYSTEM (Unitized & Storefront) CONCRETE • Adequate for the northern • High-performing for the • High-performing for the • High durability NY climate northern NY climate northern NY climate • Off-site fabrication and • Metal-clad insulation with • Pre-fabricated backup wall • Aluminum framing system reduces on-site construction factory applied coating and with metal panel outer layer with insulated glazing or time integral joints with factory applied coating metal panel infill • Field-applied coating on the • A variety of grades, profiles, • Large-scale prefabrication • Highest level of finish precast surface to reduce and coatings are available reduces waste and on-site • Durable and requires little to staining construction time • Durable and requires little to no maintenance • Heavy weight – not no maintenance • Durable and requires little to recommended for upper no maintenance levels Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 72
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• Insulated Metal Panel systems consist of interlocking panels of metal clad rigid insulation fastened to a backup structure.
• The panel joints are performance tested and can rely on factory or field installed seals. Insulation values vary with panel thickness.
• Panels come in a variety of profiles and finishes.
• Backup assembly flexibility.
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ILLUSTRATIVE ELEVATIONS ELEVATION WALL SECTION Unitized Curtain Wall Storefront Curtain Wall Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 75
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ELEVATION WALL SECTION
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• STORM DRAINAGE – EDINGER WETLANDS • STORM DRAINAGE – COWARDIN WETLANDS • UTILITY CORRIDORS • CIRCULATION • DUMPSTERS • FIRE RESPONSE • WATER MANAGEMENT • LIGHTING • CONSTRUCTION LOGISTICS • SITE AND EXTERIOR SIGNAGE 79 STORM DRAINAGE – EDINGER WETLANDS
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Roadside range of view from LEGEND Secondary Entrance Roadside range of view from Primary Entrance Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 84
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• REQUIRED LOADING DOCKS • PARKING • FENCING HEIGHT • SITE SETBACK • PRIMARY AND SECONDAY STRUCTURES 91 VARIANCE- REQUIRED LOADING DOCKS (ZBA CASE #1988)
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 92 VARIANCE- PARKING (ZBA CASE #1988)
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 93 VARIANCE- FENCING HEIGHT (ZBA CASE #1988) TOWN OF CLAY ZONING CODE § 230-17(D)(5) EXCERPT FROM ZONING BOARD OF APPEALS NARRATIVE - SECTION II-C,
The proposed fence design is a 7’ tall chain link perimeter fence, with 18” of barbed wire on top. The total fence height is 8.5’.
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 94 VARIANCE- SITE SETBACK (ZBA CASE #1988)
200’ FRONT YARD SETBACK
Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 95 VARIANCE- PRIMARY AND SECONDARY STRUCTURES (ZBA CASE #1988) Accessory Structure: A structure or mechanical equipment or decorative device attached or detached from the principal structure.
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• Full size Project Permitting Drawings are on file with the Town of Clay, New York.
• Issued for Permit – August 28th, 2025 Micron New York Semiconductor Manufacturing Facility - Planning Board Presentation - October 08, 2025 98