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Micron Semiconductor Manufacturing Project, Clay, NY Final Environmental Impact Statement EISX-006-55-CPO-001 | November 2025 U.S. Department of Commerce, CHIPS Program Office Onondaga County Industrial Development Agency U.S. Army Corps of Engineers U.S. Environmental Protection Agency MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
Final Environmental Impact Statement Designation:
Title of Proposed Action: Final Environmental Impact Statement (EIS) for the Micron Semiconductor Manufacturing Facility Project Location: Town of Clay, Onondaga and Oswego Counties, New York Joint Lead Agencies: U.S. Department of Commerce and Onondaga County Industrial Development Agency (OCIDA) NEPA Cooperating Agencies: U.S. Army Corps of Engineers (USACE), and U.S. Environmental Protection Agency (USEPA) NEPA Participating Agencies: U.S. Fish and Wildlife Service (USFWS), U.S. Department of Transportation (USDOT), and Federal Highway Administration (FHWA) NEPA Participating Entity: Onondaga Nation SEQRA Involved Agencies: New York State Department of Environmental Conservation (NYSDEC), Empire State Development, including the New York State Department of Economic Development and the New York State Urban Development Corporation (ESD), New York Department of State (NYSDOS), New York State Department of Transportation (NYSDOT), New York State Office of Parks, Recreation and Historic Preservation (OPRHP), New York State Office of General Services (NYSOGS), New York Power Authority (NYPA), New York State Canal Corporation, Onondaga County Department of Transportation (OCDOT), Onondaga County Water Authority (OCWA), Onondaga County Department of Water Environment Protection (OCDWEP), Town of Clay Town Board, Town of Clay Zoning Board, Town of Clay Planning Board, and Town of Cicero Planning Board Affected Regions: Onondaga, Oswego, Cayuga, Madison, Oneida, and Seneca Counties, New York, and the territories of the Onondaga Nation and the Haudenosaunee Confederacy Further Information: NEPA: National Institute of Standards and Technology, Creating Helpful Incentives to Produce Semiconductors (CHIPs) Program Office (CHIPSNEPA@chips.gov) SEQRA: Robert Petrovich, Executive Director; Onondaga County Industrial Development Agency, 335 Montgomery Street, Floor 2M, Syracuse, NY 13202 (Micron@ongov.net) Public Comment Period Close August 11, 2025 Date:
i MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
0.0 Executive Summary ..........................................................................................................0-0 0.1 Overview ...................................................................................................................0-0 0.2 Proposed Project and Connected Actions .....................................................................0-2 0.3 Alternatives ................................................................................................................0-5 0.4 Environmental Analysis ..............................................................................................0-6 0.5 Cumulative Effects ................................................................................................... 0-15 0.6 Unavoidable Significant Adverse Effects .................................................................. 0-16 0.7 Irreversible or Irretrievable Commitments of Environmental Resources ..................... 0-18 1.0 Introduction ......................................................................................................................1-1 1.1 Purpose and Need .......................................................................................................1-5 1.2 Preparation of the EIS .............................................................................................. 1-11 1.3 Public Review and Comment .................................................................................... 1-15 1.4 Permits, Approvals, and Consultations ...................................................................... 1-17 2.0 Proposed Action and Alternatives ....................................................................................2-1 2.1 Proposed Project and Connected Actions .....................................................................2-1 2.2 Alternatives .............................................................................................................. 2-42 2.3 Proposed Project Construction Schedule ................................................................... 2-47 3.0 Environmental Analysis....................................................................................................3-1 3.1 Land Use, Zoning, and Public Policy ..........................................................................3-2 3.2 Geology, Soils, and Topography ............................................................................... 3-35 3.3 Water Resources ....................................................................................................... 3-56 3.4 Biological Resources ................................................................................................ 3-98 3.5 Historic and Cultural Resources .............................................................................. 3-143 3.6 Air Quality ............................................................................................................. 3-157 3.7 Greenhouse Gas Emissions, Climate Change, and Climate Resiliency ...................... 3-193 3.8 Solid Waste, Hazardous Waste, and Hazardous Materials ........................................ 3-226 3.9 Human Health and Safety ....................................................................................... 3-262 3.10 Utilities and Supporting Infrastructure .................................................................... 3-273 3.11 Transportation and Traffic ...................................................................................... 3-294 3.12 Noise and Vibration ................................................................................................ 3-359 3.13 Visual Effects and Community Character ................................................................ 3-414 3.14 Community Facilities, Open Space, and Recreation ................................................. 3-453 3.15 Socioeconomic Conditions ...................................................................................... 3-475 3.16 Environmental Justice ............................................................................................. 3-513 3.17 Summary of Effects ................................................................................................ 3-540 4.0 Cumulative Effects ...........................................................................................................4-1 4.1 Definition of Cumulative Effects ................................................................................4-1 4.2 Scope of Cumulative Effects Analysis .........................................................................4-1 4.3 Cumulative Effects Analysis ..................................................................................... 4-12 5.0 Other Considerations Required by SEQRA .....................................................................5-1 5.1 Unavoidable Significant Adverse Effects ....................................................................5-1 5.2 Irreversible or Irretrievable Commitments of Environmental Resources ....................... 5-3 6.0 References .........................................................................................................................6-1 7.0 List of Preparers ...............................................................................................................7-1 7.1 NEPA Lead Agency - U.S. Department of Commerce .................................................. 7-1 7.2 SEQRA Lead Agency – Onondaga County Industrial Development Agency ................. 7-1 7.3 Third-Party NEPA Contractors ...................................................................................7-2 ii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT 7.4 Project Proponent – Micron Technology, Inc. ..............................................................7-9 8.0 Distribution List ...............................................................................................................8-1 8.1 Federal Agencies ........................................................................................................8-1 8.2 Indigenous Nations .....................................................................................................8-1 8.3 SEQRA Involved Agencies .........................................................................................8-2 8.4 SEQRA Interested Agencies .......................................................................................8-4 iii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
Figure 1.0-1 Proposed Project Location Map ............................................................................................ 1-3 Figure 1.1-1 Micron Technology Proposal to Increase U.S. DRAM Production ...................................... 1-8 Figure 1.1-2 Proposed Project and Competitor Campus Cleanroom Space ............................................ 1-10 Figure 2.1-1 Proposed Project and Connected Actions.............................................................................. 2-2 Figure 2.1-2 Proposed Micron Campus Boundary .................................................................................... 2-1 Figure 2.1-3 Proposed Project and Connected Actions Construction Timeline ......................................... 2-2 Figure 2.1-4 Micron Campus Visual Rendering ........................................................................................ 2-6 Figure 2.1-5 Micron Campus Site Plan...................................................................................................... 2-9 Figure 2.1-6 Proposed Project On-Site Construction, Operation, and Total Headcount (2025- 2045) .................................................................................................................................. 2-14 Figure 2.1-7 Rail Spur and Aggregate Materials Conveyance System Plan ............................................ 2-17 Figure 2.1-8 Childcare Site ...................................................................................................................... 2-21 Figure 2.1-9 Electricity Improvements .................................................................................................... 2-25 Figure 2.1-10 Proposed Natural Gas Line and Clay Substation Expansion............................................. 2-27 Figure 2.1-11 Proposed Water Supply Improvements ............................................................................. 2-29 Figure 2.1-12 Proposed Raw Water Pump Station Upgrades .................................................................. 2-32 Figure 2.1-13 Proposed LOWTP Upgrades and Transmission Mains ..................................................... 2-33 Figure 2.1-14 Proposed Terminal Campus and Eastern Branch Upgrades .............................................. 2-34 Figure 2.1-15 Proposed Eastern Branch Connection to Micron Campus ................................................ 2-35 Figure 2.1-16 Proposed OOWWTP Expansion and New IWWTP ......................................................... 2-38 Figure 2.1-17 Proposed Industrial Wastewater and Reclaimed Water Conveyance ................................ 2-40 Figure 2.2-1 Reduced Scale Alternative Layout ...................................................................................... 2-44 Figure 2.2-2 U.S. Route 11 Access Elimination Layout .......................................................................... 2-46 Figure 3.1-1 Existing Land Uses in Land Use Study Area ........................................................................ 3-4 Figure 3.1-2 Other Announced or Planned Projects in Land Use Study Area ........................................... 3-5 Figure 3.1-3 Farmland Classes within Land Use Study Area .................................................................. 3-12 Figure 3.1-4 Farmland Classes at Proposed Project and Connected Action Locations ........................... 3-13 Figure 3.1-5 Farmland Classes at Oak Orchard Site and OCWA Terminal Campus ............................... 3-14 Figure 3.1-6 Farmland Classes at OCWA Lake Ontario Water Treatment Plant ..................................... 3-15 Figure 3.1-7 Agricultural Districts within Land Use Study Area............................................................. 3-16 Figure 3.1-8 Agricultural Districts at Oak Orchard Site and OCWA Terminal Campus.......................... 3-17 Figure 3.1-9 Agricultural Districts at OCWA Lake Ontario Water Treatment Plant ................................ 3-18 Figure 3.1-10 Current Zoning in Land Use Study Area ........................................................................... 3-20 Figure 3.1-11 Land Use Changes Due to the Proposed Project ............................................................... 3-25 Figure 3.1-12 Zoning District Change on Micron Campus ..................................................................... 3-29 Figure 3.2-1 Depth to Bedrock at Boring Locations ................................................................................ 3-38 Figure 3.2-2 Soils at Proposed Project Sites and Clay Substation Expansion Area................................. 3-41 Figure 3.2-3 Soils at Oak Orchard Site and OCWA Terminal Campus ................................................... 3-42 Figure 3.2-4 Bedrock Removal Locations ............................................................................................... 3-49 Figure 3.3-1 Proposed Project Water Resources Study Area Map ........................................................... 3-57 Figure 3.3-2 Connected Actions Water Resources Study Area ................................................................ 3-58 Figure 3.3-3 Surface Water and Wetland Connections to Traditional Navigable Waters......................... 3-66 Figure 3.3-4 Proposed Compensatory Mitigation Sites ........................................................................... 3-94 Figure 3.4-1 Micron Campus Ecological Communities ........................................................................ 3-101 Figure 3.4-2 Rail Spur Site Ecological Communities ............................................................................ 3-102 Figure 3.4-3 Childcare Site Ecological Communities............................................................................ 3-103 Figure 3.4-4 Effects on Ecological Communities at Micron Campus ................................................... 3-120 Figure 3.5-1 Proposed Project Direct and Indirect APEs ....................................................................... 3-146 Figure 3.5-2 Direct and Indirect APE (OCWA LOWTP) ...................................................................... 3-147 iv MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Figure 3.5-3 Direct and Indirect APE (OCWA Terminal Campus) ........................................................ 3-148 Figure 3.5-4 Direct and Indirect APE (IWWTP) ................................................................................... 3-149 Figure 3.6-1 Stationary and Regional (Mobile) Air Quality Study Area ............................................... 3-164 Figure 3.7-1 Overview of GHG Emissions Scopes across Value Chain ................................................ 3-198 Figure 3.7-2 Average Scope 1 (Direct) GHG Emissions 2014-2022 Semiconductor Industry (NAICS 334412) by Gas and Percentage of Total Emissions.......................................... 3-199 Figure 3.7-3 New York GHG Emissions by Economic Sector, 1990-2022, in MMT CO2e 1 ................ 3-200 Figure 3.9-1 NIOSH Hierarchy of Controls........................................................................................... 3-264 Figure 3.10-1 2023 Load Zone C Net Electricity Generation ................................................................ 3-275 Figure 3.10-2 NYISO 2030 Base Case Large Load Projection (Fabs 1-2) ............................................ 3-280 Figure 3.10-3 Planned Solar Panel Locations ........................................................................................ 3-283 Figure 3.10-4 Micron Industrial Wastewater Reclamation Process ....................................................... 3-289 Figure 3.10-5 Proposed Project Water Life Cycle ................................................................................. 3-290 Figure 3.11-1 Study Area: Transportation Network ............................................................................... 3-296 Figure 3.11-2 Roadway Characteristics ................................................................................................. 3-300 Figure 3.11-3 Freeway LOS (Existing Conditions) ............................................................................... 3-301 Figure 3.11-4 Intersection LOS (Existing Conditions) .......................................................................... 3-302 Figure 3.11-5 Bicycle and Pedestrian Facilities ..................................................................................... 3-304 Figure 3.11-6 Transit Routes .................................................................................................................. 3-307 Figure 3.11-7 Freeway LOS (No Action Alternative in 2027) ............................................................... 3-312 Figure 3.11-8 Intersection LOS (No Action Alternative in 2027).......................................................... 3-313 Figure 3.11-9 Freeway LOS (No Action Alternative in 2031) ............................................................... 3-314 Figure 3.11-10 Intersection LOS (No Action Alternative in 2031)........................................................ 3-315 Figure 3.11-11 Freeway LOS (No Action Alternative in 2041) ............................................................. 3-316 Figure 3.11-12 Intersection LOS (No Action Alternative in 2041)........................................................ 3-317 Figure 3.11-13 Freeway LOS (Preferred Action Alternative in 2027) ................................................... 3-319 Figure 3.11-14 Intersection LOS (Preferred Action Alternative in 2027).............................................. 3-320 Figure 3.11-15 Freeway LOS (Preferred Action Alternative in 2031) ................................................... 3-324 Figure 3.11-16 Intersection LOS (Preferred Action Alternative in 2031 ............................................... 3-325 Figure 3.11-17 Freeway LOS (Preferred Action Alternative in 2041) ................................................... 3-330 Figure 3.11-18 Intersection LOS (Preferred Action Alternative in 2041).............................................. 3-331 Figure 3.11-19 Freeway LOS (Preferred Action Alternative with Recommended Mitigations in 2031) ................................................................................................................................ 3-338 Figure 3.11-20 Intersection LOS (Preferred Action Alternative with Recommended Mitigations in 2031) ................................................................................................................................ 3-339 Figure 3.11-21 Freeway LOS (Preferred Action Alternative with Recommended Mitigation 2041) .... 3-344 Figure 3.11-22 Intersection LOS (Preferred Action Alternative with Recommended Mitigation 2041) ................................................................................................................................ 3-345 Figure 3.11-23 Recommended Mitigations............................................................................................ 3-357 Figure 3.12-1 Typical Outdoor Noise Levels ......................................................................................... 3-362 Figure 3.12-2 Typical Levels of Ground-Bourne Vibration ................................................................... 3-363 Figure 3.12-3 Micron Campus and Rail Spur Construction Site Construction and Operations Study Area ....................................................................................................................... 3-369 Figure 3.12-4 Childcare Site -Construction and Operations Study Area and Traffic Noise Study Area.................................................................................................................................. 3-370 Figure 3.12-5 Traffic Noise Study Area ................................................................................................. 3-371 Figure 3.12-6 Noise Measurement Monitoring Locations ..................................................................... 3-376 Figure 3.12-7 Predicted Noise Effects from Construction of Micron Campus ...................................... 3-383 Figure 3.12-8 Predicted Noise Effects from Construction of the Rail Spur Site ................................... 3-385 Figure 3.12-9 Predicted Noise Effects from Operation of Micron Campus .......................................... 3-389 Figure 3.12-10 Sensitive Receptors Near Proposed National Grid Substation Expansion .................... 3-399 v MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Figure 3.12-11 Sensitive Receptors Near Proposed GRS 147A ............................................................ 3-401 Figure 3.12-12 Sensitive Receptors Near Proposed Improvements to OCWA LOWTP Facility .......... 3-403 Figure 3.12-13 Sensitive Receptors Near Proposed Improvements to OCWA Terminal Campus ......... 3-404 Figure 3.12-14 Sensitive Receptors Near Proposed Improvements to Oak Orchard WWTP ................ 3-405 Figure 3.12-15 Proposed Temporary and Permanent Noise Barriers to Abate Significant Effects from the Micron Campus (West) and Rail Spur Site ....................................................... 3-410 Figure 3.12-16 Proposed Temporary and Permanent Barriers to Abate Significant Noise Effects from the Micron Campus (East) ...................................................................................... 3-411 Figure 3.12-17 Proposed Temporary Barriers to Abate Significant Noise Effects from Construction of the Childcare Site ................................................................................... 3-412 Figure 3.13-1 Visual Effects Study Area and Viewpoints ...................................................................... 3-417 Figure 3.13-2 Clay Substation Expansion Area Viewpoints .................................................................. 3-418 Figure 3.13-3 Other Connected Action Viewpoints ............................................................................... 3-419 Figure 3.13-4 Typical Views of Micron Campus Site ............................................................................ 3-421 Figure 3.13-5 Typical Views of Rail Spur and Childcare Sites.............................................................. 3-422 Figure 3.13-6 Viewpoint 71 Photo Simulation ...................................................................................... 3-427 Figure 3.13-7 Viewpoint 61 Photo Simulation ...................................................................................... 3-428 Figure 3.13-8 Viewpoint 73 Photo Simulation ...................................................................................... 3-429 Figure 3.13-9 Viewpoint 77 Photo Simulation ...................................................................................... 3-430 Figure 3.13-10 Viewpoint 35 Photo Simulation .................................................................................... 3-431 Figure 3.13-11 Viewpoint 19 Photo Simulation..................................................................................... 3-433 Figure 3.13-12 Viewpoint 67 Photo Simulation .................................................................................... 3-435 Figure 3.13-13 Viewpoint 3 Photo Simulation ...................................................................................... 3-436 Figure 3.13-14 Viewpoint 66 Photo Simulation .................................................................................... 3-437 Figure 3.13-15 Viewpoint 20 Photo Simulation .................................................................................... 3-438 Figure 3.13-16 Viewpoint 7 Photo Simulation ...................................................................................... 3-440 Figure 3.13-17 Viewpoint 75 Photo Simulation .................................................................................... 3-441 Figure 3.13-18 Viewpoint 74 Photo Simulation .................................................................................... 3-442 Figure 3.13-19 Viewpoint 76 Photo Simulation .................................................................................... 3-443 Figure 3.13-20 Viewpoint 52 Photo Simulation .................................................................................... 3-445 Figure 3.13-21 Viewpoint 67 Photo Simulation (Rail Spur Site) .......................................................... 3-447 Figure 3.13-22 Viewpoint 72 Photo Simulation .................................................................................... 3-448 Figure 3.14-1 Police, Fire, and EMS ..................................................................................................... 3-454 Figure 3.14-2 Healthcare Facilities ........................................................................................................ 3-457 Figure 3.14-3 Public School Districts overlapping Study Area ............................................................. 3-459 Figure 3.14-4 Open Space and Recreational Resources ........................................................................ 3-461 Figure 3.14-5 Regional Park System ..................................................................................................... 3-462 Figure 3.15-1 Local Study Area ............................................................................................................. 3-477 Figure 3.15-2 Regional Study Area........................................................................................................ 3-478 Figure 3.15-3 Proposed Project On-Site Construction Jobs (2025–2045)* ........................................... 3-493 Figure 3.15-4 Proposed Project On-Site Operational Jobs 2025-2045 .................................................. 3-497 Figure 3.15-5 Proposed Project Total Jobs 2025-2045 .......................................................................... 3-499 Figure 3.16-1 Environmental Justice Study Area .................................................................................. 3-516 Figure 3.16-2 DACs and Minority or Low-Income Communities in Study Area.................................. 3-518 Figure 3.16-3 DACs and Minority or Low-Income Communities Near the Proposed Project and Adjacent Connected Actions ............................................................................................ 3-522 Figure 3.16-4 DACs and Minority or Low-Income Communities Near the Connected Actions (Southern Section) ........................................................................................................... 3-523 Figure 3.16-5 DACs and Minority or Low-Income Communities Near the Connected Actions (Northern Section) ........................................................................................................... 3-524 Figure 4.2-1 Present and Reasonably Foreseeable Actions - Proposed Project Local Area ...................... 4-4 vi MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Figure 4.2-2 Present and Reasonably Foreseeable Actions - Regional ...................................................... 4-5 vii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
Table 1.2-1 State and Local Involved and Interested Agencies ............................................................... 1-13 Table 1.4-1 Permits, Approvals, and Consultations ................................................................................. 1-17 Table 2.1-1 Proposed Project and Connected Actions ............................................................................... 2-3 Table 2.1-2 Micron Campus Fab Construction Schedule .......................................................................... 2-5 Table 2.1-3 Micron Campus Components ............................................................................................... 2-10 Table 2.1-4 Rail Spur Site Components ................................................................................................... 2-18 Table 2.1-5 Childcare Site Components................................................................................................... 2-22 Table 2.1-6 OCWA Phase 1 Improvements (for Fabs 1-2) ...................................................................... 2-30 Table 2.1-7 OCWA Phase 2 Improvements (for Fabs 3-4) ...................................................................... 2-31 Table 3.1-1 Legal and Regulatory Setting.................................................................................................. 3-2 Table 3.1-2 Other Announced or Planned Projects in Land Use Study Area ............................................. 3-6 Table 3.1-3 Existing Utility Properties and Proposed Improvements (Connected Actions) ...................... 3-8 Table 3.1-4 Protected Farmland ............................................................................................................... 3-11 Table 3.1-5 Land Use Study Area Zoning District Descriptions.............................................................. 3-21 Table 3.1-6 Existing Utility Property Zoning .......................................................................................... 3-22 Table 3.2-1 Legal and Regulatory Setting................................................................................................ 3-35 Table 3.2-2 Soil Types at Proposed Project and Connected Action Sites ................................................ 3-43 Table 3.2-3 Slopes by Percentage at Proposed Project and Connected Action Locations ....................... 3-46 Table 3.2-4 Bedrock Removal Locations and Volumes ........................................................................... 3-50 Table 3.2-5 Best Management Practices .................................................................................................. 3-54 Table 3.3-1 Laws and Regulations ........................................................................................................... 3-59 Table 3.3-2 Permits and Approvals .......................................................................................................... 3-60 Table 3.3-3 Federal and State Wetland Types .......................................................................................... 3-62 Table 3.3-4 Wetland Functions and Services ........................................................................................... 3-63 Table 3.3-5 Federal, State, and Non-Jurisdictional Wetland Acreages .................................................... 3-67 Table 3.3-6 Delineated Federal Jurisdictional Surface Waters................................................................. 3-70 Table 3.3-7 Anticipated Direct Losses of Jurisdictional Wetlands (Proposed Project) ............................ 3-76 Table 3.3-8 Potential Indirect Effects on Remaining Wetlands ............................................................... 3-77 Table 3.3-9 Anticipated Direct Losses of Federal Jurisdictional Streams................................................ 3-78 Table 3.3-10 Potential Indirect Effects on Remaining Rivers and Streams ............................................. 3-79 Table 3.3-11 Proposed Stormwater Management Practices ..................................................................... 3-88 Table 3.3-12 BMPs for Protection of Water Resources ........................................................................... 3-91 Table 3.3-13 Proposed Federal Wetland and Surface Water Mitigation .................................................. 3-95 Table 3.3-14 Micron Mitigation Plan Timeline........................................................................................ 3-96 Table 3.4-1 Existing Ecological Communities and Dominant Vegetation (Proposed Project) .............. 3-104 Table 3.4-2 Existing Ecological Communities (Clay Substation Expansion Area) ............................... 3-108 Table 3.4-3 Existing Land Cover Types (Other Connected Actions) ..................................................... 3-109 Table 3.4-4 Potentially Occurring Special Status Species Based on Search Results ............................. 3-111 Table 3.4-5 Potentially Occurring Special Status Species Based on Presence of Suitable Habitat ....... 3-114 Table 3.4-6 Effects on Ecological Communities (Proposed Project) ..................................................... 3-118 Table 3.4-7 Effects on Ecological Communities (Micron Campus) ...................................................... 3-119 Table 3.4-8 Construction Effects on Ecological Communities (Micron Campus)................................. 3-121 Table 3.4-9 Anticipated CPO Effect Determinations (Proposed Project) .............................................. 3-126 Table 3.4-10 Pre- and Post-Construction Roosting Habitat Acreage by Project Component ................ 3-128 Table 3.4-11 Projected Land Cover Loss Due to Induced Growth by 2041 .......................................... 3-137 Table 3.4-12 Best Management Practices .............................................................................................. 3-138 Table 3.4-13 Mitigation Measures for Protected Bat Species ................................................................ 3-140 Table 3.6-1 National Ambient Air Quality Standards ............................................................................ 3-158 Table 3.6-2 East Syracuse and Rochester Background Air Quality Concentrations .............................. 3-166 0-0 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Table 3.6-3 Summary Existing Emission Totals in Study Area in 2020 (Tons)1.................................... 3-167 Table 3.6-4 Summary of Mobile On-Road & Off-Road Emissions in New York State in 2020 (Tons)1.............................................................................................................................. 3-168 Table 3.6-5 Regional Mobile Source Pollutant Burdens and Mobile Source Air Toxics Burdens (Tons Per Year) – No Action ............................................................................................ 3-169 Table 3.6-6 Stationary Source Construction Potential Emissions Summary (tpy)................................. 3-171 Table 3.6-7 Estimated Micron Campus Post-Control Emissions Summary (tpy)1 ................................ 3-173 Table 3.6-8 OCDWEP IWWTP Operation Emissions Summary (tpy) .................................................. 3-174 Table 3.6-9 Summary of Percent Increase in Emissions from the Proposed Project ............................. 3-175 Table 3.6-10 NAAQS Results ................................................................................................................ 3-178 Table 3.6-11 SGC and AGC Results ...................................................................................................... 3-179 Table 3.6-12 Annual Construction Emissions (tpy) ............................................................................... 3-181 Table 3.6-13 Construction Emissions Compared to New York State Totals .......................................... 3-182 Table 3.6-14 Regional Mobile Source Criteria Pollutant Emissions ..................................................... 3-183 Table 3.6-15 Regional 2031 Criteria Pollutant Change in Emissions Compared to New York State Totals................................................................................................................................ 3-184 Table 3.6-16 Micron Campus PM Design Concentrations in 2041 (µg/m3) .......................................... 3-186 Table 3.6-17 Site 1 Combined Mobile and Stationary Sources PM Design Concentrations in 2041 (µg/m3) ............................................................................................................................. 3-187 Table 3.6-18 Site 2 Combined Mobile and Stationary Sources PM Design Concentrations in 2041 (µg/m3) ............................................................................................................................. 3-188 Table 3.6-19 Site 3 Combined Mobile and Stationary Sources PM Design Concentrations in 2041 (µg/m3) ............................................................................................................................. 3-189 Table 3.6-20 BMPs for Air Quality ........................................................................................................ 3-191 Table 3.7-1 National GHG Emissions Standards for Passenger Cars and Light Trucks for Model Years 2023-2026 .............................................................................................................. 3-195 Table 3.7-2 Greenhouse Gas Global Warming Potentials ...................................................................... 3-197 Table 3.7-3 30-year Climate Normals at the USW00014771 Syracuse Hancock International Airport Station1 ................................................................................................................ 3-202 Table 3.7-4 Risk and Vulnerability1 ....................................................................................................... 3-204 Table 3.7-5 Regional Mobile Source Vehicle Miles Traveled (VMT) and GHG Emissions – No Action .............................................................................................................................. 3-206 Table 3.7-6 Annual Scope 1 (Direct) Construction Emissions from Fuel Combustion1 (Metric Tons per Year) .................................................................................................................. 3-208 Table 3.7-7 GHG Construction Emission Factors for Micron Fab (GWP100) ...................................... 3-209 Table 3.7-8 OCDWEP IWWTP Construction GHG Emissions (GWP100) .......................................... 3-210 Table 3.7-9 GHG Emissions from Scope 3 Upstream Fuel Production and Transport for Construction1 (Metric Tons per Year) .............................................................................. 3-211 Table 3.7-10 Proposed Project Total GHG Emissions (GWP20)........................................................... 3-214 Table 3.7-11 Proposed Project Total GHG Emissions (GWP100) ......................................................... 3-215 Table 3.7-12 Regional Mobile Source VMT and GHG Emissions ........................................................ 3-218 Table 3.7-13 Project Design GHG Reduction Measures – Quantified GHG Emissions Reductions1 ... 3-224 Table 3.7-14 BMPs for GHGs and Climate Change .............................................................................. 3-225 Table 3.8-1 Legal and Regulatory Setting.............................................................................................. 3-228 Table 3.8-2 Relevant Permits, Licenses, and Registrations ................................................................... 3-230 Table 3.8-3 Proposed Project Construction-Related Non-Hazardous Solid Waste and Reusable or Recyclable Material ......................................................................................................... 3-236 Table 3.8-4 Proposed Project Operation-Related Solid Waste vs. Reusable or Recyclable Material .... 3-242 Table 3.8-5 Industrial and Commercial Materials for Micron RRR Program ....................................... 3-245 Table 3.8-6 Micron Campus Operation-Related Hazardous Waste........................................................ 3-246 Table 3.8-7 Hazardous Waste Accumulation Quantities by Fab ............................................................ 3-247 0-1 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Table 3.8-8 Hazardous and Universal Waste Disposal and RRR Management Methods ...................... 3-247 Table 3.8-9 Hazardous Material Types, Hazards, and Controls ............................................................. 3-252 Table 3.8-10 Hazardous Materials ......................................................................................................... 3-253 Table 3.8-11 IWWTP Chemical Bulk Storage Quantities...................................................................... 3-255 Table 3.8-12 Induced Growth Incremental MSW Projections ............................................................... 3-256 Table 3.8-13 Best Management Practices .............................................................................................. 3-259 Table 3.9-1 Legal and Regulatory Setting.............................................................................................. 3-262 Table 3.9-2 Micron Campus Process Hazards and Risk Management Measures .................................. 3-267 Table 3.9-3 Micron Campus Example Hazard Control Measures ......................................................... 3-269 Table 3.9-4 Micron Campus Additional IH Program Measures............................................................. 3-270 Table 3.9-5 BMPs for Human Health and Safety .................................................................................. 3-272 Table 3.10-1 Estimated Proposed Project Annual Electricity Consumption .......................................... 3-280 Table 3.10-2 Estimated Proposed Project Annual Peak Natural Gas Consumption .............................. 3-284 Table 3.10-3 Estimated Proposed Project Average Freshwater Usage................................................... 3-285 Table 3.10-4 Estimated Proposed Project Annual Industrial Wastewater Discharge ............................. 3-288 Table 3.10-5 BMPs for Utilities and Supporting Infrastructure ............................................................. 3-293 Table 3.11-1 Transportation Legal and Regulatory Setting ................................................................... 3-294 Table 3.11-2 LOS at Intersections .......................................................................................................... 3-298 Table 3.11-3 LOS at Freeways ............................................................................................................... 3-298 Table 3.11-4 Significant Impacts Criteria .............................................................................................. 3-299 Table 3.11-5 Intersections with High Delays (Existing Conditions)...................................................... 3-303 Table 3.11-6 Existing Bus Transit Services ........................................................................................... 3-305 Table 3.11-7 No Action Alternative Results Summary (2027, 2031 and 2041) ..................................... 3-311 Table 3.11-8 Impacted Freeway Segments (No Action Alternative vs. Preferred Action Alternative in 2027) ............................................................................................................................ 3-321 Table 3.11-9 Impacted Intersections (No Action Alternative vs. Preferred Action Alternative in 2027) ................................................................................................................................ 3-321 Table 3.11-10 Impacted Freeway Segments (No Action Alternative vs. Preferred Action Alternative in 2031) ......................................................................................................... 3-326 Table 3.11-11 Impacted Intersections (No Action Alternative vs. Preferred Action Alternative in 2031) ................................................................................................................................ 3-326 Table 3.11-12 Impacted Freeway Segments (No Action Alternative vs. Preferred Action Alternative in 2041) ......................................................................................................... 3-332 Table 3.11-13 Impacted Intersections (No Action Alternative vs. Preferred Action Alternative in 2041 AM peak) ................................................................................................................ 3-333 Table 3.11-14 Impacted Intersections (No Action Alternative vs. Preferred Action Alternative in 2041 PM peak) ................................................................................................................. 3-334 Table 3.11-15 Impacted Freeway Segments Comparison - 2031........................................................... 3-340 Table 3.11-16 Impacted Intersections Comparison – 2031 .................................................................... 3-340 Table 3.11-17 Impacted Freeway Segments Comparison - 2041........................................................... 3-346 Table 3.11-18 Impacted Intersections Comparison – 2041 AM Peak .................................................... 3-348 Table 3.11-19 Impacted Intersections Comparison – 2041 PM Peak .................................................... 3-349 Table 3.12-1 Potential Sources of Noise and Vibration from the Preferred Action Alternative............. 3-359 Table 3.12-2 Noise and Vibration Terms and Concepts ......................................................................... 3-359 Table 3.12-3 Local Noise and Vibration Requirements and State and Federal Guidance ..................... 3-364 Table 3.12-4 Construction Vibration Damage Criteria .......................................................................... 3-368 Table 3.12-5 Noise and Vibration Peak Period Analysis Scenarios ....................................................... 3-372 Table 3.12-6 Existing Conditions: Summary of Measured Noise Levels at Monitoring Areas ............. 3-377 Table 3.12-7 Modeled Existing Baseline Traffic Noise Exposure ......................................................... 3-378 Table 3.12-8 Summary of Predicted Noise Exposure from Construction of Micron Campus ............... 3-381 Table 3.12-9 Predicted Noise Effect from Construction of Rail Spur Site ............................................ 3-384 0-2 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Table 3.12-10 Predicted Noise Exposure from Construction of Childcare Site..................................... 3-386 Table 3.12-11 Predicted Noise Exposure from Operation of Micron Campus ...................................... 3-387 Table 3.12-12 Preferred Action Alternative: Summary of Predicted Traffic Noise Exposure Above Significance Threshold1 ................................................................................................... 3-392 Table 3.12-13 Summary of Predicted Significant Construction and Operation Effects of the Preferred Action Alternative1 ........................................................................................... 3-393 Table 3.12-14 Summary of Noise Exposure and Increases Over Ambient Levels of the Preferred Action Alternative ............................................................................................................ 3-395 Table 3.12-15 Summary of Proposed Noise Abatement Measures ........................................................ 3-413 Table 3.13-1 Legal and Regulatory Setting............................................................................................ 3-415 Table 3.13-2 Representative Photo Simulations of Views of Micron Campus ...................................... 3-426 Table 3.14-1 Police, Fire, and EMS ....................................................................................................... 3-455 Table 3.14-2 Healthcare Facilities.......................................................................................................... 3-458 Table 3.14-3 Public School District Enrollment in Study Area ............................................................. 3-460 Table 3.14-4 Open Space and Recreational Resources in Study Area ................................................... 3-463 Table 3.14-5 Fire and EMS Incidents at Micron Technology Boise, ID Facility................................... 3-468 Table 3.14-6 Five-County Region Public School Enrollment................................................................ 3-472 Table 3.14-7 Estimated Changes in School-Aged Children from 2020-2041........................................ 3-472 Table 3.14-8 Best Management Practices .............................................................................................. 3-474 Table 3.15-1 Town of Clay 2025 Adopted Budget................................................................................. 3-485 Table 3.15-2 Town of Cicero 2025 Final Budget ................................................................................... 3-485 Table 3.15-3 School Districts that Service the Local Study Area 2023-2024 Budgets and Enrollment Trends ........................................................................................................... 3-487 Table 3.15-4 Connected Actions – Responsible Parties and Beneficiaries ............................................ 3-496 Table 3.15-5 Induced Household Growth Projections Exceeding 10 Percent of Existing Household Estimates ....................................................................................................... 3-501 Table 3.15-6 Projected Supply Chain Jobs by Industry ......................................................................... 3-505 Table 3.15-7 Projected Jobs Supporting Household Spending .............................................................. 3-506 Table 3.16-1 Regulatory Setting ............................................................................................................ 3-513 Table 3.16-2 DAC Tracts within 5 Miles of Proposed Project and/or ½ Mile of Connected Actions ... 3-525 Table 3.17-1 Summary of Effects .......................................................................................................... 3-540 Table 4.2-1 Present and Reasonably Foreseeable Actions ......................................................................... 4-6 Table 4.3-1 Summary of Predicted Effect of Cumulative Traffic Mitigation Scenario C on Traffic Noise Impacts1 ................................................................................................................... 4-28 Table 4.3-2 Cumulative Household Growth Projections by County and Select Municipalities Exceeding 10 percent of 2023 Household Estimates ......................................................... 4-32 0-3 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
Abbreviations/ Definition Acronyms µg/m³ Micrograms per Cubic Meter 3D NAND Three dimensional “not and” AADT Annual Average Daily Traffic ACGIH American Conference of Governmental Industrial Hygienists ACHP Advisory Council on Historic Preservation ACM Asbestos-Containing Material ACS American Community Survey AED semi-automatic defibrillator AERMAP AERMOD Terrain Pre-processor AERMET AERMOD Meteorological Pre-processor AERMOD AMS/EPA Regulatory Model AERR Air Emissions Reporting Rule AFFF aqueous film forming foam AGC Annual Guideline Concentration AHA American Heart Association AI artificial intelligence AJD Approved Jurisdictional Determination AKRF AKRF, Inc.
AMHS Automated Material Handling System AMR American Medical Response APE Area of Potential Effects ARM2 Ambient Ratio Method 2 ASCE American Society of Civil Engineers AQCR Air Quality Control Region ASOS Automated Surface Observing System 0-4 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT AST Aboveground Storage Tank ASTM American Society for Testing and Materials ATR automatic traffic recorder BACT Best Available Control Technology BBA Breeding Bird Atlas BEI Biological Exposure Indices BGEPA Bald and Golden Eagle Protection Act BIO biological treatment BA Biological Assessment BLS Bureau of Labor Statistics BMPs best management practices BOS Boston Consulting Group BPIP-PRIME Building Profile Input Program BRT Bus Rapid Transit BUD Beneficial Use Determination C&D Construction and Demolition Debris CAA Clean Air Act CAAS Commission on Accreditation of Ambulance Services Cadna-A Computer Aided Noise Abatement CAU capital asset utilization CBC Christmas Bird Count CBS Chemical Bulk Storage CCARP Climate Change and Resilience Plan CDD Construction and demolition debris CEC Community Engagement Committee CECPN Certificate of Environmental Compatibility and Public Need CEHAs Coastal Erosion Hazard Areas 0-5 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT CEJST Climate and Economic Justice Screening Tool CEQ Council on Environmental Quality CF4 carbon tetrafluoride CFR Code of Federal Regulations CGP Construction General Permit (or General Permit for Stormwater Discharges from Construction Activity) CH4 Methane CHIPS Creating Helpful Incentives to Produce Semiconductors CIF Community Investment Fund CJWG Climate Justice Working Group Clay Fire Clay Fire Department CLCPA Climate Leadership and Community Protection Act CME CME Associates, Inc.
CMP Chemical Mechanical Planarization; Coastal Management Program CNY Central New York CNYRPDB Central New York Regional Planning and Development Board CNYREDC Central New York Regional Economic Development Council CO Carbon monoxide CO2 Carbon Dioxide CO2e CO2 equivalents County Onondaga County CP Commissioner Policy CPI Consumers Price Index CPO CHIPS Program Office CPR cardiopulmonary resuscitation CPT Cone Penetration Testing CRIS Cultural Resource Information System CRRA Community Risk and Resiliency Act 0-6 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT CRT Crisis Management Team CSD Central School District CSX Freight Rail Owner CT Census Tract CUB(s) central utility building(s) CVD Chemical Vapor Deposition CWA Clean Water Act CWMP Construction Waste Management Plan CY cubic yards CZMA Coastal Zone Management Act DA Department of the Army DAC Disadvantaged Community DACAT Disadvantaged Communities Assessment Tool DAR Department of Air Resources dB Decibels dBA Decibel A-weighted level DDI Diverging Diamond Interchange DEM Onondaga County Department of Emergency Management DEP Division of Environmental Permits DNL Daytime Nighttime Equivalent Sound Level descriptor DRAM dynamic random-access memory DSL Digital Subscriber Line EAF Environmental Assessment Form ECL Environmental Conservation Law ECS Syracuse University College of Engineering and Computer Science EDPL New York State Eminent Domain Procedure Law EDR Environmental Design & Research 0-7 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT eGRID Emissions & Generation Resource Integrated Database EHS Environmental, Health, and Safety EIS Environmental Impact Statement EMD Emergency Medical Dispatch EMS Emergency Medical Services EMT Emergency Medical Technician EMT-B Emergency Medical Technician-Basic EO Executive Order EPCRA Emergency Planning and Community Right-to-Know Act ERCs Emission Reduction Credits ERMS Emergency Response Management System ERT Emergency Response Team ESA Endangered Species Act ESD Empire State Development ETC Estimated Time of Completion EUV extreme ultraviolet EV electric vehicle fab fabrication facilities fab memory fabrication unit Fab Fabrication Building(s) FEIS Final Environmental Impact Statement FEMA Federal Emergency Management Agency F-Gases Fluorinated Gases FHWA Federal Highway Administration FIFRA Federal Insecticide, Fungicide, and Rodenticide Act FIRMs flood insurance rate maps FLM Federal Land Manager 0-8 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT FSL Forecast Systems Laboratory FPPA Farmland Protection Policy Act FRA Federal Railroad Administration FSMS Fiscal Stress Monitoring System FTA Federal Transit Administration FTTH Fiber to the Home FWS Fish and Wildlife Service GC General Contractor GDP gross domestic product GHG Greenhouse Gas(es) GHS United Nations Globally Harmonized System of Classification and Labelling of Chemicals GIS Geospatial Information System GML General Municipal Law GNM Great Northern Mall gpm gallons per minute GRS Gas Regulator Station GW gigawatt GWh gigawatt-hours GWP100 20-year basis Global Warming Potential GWP20 100-year basis Global Warming Potential HAP(s) Hazardous Air Pollutant(s) HAZWOPER Hazardous Waste Operations and Emergency Response HCM Highway Capacity Manual HDD horizontal directional drilling HDM Highway Design Manual HFCs Hydrofluorocarbons HI Hazards Index 0-9 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT HMTA Hazardous Materials Transportation Act HPM Hazardous Process Materials HRSA Health Resources and Services Administration HTF Heat Transfer Fluid HUCs Hydrologic Unit Codes HUD United States Department of Housing and Urban Development HWCP Hazardous Waste Contingency Plan IDLH Immediately Dangerous to Life and Health IH Industrial Hygiene IND Industrial IPaC Information for Planning and Consultation IPCC Intergovernmental Panel on Climate Change ISHD Integrated Surface Hourly Data ISO International Organization for Standardization IWTP Industrial Wastewater Discharge Permit IWWTP Industrial Wastewater Treatment Plant JEDEC Joint Electron Device Engineering Council JHA Job Hazard Analysis JPA Joint Permit Application kV kilovolt KSYR Syracuse Hancock International Airport L10 Sound level that is exceeded ten percent of the time (90th percentile) LAER Lowest Achievable Emission Rate lbs pounds LCD Liquid Crystal Display Lday Daytime noise level LDN Average noise level over a 24-hour period (DNL)
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT LEED Leadership in Energy and Environmental Design LEHD Longitudinal Employer-Household Dynamics LEPC Local Emergency Planning Committee Leq Equivalent Noise Level LF linear feet Lnight Nighttime noise level LOD Limit of Disturbance LOS Level of Service LOWTP Lake Ontario Water Treatment Plant LQG Large Quantity Generator LRTP Long Range Transportation Plan LSWMP Local Solid Waste Management Plan LWRP Local Waterfront Revitalization Program MASW Multichannel Analysis of Surface Waves MBR membrane biological reactor MBTA Migratory Bird Treaty Act MCF thousand cubic feet MCL maximum contaminant levels MDth thousand dekatherms megafabs mega-fabrication facilities MERP Modeled Emission Rates for Precursors MEMS Micro-electromechanical Systems MG million gallon MGD million gallons per day Micron Micron New York Semiconductor Manufacturing LLC mmt Millions of metric tons MOE measure of effectiveness
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT MOSF Major Oil Storage Facility MOVES Motor Vehicle Emission Simulator MOVES4 Motor Vehicle Emission Simulator MPA Metropolitan Planning Area mph mile(s) per hour MSAT Mobile Source Air Toxics MSGP Multi-Sector General Permit MSW municipal solid waste Mt Megatonne MTP Metropolitan Transportation Plan MW Megawatt N2O Nitrous Oxide NAAQS National Ambient Air Quality Standards NABTU North America’s Building Trades Unions NAC FHWA Noise Abatement Criteria NAICS North American Industry Classification System NAVAC North Area Volunteer Ambulance Corps NCEI National Centers for Environmental Information NEI National Emissions Inventory NEPA National Environmental Policy Act NESHAP National Emission Standards for Hazardous Air Pollutants NF3 nitrogen trifluoride NFPA National Fire Protection Association NHL National Historic Landmarks NHPA National Historic Preservation Act NIMS/ICS National Incident Management System/Incident Command System NIOSH National Institute for Occupational Safety and Health
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT NIST National Institute of Standards and Technology NLCD National Land Cover Database NLUS Northern Land Use Study NNSR Nonattainment New Source Review NO2 Nitrogen dioxide NOAA National Oceanic and Atmospheric Administration NOFO Notice of Funding Opportunity NOI Notice of Intent NOVA Northern Onondaga Volunteer Ambulance NOX Oxides of Nitrogen NPDES National Pollutant Discharge Elimination System NRCS Natural Resources Conservation Service NRHP National Register of Historic Places NSPS New Source Performance Standards NSR New Source Review NWS National Weather Service NY New York NYCDOT New York City Department of Transportation NYCRR New York Codes, Rules, and Regulations NYISO New York Independent System Operator NYNHP New York Natural Heritage Program NYPA New York Power Authority NYS New York State NYSEDC New York State Economic Development Council NYSDEC New York State Department of Environmental Conservation NYSCIA New York State Climate Impacts Assessment NYSDOH New York State Department of Health
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT NYSDOL New York State Department of Labor NYSDOS New York Department of State NYSDOT New York State Department of Transportation NYSDPS New York State Department of Public Service NYSED New York State Education Department NYSERDA New York State Energy Research & Development Authority NYSRHP New York State Register of Historic Places NYSHPA The New York State Historic Preservation Act of 1980 NYSHPO New York State Historic Preservation Office NYSOGS New York Office of General Services NYSOSC Office of the New York State Comptroller NYSPSC New York State Public Service Commission NYSTA New York State Thruway Authority O3 Ozone OCDOT Onondaga County Department of Transportation OCDWEP Onondaga County Department of Water Environment Protection OCIDA Onondaga County Industrial Development Agency OCM BOCES Onondaga-Cortland-Madison Board of Cooperative Educational Services OCRRA Onondaga County Resource Recovery Agency OCRRF Onondaga County Resource Recovery Facility OCWA Onondaga County Water Authority OECD Organisation for Economic Co-operation and Development OEL Occupational Exposure Limit OHWM ordinary high water mark OLM Ozone Limiting Method OOWWTP Oak Orchard Wastewater Treatment Plant OPHRP Office of Parks, Recreation, and Historic Preservation
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT OSHA Occupational Safety and Health Administration OTR Ozone Transport Region Pb Lead PBS Petroleum Bulk Storage pc/mi/ln passenger cars per mile per lane PCBs polychlorinated biphenyls PCE Passenger Car Equivalent pcphpl passenger cars per hour per lane PDD Planning Development Districts PEECs Process Equipment Exhaust Conditioners PEJAs Potential environmental justice areas PEL Permissible Exposure Limit PEM palustrine emergent PFAS per- and polyfluoroalkyl substances PFCs Perfluorocarbons PFO palustrine forested PFOA perfluorooctanoic acid PFOS perfluorooctane sulfonic acid Phase I ESA Phase I Environmental Site Assessment PHF peak hour factor PILOT Payment In Lieu of Taxes PJD preliminary jurisdictional determination PM Particulate Matter PM10 Particulate matter with an aerodynamic diameter smaller than or equal to 10 micrometers PM2.5 Particulate matter with an aerodynamic diameter smaller than or equal to 2.5 micrometers POM Polycyclic Organic Matter
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT POTW publicly owned treatment works POW palustrine open water POU point-of-use ppb Parts per billion PPE Personal Protective Equipment ppm Parts per million PPV Peak Particle Velocity PSD Prevention of Significant Deterioration PSL Public Service La PSM Process Safety Management PSS palustrine scrub/shrub PTE Potential to Emit PTP Pre-Task Plan PTW Permit-to-Work PUB palustrine unconsolidated bottom PV Photovoltaic Cell PWL Sound Power Level QCEW Quarterly Census of Employment and Wages QEP Qualified Environmental Professional RA-1OO Residential/Agricultural RACT Reasonably Available Control Technology Ramboll Ramboll Americas Engineering Solutions, Inc.
RBLC Reasonably Available Control Technology/Best Available Control Technology/Lowest Achievable Emission Rate Clearinghouse RCNM Roadway Construction Noise Model RCR Rock Cut Road RCRA Resource Conservation and Recovery Act RCTOs rotor-concentrator thermal oxidizers
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT RECs Renewable energy credits REMI Regional Economic Models, Inc.
RMP Risk Management Plan; Risk Management Program RMSE root mean squared error RMW Regulated Medical Waste ROD Record of Decision ROI Region of Influence ROW right-of-way RRR reuse, recycle, and recovery RTOR right turn on red RWPS Raw Water Pump Station SF6 sulfur hexafluoride S/NR State/National Register SCF standard cubic feet SCSD Syracuse City School District SEMI S2 Semiconductor Equipment and Materials International Standard 2 SEMI-NY Semiconductor Manufacturing Initiative SEQR State Environmental Quality Review SEQRA State Environmental Quality Review Act SERC State Emergency Response Commission SERCs State Emergency Response Commissions SF6 sulfur hexafluoride SFHA special flood hazard areas SFR saturation flow rate SGC Short-term Guideline Concentration SGEIS Supplemental Generic Environmental Impact Statement SHER Safety, Health, & Essential Rights
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT SHIA Syracuse Hancock International Airport SHPO State Historic Preservation Office SIA Semiconductor Industry Association SIP State Implementation Plan SIRS Student Information Repository System SMMP Soil and Materials Management Plan SMP(s) stormwater management practice(s) SMTA Syracuse Metropolitan Transportation Authority SMTC Syracuse Metropolitan Transportation Council SNOP Sales & Operations Planning SO2 Sulfur dioxide SPCC Spill Prevention Control and Countermeasure SPDES State Pollutant Discharge Elimination System SPL Sound Pressure Level SPL Lmax Maximum Sound Pressure Level SPR Spill Prevention Report SPT Standard Penetration Testing sq. ft. square feet SR State Register of Historic Places SSAs sole source aquifers SSURGO Soil Survey Geographic STAMP Science, Technology, and Advanced Manufacturing Park STPH short tons per hour SUNY State University of New York SWPPP Stormwater Pollution Prevention Plan T&E Threatened and Endangered TAZ traffic analysis zone
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT TEM Transportation Environmental Manual TGM Toxic Gas Monitoring TIS Traffic Impact Study TLV Threshold Limit Value TMA trimethylaluminum TMC turning movement count TNM FHWA Traffic Noise Model TNW Traditional Navigable Waterways tpy Tons per year TRI Toxics Release Inventory TSCA Toxic Substances Control Act TTR Transportation Technical Report TWT The Wetland Trust U.S. United States USCB U.S. Census Bureau (USCB) USDOT United States Department of Transportation USACE United States Army Corps of Engineers USEPA United States Environmental Protection Agency USFWS U.S. Fish and Wildlife Service USGS United States Geological Survey UST Underground Storage Tank UVIR Ultraviolet Infrared v/c volume-to-capacity ratio VCC vehicle classification count VdB Vibration decibel level VMT Vehicle Miles Traveled V-NAND vertical “not and”
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT VOC Volatile Organic Compound(s) VSQG Very Small Quantity Generator WBV Water bath vaporizer WMA(s) Wildlife Management Area(s) WOPW water output per week WOTUS Waters of the U.S.
WPCP White Pine Commerce Park WQV water quality volume WSCs Workplace Safety Committees WTE Waste-to-Energy WWTP Wastewater Treatment Plant ZID Zone of Immediate Dilution
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
The Creating Helpful Incentives to Produce Semiconductors (CHIPS) for America Act is a set of bipartisan legislation that was enacted in 2020 and 2022 to revitalize the semiconductor manufacturing industry in the United States and accelerate domestic production of cutting-edge logic and memory chips. Under the authority of the CHIPS Act, the U.S. Department of Commerce created the CHIPS Program Office (CPO) to administer the CHIPS Incentives Program, which aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security.
The Onondaga County Industrial Development Agency (OCIDA) is authorized to develop commerce and industry and advance job opportunities in the State of New York. In addition, the State has committed to attracting new semiconductor manufacturing and related material supplier projects to the State through measures such as the New York Green CHIPS Program and the Green CHIPS Excelsior Jobs Tax Credit Program.
On June 14, 2023, Micron New York Semiconductor Manufacturing LLC (Micron), a wholly owned subsidiary of Micron Technology, Inc., submitted an application to OCIDA requesting certain financial assistance pursuant to New York General Municipal Law § 854(14). Micron’s application, as amended and restated, includes the lease and eventual purchase of the White Pine Commerce Park (WPCP) in Clay, New York and the undertaking of potential property condemnation pursuant to the New York Eminent Domain Procedure Law.
On August 18, 2023, Micron filed an application with CPO for direct funding under the CHIPS Incentives Program’s February 28, 2023, Notice of Funding Opportunity (NOFO) for the purpose of constructing commercial semiconductor fabrication facilities in Clay, New York. On December 5, 2024, the U.S. Department of Commerce approved Micron’s application for an award under the NOFO. The purpose and need for CPO’s Proposed Action are to fulfill the Department of Commerce’s statutory responsibilities under the CHIPS Act, including the requirement to provide Federal financial assistance to covered entities 1 to incentivize investment in facilities and equipment in the U.S. for the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment. 2 Specifically, Micron proposes to construct and operate a large-scale, state-of-the-art dynamic random-access memory (DRAM) semiconductor manufacturing facility (the Micron Campus) at the WPCP. Micron also proposes to construct a rail spur and construction material conveyance facility to reduce truck trips and support construction of the Micron Campus (the Rail Spur Site) and a childcare center, healthcare center, and recreation center (the Childcare Site) to 1 The term “covered entity” means a nonprofit entity, a private entity, a consortium of private entities, or a consortium of nonprofit, public, and private entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment. 15 U.S.C. § 4651(2).
2 15 U.S.C. § 4652(a)(1).
0-0 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT serve its employees, and to lease existing warehouse space within 20 miles of the Micron Campus (the Warehouse Site). The Micron Campus, Rail Spur Site, Childcare Site, and Warehouse Site are collectively referred to as the Proposed Project. The Proposed Project also would require utility and infrastructure improvements to meet its electricity, natural gas, water supply, wastewater, and telecommunications needs, collectively referred to as the Connected Actions.
The construction of the Proposed Project would take place in stages over approximately 16 years. Subject to the receipt of all applicable permits, authorizations, and approvals, Micron would mobilize for initial site preparation for the Proposed Project beginning in the fourth quarter of 2025, with the first two DRAM manufacturing facilities (Fabs 1 and 2) estimated to be operational by 2029 and 2030, respectively, and the remaining fabs (Fabs 3 and 4) estimated to be operational by 2035 and 2041, respectively. The manufacturing facility would ramp up to full production output by 2045. The Connected Actions would be constructed on a parallel schedule to meet the utility needs for the Proposed Project as it scales up over the 16-year construction period. The Proposed Project would be supported by more than $100 billion of private investment over the course of the next two decades, with a first phase of investment of $20 billion planned by the end of this decade. At full operational capacity in 2045 the Proposed Project would generate more than 9,000 permanent on-site operational jobs and spur the creation of approximately 40,000 additional jobs in the regional economy and throughout New York State, including vendor, supply chain, construction, and community jobs. Upon completion, the Proposed Project would be the largest domestic producer of DRAM chips, which have crucial applications in military equipment, cybersecurity technology, the aerospace industry, artificial intelligence (AI), and other cutting- edge uses, as well as more common areas of the domestic consumer economy.
CPO and OCIDA jointly prepared this Final Environmental Impact Statement (EIS) to evaluate the reasonably foreseeable environmental effects of the Proposed Project and Connected Actions pursuant to the National Environmental Policy Act of 1969 (NEPA), 42 U.S.C. §§ 4321 et seq., and the State Environmental Quality Review Act (SEQRA), as codified at N.Y. Envtl. Conserv. Law §§ 8-0101 et seq. and its implementing regulations at 6 N.Y.C.R.R. Part 617. The purpose of the EIS is to identify and assess the reasonably foreseeable environmental effects of the Proposed Project and Connected Actions and a reasonable range of alternatives, facilitate public involvement and informed agency decision-making, and recommend appropriate mitigation measures. The EIS provides a basis for coordinated Federal, State, Indigenous Nation, and local input and review in a single document.
The EIS includes five main chapters. Chapter 1 provides a detailed introduction to CPO and OCIDA and their roles as the joint lead agencies for the environmental review of Micron’s Proposed Project under NEPA and SEQRA, along with information on other agencies and interested parties involved in the environmental review. Chapter 2 provides a comprehensive overview of the various components of the Proposed Project and Connected Actions and a discussion of the alternatives that CPO and OCIDA considered. Chapter 3 is divided into 16 sections analyzing the reasonably foreseeable effects of the Proposed Project and Connected Actions on various resource areas. Chapter 4 analyzes the reasonably foreseeable cumulative effects of the Proposed Project and Connected Actions. Chapter 5 discusses the unavoidable significant adverse effects and the irreversible or irretrievable commitments of environmental resources that would occur if the Proposed Project and Connected Actions are implemented. 0-1 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT This Executive Summary provides a high-level overview of the Proposed Project and Connected Actions, the alternatives CPO and OCIDA considered, and the environmental effects on the resource areas analyzed in Chapters 3-5.
Micron proposes to construct a semiconductor manufacturing facility on an approximately 1,377-acre site consisting primarily of the current WPCP, in Onondaga County, New York. The area surrounding the WPCP is sparsely populated with relatively low-density residential development, mostly along Caughdenoy Road and Verplank Road west of the WPCP. I-81 is located a little more than one mile east of the WPCP. The WPCP is approximately seven miles north of the City of Syracuse. Although a majority of the Micron Campus would be contained within the Town of Clay, a small portion would be in the Town of Cicero.
The Micron Campus would include four DRAM production fabs, ancillary support facilities, driveways, parking, and ingress and egress roads with access from New York State (NYS) Route 31, U.S. Route 11, and Caughdenoy Road. Each fab would occupy approximately 1.2 million square feet (sq. ft.) of land and contain approximately 600,000 sq. ft. of semiconductor cleanroom manufacturing space. The fabs would be supported by central utility buildings, warehouse space, and product testing space.
The Proposed Project would involve the development of three additional properties with uses ancillary to the Micron Campus: an approximately 38-acre parcel on the west side of Caughdenoy Road in the Town of Clay for the Rail Spur Site; an approximately 31-acre parcel located at 9100 Caughdenoy Road in the Town of Brewerton for the Childcare Site; and leasing of 360,000-500,000 sq. ft. of existing warehouse space for the Warehouse Site in an industrially zoned area at a location to be determined within 20 miles of the Micron Campus.
Construction of the Connected Actions would include expansion of certain existing utility properties and the construction and operation of various utility improvements by National Grid, Onondaga County Water Authority (OCWA), Onondaga County Department of Water Environment Protection (OCDWEP), and others to support the electricity, natural gas, water supply, wastewater, and telecommunication needs of the Proposed Project. To supply the estimated electricity needs of the Micron Campus, National Grid proposes to expand the existing footprint of the Clay Substation (located to the northwest of the WPCP across the CSX Railroad line) toward the north and east by approximately 10 acres. To supply the estimated natural gas demands of the Micron Campus, National Grid proposes to construct an approximately 3.1-mile long, 16-inch diameter below-grade (underground) natural gas distribution line from its existing Gas Regulator Station (GRS) 147 at 4459 NYS Route 31 to the Micron Campus and to construct a new GRS 147A at the same address.
OCWA proposes to undertake two phases of water system capacity and transmission upgrades to supply water to the Micron Campus. Phase 1 would involve upgrading the Raw Water Pump Station (RWPS) and Lake Ontario Water Treatment Plant (LOWTP) in Oswego and the Terminal Campus in the Town of Clay and constructing new water transmission mains from these facilities to the Micron Campus. Phase 2 would involve additional upgrades and transmission lines based on future needs. None of OCWA’s proposed water infrastructure upgrades that are needed to meet Micron Campus water demands would require permanent land acquisition.
0-2 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT OCDWEP proposes to undertake two stages of wastewater infrastructure and capacity improvements to serve the Micron Campus. Stage 1 would involve interim “bridging” projects at the existing OCDWEP Oak Orchard Wastewater Treatment Plant (OOWWTP) to receive startup industrial wastewater flows and potentially initial manufacturing industrial flows from construction of Phase 1 of the Micron Campus (Fabs 1-2) while OCDWEP constructs a new Industrial Wastewater Treatment Plant (IWWTP) and reclaimed water facilities at its 76-acre Oak Orchard site. Stage 1 would also involve construction of a new conveyance between the Micron Campus and the Oak Orchard site to send pretreated industrial wastewater to the IWWTP and return reclaimed water to the Micron Campus. Stage 2 would expand and upgrade the IWWTP to serve additional campus industrial wastewater flows from Phase 2 of the Micron Campus build- out (Fabs 3-4) and provide additional reclaimed water back to the Micron Campus.
To supply telecommunication and broadband internet connectivity to the Micron Campus Micron would make use of two existing fiber optic lines along Caughdenoy Road and NYS Route 31 accessible via two fiber optic connection entry points within a mile of the WPCP, one at the intersection of Caughdenoy and Verplank Roads, and one at the intersection of Caughdenoy Road and NYS Route 31. The existing fiber optic lines currently serve a cell tower on the southern portion of the WPCP, just north of NYS Route 31.
0-3 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Proposed Project and Connected Actions Source: Light Gray Canvas (Esri, 2025a): Esri, TomTom, Garmin, FAO, NOAA, USGS, © OpenStreetMap contributors, and the GIS User Community.
0-4 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
NEPA and SEQRA require agencies to consider a reasonable range of alternatives to a proposed action. The range of alternatives CPO and OCIDA considered in this EIS are the Preferred Action Alternative (construction of the Proposed Project and Connected Actions), the No Action Alternative, a Reduced Scale Manufacturing Alternative, a U.S. Route 11 Access Elimination Alternative, and six Micron Campus Site Layout Alternatives. Following an extensive examination of each alternative based on a defined set of criteria, CPO and OCIDA determined that the Preferred Action Alternative is the only alternative that would meet CPO’s purpose and need under NEPA and Micron’s purpose and need under SEQRA.
No Action Alternative Under the No Action Alternative, the WPCP would remain in its current condition pending future development proposals. OCIDA acquired all parcels on the WPCP, the vast majority of which are presently vacant, for the specific purpose of creating an industrial park (as analyzed in the WPCP 2021 Supplemental Generic Environmental Impact Statement). The No Action Alternative would delay OCIDA’s long-standing objective to bring high-tech facilities and high paying jobs to Onondaga County at the WPCP until such time as OCIDA identifies another suitable development proposal for the property. The Rail Spur and Childcare Sites would remain vacant properties. The existing utility authorities would not undertake utility improvements, outside those already planned as part of the systems’ long term maintenance or need to obtain easements for the Connected Actions.
Reduced Scale Manufacturing Alternative CPO and OCIDA considered reduced scale manufacturing alternatives in coordination with Micron. As described in Chapters 1-2, reduced scale alternatives, including two- and three-fab configurations, would not be able to achieve the level of economically viable domestic memory chip output sufficient to meet CPO and Micron’s purpose and need. A reduced scale manufacturing alternative would incur significantly higher costs per unit of DRAM produced than a full-scale four-fab campus and would not meet Micron or CPO’s economic sustainability needs. Without a single campus capable of achieving 52,000 chip wafers of output per week, Micron would not be able to facilitate co-location and efficient operation of semiconductor manufacturing supply chain expertise and supplier delivery operations in the vicinity, which would impede the Proposed Project’s operational efficiency by making it more difficult to obtain critical materials and keep production high and costs low through collaborative engineering. Further, a reduced scale alternatives would require constructing and operating additional fabs at other locations, above and beyond what is already being contemplated, which would have additional environmental effects. Based on the above factors, reduced scale manufacturing alternatives would not be economically viable or meet CPO and Micron’s purpose and need and were not carried forward for further evaluation.
U.S. Route 11 Access Elimination Alternative In coordination with Micron, CPO and OCIDA considered a potential site layout alternative for the proposed Micron Campus that would eliminate driveway access to the campus from U.S. Route 11. Eliminating the driveway would avoid the disturbance of 2.3 acres of federal 0-5 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT jurisdictional wetlands, including 0.71 acres of State jurisdictional wetlands accounted for within the 2.3 acres of federal jurisdictional wetlands. The site access driveway from U.S. Route 11, however, would be a vital access point to the Micron Campus and would ensure sufficiently streamlined construction traffic movement to avoid interference with local traffic patterns, particularly during construction of Fabs 2 through 4. Further, the driveway would distribute site access more effectively across the area roadway network and would mitigate post-construction traffic effects from campus operations. Therefore, CPO and OCIDA did not carry this site layout alternative forward for further analysis in the EIS.
Micron Campus Site Layout Alternatives In coordination with Micron, CPO and OCIDA considered a further series of potential site layout alternatives for the proposed Micron Campus to determine whether a different layout of the fabs and supporting buildings from the Preferred Action Alternative site layout would result in fewer effects to waterbodies and wetlands on the WPCP. Specifically, six site layout alternatives were considered in addition to the Preferred Action Alternative. However, CPO and OCIDA determined that none of the site layout alternatives besides the Preferred Action Alternative would be technically or economically feasible or practicable because each would create inefficiencies that would prevent the Micron Campus from achieving the semiconductor wafer output necessary to achieve commercial viability. In addition, CPO and OCIDA found that all of the site layout alternatives besides the Preferred Action Alternative would result in the permanent loss of an equivalent amount or additional acres of federal jurisdictional wetlands.
CPO and OCIDA considered the environmental resources that may be affected by the Proposed Project and Connected Actions. Best management practices (BMPs) were proposed to avoid and minimize potential effects where feasible. The EIS also identifies the mitigation measures that CPO, OCIDA, or other parties may require Micron to commit to or undertake to mitigate significant adverse effects.
The remainder of this section provides high-level summaries of the environmental analyses for each resource area discussed in the EIS.
Land Use, Zoning, and Public Policy Construction of the Proposed Project and Connected Actions would convert existing vacant land and residential land uses to industrial use over a 16-year timeframe. Although these activities would not result in significant adverse effects on land use, the Proposed Project, and the Micron Campus in particular, would nevertheless represent a significant direct change to existing land use. This change, however, would still be consistent with the I-2 zoning designation for the WPCP. Moreover, the Proposed Project would comply with zoning regulations and the terms and conditions of any necessary local approvals, would be consistent with relevant public policies, and would fulfill several public policy goals relating to economic development and industrial use of the WPCP. The growth inducing effects of the Preferred Action Alternative would result in significant changes to land use but would continue to be subject to local discretionary approvals and planning policies, including applicable measures to avoid or minimize adverse development effects. Therefore, the Preferred Action Alternative would not result in any significant adverse 0-6 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT effects with respect to zoning or public policies and would likely result in beneficial effects by fulfilling economic development policy goals.
Geography, Soils, and Topography Construction of the Proposed Project would include removal of substantial volumes of soil and bedrock, and extensive fill and grading of more than 1,000 acres across the Micron Campus, Rail Spur Site, and Childcare Site, plus activity across additional sites and utility routes to construct the Connected Actions, resulting in permanent changes to these resources. These construction activities would be conducted in accordance with Micron’s Soil and Materials Management Plan (SMMP) as well as State Pollutant Discharge Elimination System (SPDES) program requirements, including preparation of a Stormwater Pollution Prevention Plan (SWPPP). With these required BMPs and mitigation plans in place, significant adverse effects on existing geology, soils, and topography would be avoided.
Water Resources Construction of the Proposed Project and Connected Actions would result in significant adverse effects on wetlands and surface water through the anticipated permanent loss of approximately 200 acres of federal jurisdictional wetlands and 7,828 linear feet (LF) of jurisdictional surface water features, of which approximately 193 acres of federal jurisdictional wetlands and 6,283 LF of jurisdictional surface water features are associated with the Proposed Project. Construction of the Proposed Project and Connected Actions would not result in significant adverse effects from stormwater or significant adverse effects on groundwater, floodplains, or coastal resources. Post-construction operation of the Proposed Project and Connected Actions would not result in significant adverse effects on water resources. The Preferred Action Alternative could potentially result in significant growth inducing effects on wetlands and surface water in the five-county Central New York (CNY) Region (defined as Onondaga, Oswego, Madison, Cortland, and Cayuga Counties) (five-county region) over time, but these changes would be gradual and would be subject to applicable permitting processes for other activities.
Mitigation would be required under Section 404 of the Clean Water Act and Article 24 of the Environmental Conservation Law to address the anticipated permanent losses of federal and State jurisdictional wetlands and surface water features. Under a proposed mitigation plan, Micron would enhance, establish, or restore a total of 422.14 acres of wetlands and 14,030 LF of stream features across six mitigation sites located within a nine-mile distance to the northwest of the WPCP, an approximately 2:1 mitigation ratio. Overall, approximately 1,341 acres of land within the Oneida River watershed would be protected in perpetuity under the mitigation plan. Additionally, Micron would purchase nine in-lieu fee program credits.
Biological Resources Construction of the Proposed Project and Connected Actions would result in significant adverse effects on biological resources. This would include significant adverse effects on Federal and State listed threatened and endangered species, including the Indiana bat, northern long-eared bat, tricolored bat, northern harrier, and short-eared owl. Post-construction operation of the Proposed Project and Connected Actions would not result in significant adverse effects on 0-7 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT biological resources. The Preferred Action Alternative has low potential to result in significant growth inducing effects on biological resources in the five-county region over time. Micron would be required to implement several BMPs to avoid or minimize effects on biological resources, including wintertime tree clearing, tree marking, retention of onsite roosting and foraging habitat where feasible, noise and lighting reduction to reduce the potential for disturbance of bats in adjacent areas of habitat, water quality protection, and biological monitoring , among others. Mitigation would be required to reduce unavoidable significant adverse effects of the Proposed Project on Federal and State listed bat species and State listed grassland birds. Micron would purchase and permanently protect twice the amount of roosting habitat that would be lost due to Proposed Project and Connected Action construction and would fund research and monitoring efforts to benefit science-based bat species conservation and management programs in New York State.
Historic and Cultural Resources CPO is serving as the lead Federal agency for the Section 106 consultation process under the National Historic Preservation Act (NHPA) for the Proposed Project and Connected Actions. CPO, in consultation with the New York State Historic Preservation Office (NYSHPO), the Advisory Council on Historic Preservation (ACHP), and other consulting parties, including Indigenous Nations with an interest in potentially affected areas, has identified areas of potential effect (APE) for both historic architectural properties and archaeological resources. CPO has proposed a finding of no adverse effect with respect to one historic architectural property and is continuing to review information on other historic architectural properties in consultation with NYSHPO. CPO also is in the process of preparing a Programmatic Agreement (PA) for the Proposed Project and Connected Actions that will implement a phased identification process to defer the final identification and evaluation of archaeological resources. Micron has completed Phase 1A Archaeological Studies and is in the process of completing Phase 1B Archaeological Investigations, which may continue to be conducted during the federal and State agency reviews of the Proposed Project and Connected Actions. CPO determined that Indigenous Nation monitoring is warranted during archaeological testing and Micron is continuing to coordinate with Indigenous Nation monitors as part of the archaeological investigations. Because the Section 106 process is ongoing, Micron would not be authorized to begin construction of the Proposed Project until all consulting parties are afforded an opportunity to comment on whether historic properties (including historic architectural properties and archaeological resources) would be adversely affected and CPO reviews and approves the results of any further applicable historic architectural surveys or archaeological investigation work. Induced growth throughout the five-county region has the potential to affect historic architectural properties and archaeological resources. Although it cannot be predicted exactly when, or to what degree, induced growth would affect historic architectural properties, any future development requiring discretionary approvals would be required to comply with Section 106 of the NHPA or Section 14.09 of the New York State Historic Preservation Act (NYSHPA). 0-8 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Air Quality Construction activities associated with the Proposed Project components would result in temporary adverse effects on air quality. Based on applicable air quality regulatory and permitting requirements, stationary sources associated with the Proposed Project would not cause or contribute to an exceedance of any of the applicable National Ambient Air Quality Standards (NAAQS), short-term guideline concentrations (SGC), or annual guideline concentrations (AGC). The stationary and mobile source emissions from construction and long-term operation of the Proposed Project also would not have a significant adverse effect on air quality. The potential effects on air quality from induced growth under the Preferred Action Alternative would not cause a significant adverse effect within the five-county region.
To avoid and minimize effects on air quality during construction and operations, Micron would be required to implement BMPs to control the potential for fugitive dust emissions and off- site transport of dust, reduce emissions of air pollutants, control the potential for emissions of volatile chemicals, and minimize the ambient emissions of sulfur compounds. With these avoidance and minimization efforts and compliance with all applicable federal and State regulations as well as permit conditions mandated by NYSDEC, the Proposed Project would not result in significant adverse air quality effects.
Greenhouse Gas (GHG) Emissions, Climate Change, and Climate Resiliency Construction and operation of the Proposed Project and Connected Actions, including indirect, upstream, and downstream activities, land use changes, and induced growth, would result in significant increases in GHG emissions and potentially significant contributions to climate change. The greatest contributing factor to GHG emissions would be the operation of the four fabs at the Micron Campus. The Proposed Project would incorporate project design GHG reduction measures to control and reduce GHG emissions from the manufacturing process. Micron would be required to implement additional BMPs to further avoid and minimize GHG emissions and effects on climate change and climate resiliency during construction and operation. Although Micron has committed to controlling direct GHG emissions to the maximum extent practicable, the Preferred Action Alternative would result in significant adverse effects on climate change. Micron would commit to purchasing 100 percent carbon-free electricity utilizing power purchase agreements and renewable energy credits (RECs). NYSDEC is reviewing Micron’s Climate Leadership and Community Protection Act (CLCPA) analysis for consistency with New York State’s ability to meet its statewide GHG emission limits. NYSDEC may require additional or revised climate-related mitigation measures under the CLCPA.
The Preferred Action Alternative is not anticipated to present significant climate resiliency risks. The Proposed Project and Connected Actions also would be designed and engineered to withstand effects of the changing climate, in accordance with applicable laws and regulations, and New York State and public utility climate policies.
Solid Waste, Hazardous Waste, and Hazardous Materials The Preferred Action Alternative would result in the generation of substantial quantities of solid and hazardous waste and use of substantial quantities of hazardous materials, primarily associated with the construction and operation of the Micron Campus. Solid waste disposal 0-9 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT facilities in the five-county region are anticipated to be able to accommodate the solid waste flows from the Proposed Project with certain permit modifications and expansions. Micron’s reuse, recycle, and recovery (RRR) Program and other waste minimization procedures would also help reduce waste-to-landfill volumes from the Proposed Project.
The Micron Campus would manage hazardous waste in compliance with all applicable federal and State requirements and would contract with private haulers to collect and safely transport hazardous waste to off-site treatment, storage, and disposal facilities authorized to collect such waste, including relevant out-of-state facilities. Micron would further manage hazardous and universal materials through its RRR Program to the greatest extent practicable to reduce the volume of material that would need to be managed as hazardous waste.
Accordingly, the Preferred Action Alternative would not result in significant adverse effects relating to the generation of solid or hazardous waste or the management of hazardous materials. Micron would be required to implement several BMPs to address solid and hazardous waste generation and the use of hazardous materials over time and minimize the amount of waste that is generated and requires disposal. Therefore, significant adverse effects are not anticipated, and no mitigation measures are required.
Human Health and Safety The Preferred Action Alternative, and the construction and operation of the Micron Campus in particular, would pose potential human health and safety risks based on hazards to construction workers and hazards present in the semiconductor manufacturing process. However, Micron would develop and implement a comprehensive set of procedures to manage these risks in accordance with all applicable laws and regulations, and consistent with established environmental health and safety (EHS) programs Micron has implemented at its other facilities. Although potential incidents cannot be ruled out, given the comparatively low incident rate in the semiconductor industry and the risk management programming Micron would implement as part of the Proposed Project, the human health and safety risks to construction workers, employees, and the surrounding community are low. Therefore, the Preferred Action Alternative is not anticipated to result in significant adverse effects on human health or safety.
Micron would be required to implement BMPs to address the potential human health and safety effects of Proposed Project construction and operations, including requiring construction contractors to submit fatigue management plans in the event overtime work is required, maintain a crisis management plan with established mustering locations, maintain onsite Micron emergency response, and partner with local fire and EMS to provide documentation of hazardous materials stored on-site and coordinate emergency response readiness and preparedness. With implementation of these BMPs, the Preferred Action Alternative would not result in significant adverse effects on human health and safety.
Utilities and Supporting Infrastructure The Preferred Action Alternative would likely have significant effects on electricity and transmission demand in Load Zone C, due to a potentially earlier and greater exceedance of local generation capacity compared to the No Action Alternative. However, long-term grid and
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT transmission planning by the appropriate entities is expected to ensure adequate capacity to meet future electricity demands, regardless of where the generation occurs.
Micron anticipates that over the course of the long-term construction of the Micron Campus the agencies with jurisdiction over New York State’s energy generation and transmission resources will plan and implement measures to meet Micron’s forecasted energy demand and the demands of other users of energy in the State. However, neither Micron, nor the lead agencies issuing this EIS, have jurisdiction over regional or statewide planning for future electricity demand (including the future demands of the Proposed Project), or for determining the precise measures that will be undertaken in the future to ensure that those demands are met. The authority for ensuring that such demands are met are delegated to separate State and regional electricity planning entities with their own public administrative and adjudicatory processes. Though the effects of the Preferred Action Alternative are anticipated to be significant, they are not anticipated to be adverse due to the ongoing electricity planning processes.
Although natural gas demand under the Preferred Action Alternative would require system upgrades and expanded infrastructure, coordinated long-term planning between Micron and National Grid is expected to ensure sufficient delivery capacity, resulting in no significant adverse effects on natural gas supply or capacity.
The Proposed Project would have no significant adverse effect on water usage and capacity, as necessary system upgrades, permitting, and infrastructure development led by OCWA and local water authorities are expected to maintain adequate capacity. Wastewater treatment needs, including both sanitary and industrial wastewater, would be accommodated by existing and planned infrastructure, including construction of the IWWTP, avoiding any significant adverse effects on wastewater treatment capacity.
Finally, the Preferred Action Alternative would not result in any significant adverse effects on broadband internet connectivity or telecommunications infrastructure, as existing systems are expected to meet both current and future Proposed Project related and regional demand. Transportation and Traffic The Preferred Action Alternative would result in significant adverse effects on transportation and traffic in the surrounding areas during certain periods of construction and operation. Many of these effects, however, would be addressed through mitigation measures developed with input from agencies with jurisdiction to implement such measures. The years 2027, 2031, and 2041, along with their multimodal effects, were analyzed, as well as recommended mitigation scenarios.
Significant traffic effects are anticipated at intersections and freeway segments in forecast year 2027. No significant transportation improvements are anticipated to be able to be built by 2027 in response to the Proposed Project. The significant effects from traffic would increase as the Preferred Action Alternative construction advances, such that a greater number of intersections and freeway segments would be significantly affected in 2031 and 2041. In the 2041 forecast year, ten segments and 27 intersections would be significantly affected by the Preferred Action Alternative.
If implemented, the recommended mitigation measures listed below would be anticipated
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT to sufficiently mitigate these effects on transportation and traffic for the forecast years 2031 and 2041 below significance levels, except for five intersections for forecast year 2041. Significant effects at these locations were determined to be unmitigable due to the number of improvements already presented by the mitigation measures and the infeasible geometric modifications that would be necessary to mitigate effects below significance levels.
• NYS Route 31 – Widening from one lane to two lanes in each direction between U.S. Route 11 and Morgan Road.
• NYS Route 31/I-81 Interchange – Re-configuring the existing interchange to a Diverging Diamond Interchange (DDI) with three lanes in each direction on NYS Route 31. • Sneller Road/I-81 Interchange – Constructing a new interchange connecting I-81 with Sneller Road and U.S. Route 11.
• U.S. Route 11 – Widening from one lane to two lanes in each direction between NYS Route 31 and Sneller Road.
• New Access Road – Constructing a new four-lane access road (New Access Road) between NYS Route 481 and Caughdenoy Road, north of NYS Route 31, paralleling the CSX railroad.
• New Access Road/NYS Route 481 Interchange – Constructing a new interchange between the New Access Road and NYS Route 481, located just east of the CSX railroad mainline, with a new roundabout at the New Access Road and Maple Road intersection.
• Caughdenoy Road/NYS Route 481 Ramp – Constructing a new access ramp providing additional southbound to westbound movement from Caughdenoy Road to NYS Route 481 with a new roundabout at the intersection of Caughdenoy Road and Maple Road. Ultimately, the recommended traffic mitigation measures are within the jurisdiction of federal, State, and local transportation agencies and would be subject to detailed design and approval, including applicable environmental review, by New York State Department of Transportation (NYSDOT) and Federal Highway Administration (FHWA).
Noise and Vibration Noise from construction and operation of the Micron Campus, Rail Spur Site, and Childcare Site would exceed one or both of the thresholds for significant adverse effects at 51 of the 138 individual sensitive receptors in the noise and vibration study areas closest to the Proposed Project, including an apartment complex and nursing home east of the proposed Micron Campus, five residences north and south of the Rail Spur Site west of Caughdenoy Road, and three residences across the street from the Childcare Site.
To avoid and minimize predicted noise effects, Micron would be required to implement BMPs as part of the Proposed Project, including the use of vibratory drilling as opposed to pile driving, installation of ground level noise barriers and rooftop shielding elements, berms, sound attenuators or low noise packages on equipment, and strategic equipment locations. Even with the proposed BMPs, significant noise effects would exist such that additional noise mitigation
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT measures would be required. Micron has proposed noise mitigation measures to sufficiently reduce these effects to below significance thresholds. Noise barriers would be constructed within the Micron Campus property boundaries to abate significant adverse construction and operation noise, and enclosures would be installed around rooftop equipment on the Micron Campus to abate significant adverse operational noise. Micron also would construct permanent noise barriers on the Rail Spur Site to abate noise from rail spur operations. As needed, additional refinement to these mitigations will be implemented based on noise monitoring to ensure efficacy. Micron would offer to construct temporary noise barriers within its property boundaries for affected property owners and would consult owners about aesthetic considerations, such as landscaping, and for ideas about other potentially effective mitigation measures.
Significant traffic noise effects would be anticipated to occur primarily from traffic on the main roadway corridors to the Micron Campus, including NYS Route 31, Caughdenoy Road, NYS Route 481, and U.S. Route 11. Although noise barriers were considered as a potential noise mitigation measure, in most cases, the construction of noise barriers to mitigate elevated traffic noise is not feasible because property and driveway access to the roadways must be maintained. These effects would be concentrated in areas directly to the west, south, and east of the Micron Campus and along the main roadway corridors to the Micron Campus, including NYS Route 31, Caughdenoy Road, NYS Route 481, and U.S. Route 11. Nearly all these receivers are located adjacent to and access their properties from these roads. These significant adverse noise impacts are expected to further increase if the recommended traffic improvements are implemented. Visual Effects and Community Character The Preferred Action Alternative, and construction and operation of the Micron Campus and Rail Spur Site in particular, would be highly visible from certain surrounding areas and would produce noticeable visual effects from multiple viewpoints. Visual effects would be most apparent from viewpoints closest to the Micron Campus, but would become less apparent or would not occur beyond approximately a half-mile distance from the site. Overall, these visual effects would be significant from the standpoint of viewers at closer distances. Separately, there would be no significant aesthetic impacts on any designated aesthetic resources in range of the Proposed Project or Connected Actions. Lastly, the Preferred Action Alternative would result in changes to community character based on the combination of the visual effects, such as increased traffic and noise, and the effects of induced growth (reflecting an overall change from a low-density, rural, and undeveloped area to a site with a large industrial manufacturing facility). However, these changes would be consistent with community character as expressed in local land use regulations, policies, and plans.
Changes in visibility of the Micron Campus would be minimized through required BMPs including significant setbacks, landscaping, and the use of downward directional, shielded, warm white LED lights. All proposed lighting would be designed and installed in accordance with applicable local regulations.
Community Facilities, Open Space, and Recreation Construction and operation of the Proposed Project would not result in any significant adverse effects on police services, fire services, EMS, healthcare facilities, or schools, nor would construction and operation of the Proposed Project and Connected Actions have any significant
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT adverse effects on open space or recreational resources. The Preferred Action Alternative would not result in significant adverse growth inducing effects on police services, EMS, healthcare facilities, schools, or open space or recreational resources, but would potentially have significant adverse effects on volunteer fire services in the five-county region.
Micron would engage closely and collaboratively with local fire departments, including Clay Fire and Cicero Fire, to familiarize local fire service personnel with any potential Proposed Project construction hazards such as construction site fuel and chemical storage, jointly prepare to implement BMPs for construction fire safety, and ensure compliance with applicable fire protection code requirements. To ensure continuous front-line coverage during construction of the Proposed Project, Micron would continuously employ construction site safety and EHS personnel to respond to and contain a range of construction incidents and would continuously employ its Emergency Response Team (ERT) to address medical incidents. In addition, as part of the construction of the Proposed Project, Micron would establish a dedicated on-site construction occupational health clinic (separate from the proposed Childcare Site healthcare center) staffed with an occupational medical physician, physician’s assistant, registered nurse, licensed nurse practitioner, physical therapist, and other support staff. The ERT would transport injured construction workers or personnel to the construction clinic for medical care, as appropriate. To address the potential significant adverse effect on volunteer fire services due to the induced growth associated with the Proposed Project, including on Clay Fire and the Town of Clay’s fire response capacity, Micron would commit to pay for and support ongoing Micron- related training efforts with Clay Fire and other local fire departments as a mitigation measure. Similarly, Micron would work with Clay Fire to determine any future need for the development of a full-time professional fire service. The determination of future needs planning could be completed through a feasibility study or similar alternative method.
Construction and operation of the proposed Micron Campus and the National Grid Clay Substation Connected Action expansion would require permanent closure of a portion of the Snow Owls Snowmobile Trail that runs through the two properties.
Socioeconomic Conditions The socioeconomic effects of the Preferred Action Alternative would be significant and beneficial. The Proposed Project would generate substantial new economic activity in the local and regional study areas. It is projected that operations of a 4-fab facility would (i) generate over $10 billion in real GDP impacts within the regional study area, (ii) generate additional tax revenues for the local and regional study areas, (iii) invest $500 million in local and regional initiatives that advance identified community needs, (iv) generate over 4,000 on-site construction jobs over the approximately 16-year construction period, and (v) generate over 9,000 permanent on-site operational jobs.
In addition to on-site benefits, the Proposed Project’s construction and operational activities would generate off-site economic activity and additional jobs and labor income within industries supporting Micron’s construction, and within governments and businesses supporting workers’ day-to-day spending. It is anticipated that the Proposed Project would generate over $2 billion in induced disposable personal income in the five-county region by 2035 and over $3.3 billion by 2041. By 2045 the Proposed Project would generate demand for nearly 9,500 jobs at
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT regional supply chain businesses and approximately 23,500 jobs at regional governments, institutions, and businesses supporting the growth in regional household spending (approximately 33,000 off-site jobs in total by 2045). This would increase jobs in numerous industry sectors and increase income opportunities for the regional workforce, a significant benefit of the Proposed Project.
The Preferred Action Alternative’s induced housing demand may lead to short-term rent increases and the potential to indirectly displace residents who cannot afford rent increases. Within the local study area, this has the potential to result in a short-term significant adverse socioeconomic effect. Notwithstanding, this short-term potential significant adverse effect will be addressed through the provision of additional affordable housing supply facilitated by investments from the State of New York through Governor Hochul’s long-term statewide housing approach and New York Housing Compact initiatives; and local initiatives like the Onondaga County Housing Initiative Program (O-CHIP) and the OCIDA’s tax exemption program for housing projects. Micron will continue to work with agencies and local stakeholders to identify specific actionable measures to avoid or minimize the potential for this short-term significant adverse effect on the local housing market.
Environmental Justice The potential for adverse effects from construction and operation of the Preferred Action Alternative on low-income and minority communities, as well as disadvantaged communities (DACs), are expected to be limited to within an approximately 5-mile radius around the Proposed Project sites, and a ½ mile of the Connected Actions. When analyzing the associated DAC burdens at or above the 80th percentile, the Preferred Action Alternative would not cause or increase a disproportionate burden from construction or operation of the Proposed Project or Connected Actions. Similarly, in the low-income and minority communities identified within the study area, the Preferred Action Alternative would not cause or increase a disproportionate burden within those communities, except a potential temporary adverse effect on housing and rent pricing. Instead, the Preferred Action Alternative would produce beneficial effects for the local and regional communities, including identified DACs, by generating thousands of new jobs both on- and off-site through business-to-business supply chain services, stimulating local and regional development through induced residential and worker spending, generating additional tax revenues and, over the 20-year term of the Green CHIPS Community Investment Fund (CIF), by investing $500 million in local and regional initiatives that advance identified community needs. The Preferred Action Alterative includes numerous project design elements and BMPs that avoid or minimize potential adverse environmental effects. For certain resource areas, mitigation measures have been proposed to further reduce potential significant adverse environmental effects (e.g., noise, transportation). With these avoidance, minimization and mitigation measures, the Preferred Action Alternative would not cause or increase a disproportionate pollution burden on low-income and minority communities or DACs.
SEQRA requires consideration of cumulative effects. Cumulative effects occur when multiple actions affect the same resource(s) or when the incremental effects of a proposed action add to the effects caused by other past, present, and reasonably foreseeable future actions unrelated
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT to the proposed action. Cumulative effects are most likely to arise when a proposed action and other actions are expected to occur in a similar location over a similar time.
Under the Preferred Action Alternative, although most of the environmental effects of the Proposed Project and Connected Actions would generally occur within the vicinity of the Micron Campus, Rail Spur Site, and Childcare Site or within or adjacent to the Connected Actions, the effects of other present or reasonably foreseeable future actions in the local or regional area, when added to the effects of the Proposed Project and Connected Actions, may potentially result in cumulative environmental effects.
Across all the environmental resources analyzed in this EIS, none of the ongoing or future projects with effects that are cumulative with the Preferred Action Alternative would meaningfully alter or amplify the effects of the Preferred Action Alternative, because the Proposed Project and Connected Actions are the most significant drivers of the environmental effects identified in this EIS. None of the other ongoing or future projects, either individually or cumulatively, would transform an otherwise insignificant effect of the Preferred Action Alternative into a significant effect. Nor would any of the other projects, individually or cumulatively, meaningfully exacerbate any significant effect of the Preferred Action Alternative. Accordingly, there are no significant adverse cumulative effects.
The Preferred Action Alternative would have several significant environmental effects that could reasonably be reduced below the level of significance through implementation of identified mitigation measures. Nevertheless, implementation of the Preferred Action Alternative would result in some unavoidable significant effects that cannot reasonably be avoided or mitigated below the level of significance.
Water Resources The Preferred Action Alternative will necessitate the permanent loss of approximately 193.38 acres of federal jurisdictional wetlands (approximately 174.77 acres of which are State jurisdictional wetlands), and approximately 10.5 acres of non-jurisdictional wetlands at the Micron Campus, Rail Spur Site, and Childcare Site, along with the ecosystem services those wetlands currently provide. Micron, the USACE, and NYSDEC are currently developing a mitigation plan required as a part of the CWA Sec. 404 permitting process, which will include compensatory mitigation requirements to offset the loss of wetlands from implementation of the Proposed Project by creating and preserving wetlands (at a ratio of two acres or greater of created wetlands to each acre that is lost) within the watershed of the Proposed Project. Despite these significant mitigation measures, the loss of wetlands at the Micron Campus and Rail Spur Site is deemed an unavoidable significant adverse impact.
The Preferred Action Alternative would also have significant effects on localized surface water and stream resources despite the implementation of mitigation measures. As a result of the construction of the Proposed Project, most of the existing stream channels currently located in what would become the Micron Campus Site and Rail Spur Site would be lost. Loss of these surface water and stream resources is considered an unavoidable significant effect of the Preferred Action Alternative.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Biological Resources Construction of the Proposed Project and Connected Actions would result in significant adverse effects on biological resources. This would include significant adverse effects on federal and State listed threatened and endangered species, or species proposed for listing, including the Indiana bat, northern long-eared bat, tricolored bat, northern harrier, and short-eared owl. While mitigation has been proposed to address the effects of the Proposed Project through the preservation of critical habitat located off the Micron Campus, the loss of ecological communities, in particular, and the habitat they provide to these species of special concern, is considered to be an unavoidable significant adverse impact of the Preferred Action Alternative.
Climate Change The GHG emissions that would result from construction and operation of the Proposed Project are expected to be unavoidably significant. Even with significant avoidance and minimization efforts as well as mitigation, GHG emissions associated with operation of the Micron fabs and related facilities will represent a significant increase in overall GHG emissions in the five- county region and New York State. Most of these emissions would be the result of natural gas combustion, energy consumption, and process emissions needed for the DRAM manufacturing process. Natural gas combustion, and the resulting GHG emissions, are considered an unavoidable necessity for implementation of the Preferred Action Alternative.
Transportation The traffic effects of the Preferred Action Alternative are anticipated to be significant during construction of the Proposed Project, which is anticipated to be complete and operational in 2041-2042. NYSDOT anticipates having all necessary roadway improvements in place by 2031 to mitigate traffic effects in the County and region. Significant adverse impacts occurring before that time are considered temporary unmitigated impacts.
The transportation effects of the Proposed Project would be substantially mitigated if the relevant traffic authorities implemented recommended Traffic Mitigation Scenario C, which would implement a broad array of traffic improvements specifically designed to reduce the severity of the Proposed Project’s traffic effects, including interchanges, ramps, roadways, and operational equipment upgrades. Implementation of these mitigation measures likely would reduce the traffic effects of the Proposed Project below the level of significance in all but five intersections by 2041, regardless of whether proposed Traffic Mitigation Scenario C is implemented. Those intersections are: (1) NYS Route 31 and I-81 SB Ramp; (2) NYS Route 31 and NYS Route 481 SB; (3) US Route 11 and NYS Route 31; (4) NYS Route 31 and Lakeshore Spur; (5) South Bay Road and NYS Route 31. These significant adverse traffic impacts are considered unavoidable because mitigation below the level of significance would require infeasible roadway reconfiguration. Because it is uncertain whether, or under what circumstances, the recommended Traffic Mitigation Scenario C would be implemented (these measures or similar measures can only be implemented by relevant transportation agencies through separate legal, regulatory, and public processes that are independent from the Lead Agencies and actions considered in this EIS), the Preferred Action Alternative’s transportation effects are presented here as potentially unavoidably significant.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Noise Although noise from construction and operations of the Preferred Action Alternative would be mitigated below significance thresholds primarily through installation of ground-level noise barriers and rooftop enclosures around equipment, the noise effects due to traffic increases associated with the Proposed Project are anticipated to be significant and adverse. Although mitigation will be implemented to the maximum extent practicable, noise associated with traffic cannot be fully mitigated. These unmitigated significant noise impacts are expected to further increase if the recommended traffic measures are implemented.
The irreversible and irretrievable commitment of environmental resources to the Preferred Action Alternative consists primarily of resources committed to the physical construction of the Proposed Project, related utility facilities, nonrenewable natural gas resources and other resources consumed by project operations.
The Micron Campus would irretrievably devote approximately 1,000 acres of the 1,377 WPCP and related parcels to approximately five million sq. ft. of factory space, associated indoor facilities, and otherwise generally impermeable surface uses. These developable lands would no longer be available for other developments. Wetlands, stream systems, and vegetated areas within the construction area would be irretrievably lost or subsumed in this developed space. Due to the loss of wetlands on site, mitigation areas would be established elsewhere as mandated by the USACE Section 404 and NYSDEC Article 24 permits required to construct the Micron Campus. These mitigation sites would be dedicated to the establishment of additional wetlands. Construction would involve the permanent removal of soil and replacement with approximately nine million cubic yards of fill. Millions of tons of steel and other construction materials would be irreversibly committed to construction of the Proposed Project in these areas and unavailable for other uses.
Operations would necessitate the use of billions of standard cubic feet of natural gas per year, and, depending on the energy mix used to supply the New York Independent System Operator (NYISO) grid over the life of the Proposed Project, any portion of electric supply derived from nonrenewable sources would also represent an irretrievable commitment of nonrenewable energy resources to the Preferred Action Alternative. Though the Proposed Project would utilize and return water to Lake Ontario, which is one of the largest renewable freshwater sources in North America, municipal water supply and wastewater resources would be irretrievably committed to supplying the Proposed Project with fresh water and wastewater delivery, treatment, and disposal. A substantial portion of the water supply, and wastewater infrastructure needed by the Proposed Project will be constructed specifically to meet the demands of the Proposed Project. The resources required to construct these water and wastewater facilities would represent an irretrievable commitment of environmental resources to the Preferred Action Alternative, as would construction of any utility facilities intended for exclusive use by the Proposed Project. These include construction materials associated with OCDWEP’s construction of a new IWWTP for the Proposed Project at the OCDWEP’s Oak Orchard site, expansion of the National Grid Clay
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Substation and related power line installation to supply the Proposed Project, and gas line and water line infrastructure needed to supply the Proposed Project.
Raw material inputs needed to manufacture the finished DRAM chips also would represent an irretrievable commitment of resources to the Preferred Action Alternative, as would the resources, facilities, and landfill space required to treat and dispose of the solid waste streams associated with the Proposed Project. Construction of the Rail Spur Site and Childcare Site similarly would necessitate the irretrievable loss of vegetation, soils, and jurisdictional/non- jurisdictional wetlands, and would occupy developable land that would no longer be available for alternative development. Construction would require the irretrievable commitment of building resources to facilities, roads, loading areas, and impermeable or semi-permeable surfaces that will be unavailable for alternative uses.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
On August 18, 2023, Micron New York Semiconductor Manufacturing LLC (Micron), a wholly owned subsidiary of Micron Technology, Inc. (Micron Technology), filed an application with the Creating Helpful Incentives to Produce Semiconductors (CHIPS) Program Office (CPO) for direct funding under the CHIPS Incentives Program’s February 28, 2023, Notice of Funding Opportunity (NOFO) for the construction of commercial semiconductor fabrication facilities in Clay New York (CPO, 2023a). On December 5, 2024, the U.S. Department of Commerce (Department of Commerce) approved Micron’s application for an award under the NOFO. The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security and is authorized by Title XCIX, CHIPS for America, of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (Pub. L. 116-283), as amended by the CHIPS Act of 2022 (Division A of Pub. L. 117-167) (together referred to as the CHIPS Act). CPO is responsible for implementing the CHIPS Act by providing incentives for investment in semiconductor facilities and equipment in the United States (U.S.).
On June 14, 2023, Micron submitted an application to the Onondaga County Industrial Development Agency (OCIDA) requesting certain financial assistance within the meaning of New York General Municipal Law § 854(14). Micron’s application, as amended and restated, includes the lease and eventual purchase of the White Pine Commerce Park (WPCP) in Clay, New York and the undertaking of potential property condemnation pursuant to the New York Eminent Domain Procedure Law (EDPL).
OCIDA is authorized and empowered by the provisions of Chapter 1030 of the 1969 Laws of New York, constituting Title 1 of Article 18-A of the General Municipal Law, Chapter 24 of the Consolidated Laws of New York, as amended, Chapter 435 of the Laws of 1970 of the State of New York and Chapter 676 of the Laws of 1975 of the State of New York, as amended, constituting Section 895 of said General Municipal Law to promote, develop, encourage, and assist in the acquiring, constructing, reconstructing, improving, maintaining, equipping, and furnishing of manufacturing, warehousing, research, commercial, and industrial facilities, among others, for the purpose of promoting, attracting, and developing economically sound commerce and industry to advance the job opportunities, health, general prosperity, and economic welfare of the people of the State of New York, to improve their prosperity and standard of living, and to prevent unemployment and economic deterioration. Under this authority, OCIDA acquired and created the WPCP, located at 5171 Route 31, in the Town of Clay, NY 13041, and expanded it to attract large- scale, high-value, and high-tech manufacturing industries that will provide high-paying, sustainable jobs to Onondaga County.
The State of New York is committed to creating 21st century jobs and becoming a global capital for semiconductor manufacturing. New York’s Green CHIPS Program provides a State- level companion incentive program to the Federal CHIPS Incentives Program by offering up to $10 billion in economic incentives to locate new, cutting-edge semiconductor manufacturing and supply chain projects within the state. In addition, New York’s Green CHIPS Excelsior Jobs Tax Credit Program provides certain semiconductor manufacturer tax incentives that are intended to 1-1 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT help attract thousands of jobs and billions of dollars to establish New York as a leader in domestic re-shoring of semiconductor manufacturing. To receive benefits from this tax credit program, a project must be within the semiconductor manufacturing industry, invest at least $3 billion in the State over a 10-year period, create 500 new jobs per project, make commitments to worker and community investments, and include sustainability measures to mitigate the project’s greenhouse gas emissions over its lifetime.
Micron’s proposed activities under Micron’s funding applications to CPO and OCIDA, described below, are collectively referred to in this EIS as the “Proposed Project.” Because CPO and OCIDA determined, during their examination of Micron’s respective applications, and in the case of OCIDA, Part 1 of Micron’s Environmental Assessment Form, that the proposed activities in the applications have the potential to result in at least one significant adverse effect on the environment, CPO and OCIDA prepared this EIS to evaluate the potential environmental effects 3 of the Proposed Project pursuant to the requirements of the National Environmental Policy Act of 1969 (NEPA), 42 U.S.C. § 4321 et seq., and the State Environmental Quality Review Act (SEQRA), as codified at N.Y. Envtl. Conserv. Law § 8-0101 et seq. and its implementing regulations at 6 N.Y.C.R.R. Part 617.
The Proposed Project would involve the construction and operation of a semiconductor manufacturing facility with four semiconductor fabrication buildings (“fabs”) at the WPCP
location. The Proposed Project would primarily consist of: (1) construction of the Micron Campus, including the four fabs, ancillary support facilities, ingress and egress roads, driveways, and parking, within a site totaling approximately 1,377 acres; (2) construction of a rail spur and construction material conveyance facility on approximately 38 acres west of 8625 Caughdenoy Road in Clay, NY 13041, to support construction of the Micron Campus (the “Rail Spur Site”); (3) construction of a childcare center, healthcare center, and recreational center on an approximately 31-acre parcel located at 9100 Caughdenoy Road, Brewerton, NY 13029, to support the estimated 9,300 employees who would ultimately work at the completed Micron Campus (the “Childcare Site”); and (4) leasing of 360,000-500,000 sq. ft. of existing warehouse space in an industrially zoned area at a location to be determined within 20 miles of the Micron Campus (the “Warehouse Site”). In addition, implementing the Proposed Project would require several utility and infrastructure improvements to meet its electricity, natural gas, water supply, wastewater, and telecommunications needs (the “Connected Actions”).
Chapter 2 of this EIS provides a comprehensive overview of the various components of the Proposed Project and Connected Actions, and discusses CPO’s and OCIDA’s consideration of alternatives. Chapter 3 of the EIS describes the affected environment and analyzes the environmental effects of the Proposed Project and Connected Actions, as well as a No Action Alternative. Chapter 4 analyzes the cumulative environmental effects of the Proposed Project and Connected Actions and the No Action Alternative.
Figure 1.0-1 below shows the Proposed Project’s location in Central New York. 3 For purposes of this EIS, the terms “impacts” and “effects” are synonymous.
1-2 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Figure 1.0-1 Proposed Project Location Map Source: Light Gray Canvas (Esri, 2025a): Esri, TomTom, Garmin, FAO, NOAA, USGS, © OpenStreetMap contributors, and the GIS User Community.
1-3 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Construction of the Proposed Project would take place over approximately 16 years. Subject to the receipt of CPO and OCIDA authorizations and all other applicable permits, authorizations, and approvals, Micron would mobilize for initial site preparation for the Proposed Project beginning in the fourth quarter of 2025, with the first two fabs (Fabs 1 and 2) estimated to be operational by 2029 and 2030, respectively, and the remaining fabs (Fabs 3 and 4) estimated to be operational by 2035 and 2041, respectively. The manufacturing facility as a whole would ramp up to full production output by 2045. The Proposed Project would be supported by more than $100 billion of private investment over the course of the next two decades, with a first phase of investment of $20 billion planned by the end of this decade (Micron Technology, 2022).
Central New York and other regions of New York State have experienced a reduction in manufacturing jobs over several decades. In response, starting in the early 1990s, OCIDA and the City of Syracuse started to study potential sites for locating industrial businesses in Onondaga County to increase manufacturing employment. The WPCP was ultimately selected due to its proximity to water and energy infrastructure and highway access, and its zoning classification. OCIDA’s intent in forming the WPCP was buttressed in 1998 with the inception of the New York high-tech Semiconductor Manufacturing Initiative (SEMI-NY) program, a comprehensive effort to encourage semiconductor manufacturing in the State. Thereafter, following decades of unsuccessful efforts to develop the WPCP, OCIDA increased the size of the WPCP to make it more attractive to a broader scope of industries, particularly the semiconductor industry, and bring high-tech and high-paying jobs to Onondaga County.
OCIDA previously conducted multiple studies of the WPCP. In 2021, OCIDA prepared, as lead agency under SEQRA, a Final Supplemental Generic Environmental Impact Statement (SGEIS) that evaluated the contemplated expansion and development of the WPCP for semiconductor manufacturing. As OCIDA determined in its Findings Statement for the SGEIS, high-tech advanced manufacturing holds the promise of transforming the Onondaga County economy through new high-paying jobs, significant financial investment, and increased economic activity, including: (1) the creation of thousands of construction jobs and up to approximately 50,000 permanent jobs; (2) a robust supply chain of companies that will service a high-tech advanced manufacturing organization; (3) a reduction in poverty; and (4) secondary benefits such as increased local small business activity, growth in community civic and cultural organizations, and increased county and municipal investment.
As noted above, OCIDA is authorized to develop commerce and industry and advance job opportunities in the State of New York. To accomplish its stated purposes, OCIDA is authorized to grant financial assistance in connection with the acquisition, construction, and equipping of one or more projects. Accordingly, OCIDA is considering financial assistance for the Proposed Project, the use of eminent domain, and the lease and subsequent sale of the WPCP to Micron to construct and operate the Proposed Project.
Also as noted above, New York State has committed to attract new semiconductor manufacturing and related material supplier projects to the State through measures such as the New York Green CHIPS Program and the Green CHIPS Excelsior Jobs Tax Credit Program. New York State is considering providing financial support and tax incentives to Micron under the Green CHIPS Act and the Green CHIPS Excelsior Jobs Tax Credit Program to support construction and 1-4 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT operation of the Proposed Project within New York State.
This EIS will support decision-making among the Federal, State, and local agencies responsible for evaluating the Proposed Project pursuant to their respective legal and regulatory authorities. In accordance with NEPA, this section states the purpose and need for CPO’s proposed action relating to the Proposed Project. In accordance with SEQRA, this section also states Micron’s purpose and need for the construction and operation of the Proposed Project.
On December 10, 2024, the Department of Commerce announced final direct funding awards of up to $6.165 billion under the CHIPS Incentives Program to support Micron Technology’s plans to construct two semiconductor manufacturing facilities in New York and one semiconductor manufacturing facility in Idaho (Department of Commerce, 2024). On June 12, 2025, the Department of Commerce announced a final direct funding award of up to $275 million under the CHIPS Incentives Program to support Micron Technology’s plans to expand and modernize a semiconductor manufacturing facility in Virginia and an amendment to the original agreement to include one additional semiconductor manufacturing facility in Idaho. The disbursement of Federal financial assistance under the terms of the CHIPS Incentives Program final award to Micron for Micron’s Proposed Project in Clay, New York (referred to in this Final EIS as CPO’s “Proposed Action”) is subject to Micron’s completion of certain Proposed Project milestones, including the requirement for Micron to obtain certain applicable permits, authorizations, and approvals for the Proposed Project. The disbursement of Federal financial assistance for the Proposed Project is subject to CPO’s completion of a Final EIS and issuance of a Record of Decision (ROD) under NEPA.
The purpose and need for CPO’s Proposed Action are to fulfill the Department of Commerce’s statutory responsibilities under the CHIPS Act, including the requirement to provide Federal financial assistance to covered entities 4 to incentivize investment in facilities and equipment in the U.S. for the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment. 5 In awarding CHIPS direct funding, the Department of Commerce must give priority to ensuring that a covered entity receiving such funding will: (1) manufacture semiconductors necessary to address gaps and vulnerabilities in the domestic supply chain across a diverse range of technology and process nodes; and (2) provide a secure supply of semiconductors necessary for the national security, manufacturing, critical infrastructure, and 4 The term “covered entity” means a nonprofit entity, a private entity, a consortium of private entities, or a consortium of nonprofit, public, and private entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment. 15 U.S.C. § 4651(2).
5 15 U.S.C. § 4652(a)(1).
1-5 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT technology leadership of the U.S. and other essential elements of the economy of the U.S. 6 Pursuant to these statutory responsibilities, the Department of Commerce considers applications under the CHIPS Incentives Program NOFO for commercial semiconductor facilities consistent with several program priorities, including economic security, national security, and commercial viability (CPO, 2023a, pp. 13-17). This category includes leading-edge facilities that manufacture logic or memory chips 7 that utilize the most advanced front-end fabrication processes and achieve the highest transistor and power performance. For memory chip production, this includes facilities capable of producing three-dimensional “not-and” (3D NAND) flash memory technology (also known as vertical NAND or V-NAND) that stacks memory cells vertically in multiple layers, which enables production of faster, more efficient, and more energy-saving memory and dynamic random-access memory (DRAM) chips (CPO, 2023a).
Memory chips using DRAM technology have crucial applications in military equipment, cybersecurity technology, the aerospace industry, artificial intelligence (AI), and other cutting- edge uses, as well as more common areas of the domestic consumer economy. 8 However, the global structure of the semiconductor supply chain is vulnerable to critical points of failure that create the risk of geopolitical tensions and large-scale supply interruptions, which could impair access to suppliers or customers. For example, South Korea currently has a 44 percent share of the global memory chip market. Therefore, expanding or “onshoring” domestic advanced semiconductor manufacturing capacity in key areas such as memory is critical to enhancing the resilience of the U.S. semiconductor supply chain to potential global disruptions (Varas et al., 2021). This need is particularly critical given that current DRAM production in the U.S. represents less than one percent of global DRAM production (Tech Insights, 2024). Accordingly, incentivizing expanded domestic DRAM production to a level sufficient to offset potential disruptions to U.S. economic and national security is a key Department of Commerce responsibility under the CHIPS Act.
Incentivizing sufficient domestic DRAM production for U.S. economic and national security purposes means that a domestic manufacturing facility must achieve similar scale to global competitors, which can only be accomplished by grouping multiple fabs into a close geographical
location to ensure efficient infrastructure costs and an efficient upstream supply chain. The global DRAM market is highly competitive, with producers competing to supply primarily standardized DRAM products under high initial fixed production cost constraints. DRAM production viability therefore depends on production at a scale large enough to achieve globally competitive marginal 6 Id. § 4652(a)(2)(D).
7 Semiconductors are the foundational material used in the manufacturing of chips, such as logic or memory chips, which are then integrated into electronic devices.
8 Micron Technology anticipates that DRAM produced by the Proposed Project would have uses in high bandwidth memory applications supporting AI technology, automotive safety systems such as computerized self-driving safety systems and braking, industrial platforms such as telecommunications, enterprise servers, and drones, and a wide array of consumer products, including PCs and mobile devices. See, e.g., Micron Technology, Markets and Industries, https://www.micron.com/markets-industries Micron Technology anticipates that the Proposed Project would enable increased DRAM supply for military and defense applications over time by being the sending-site for future technology transfers for the planned expansion of Micron Virginia’s facility.
1-6 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT production cost and long-term commercial viability.
According to the National Institute of Standards and Technology (NIST) report titled Vision for Success – Commercial Fabrication Facilities, “[u]nlike logic chips, memory products are standardized and often interoperable: A memory chip from one company can typically substitute for a memory chip from another. These features generally increase the resiliency of the memory market, as memory customers willing to pay the prevailing market price can often source their products from any memory producer in the market. Memory chipmakers must thus compete largely on price and operate at lower margins relative to logic chipmakers. U.S. memory producers will therefore need to reach sufficient scale to benefit from the economies of scale enjoyed by larger clusters in East Asia.” (CPO, 2023b). In keeping with these trends, leading global DRAM competitors in East Asia have announced plans to produce memory chips in multiple fab clusters of increasing scale. 9 The complexity of the semiconductor wafer 10 manufacturing process is the primary driver of the need for larger logic and memory fab clusters that co-locate larger cleanrooms 11 on a single campus to facilitate necessary economies of scale. Fabs require an increasing amount of cleanroom space per wafer over time to accommodate the more sophisticated and larger tools needed for more advanced DRAM production. The cost of producing a wafer also depends on fixed costs of cleanroom and fab supporting infrastructure (e.g., site preparation, utilities, gas and chemical storage, and warehouse and office space) and the average operating cost per wafer (e.g., cost of services, labor and workforce training, warehousing, and upstream supplier service contracts). In general, co-locating more fabs with larger cleanroom spaces on a single site reduces both the fixed cost per wafer produced and the average operating cost per wafer.
Accordingly, viability in the industry depends on the construction of large fab clusters, or megafabs, on single campuses, with average fab sizes sufficient to accommodate necessary cleanroom space for specific technology types. 82 percent of major semiconductor memory campuses have more than two fabs (with fab sizes of 1.2 million sq. ft. or greater and cleanroom sizes of 600,000 sq. ft. or greater), and 55 percent have more than three fabs (1.8 million sq. ft. or greater). 72 percent of such campuses established in the past 20 years were built with more than three fabs to achieve increasingly necessary economies of scale. For additional discussion of the factors that drive semiconductor memory campus sizing and configuration, see Appendix A-1. Currently, Micron Technology manufactures all DRAM produced in the U.S. (less than one percent of global DRAM production). These DRAM chips serve certain industrial markets and cannot support new AI technology use cases. To meet CHIPS Incentives Program objectives, Micron Technology proposed to increase its U.S.-based DRAM production by a factor of 12 (i.e., to approximately 12 percent of global DRAM output) over the next two decades, which would also bring Micron Technology’s overall supply in line with industry demand growth trends 9 SK hynix has proposed a 4-fab DRAM cluster in Yongin, South Korea estimated to be completed by 2042 (Shilov, 2024). Samsung has proposed a 6-fab DRAM and advanced logic cluster in Yongin, estimated to be completed by 2047 (Ko, 2024).
10 A wafer is a thin slice of semiconductor material used in fabricating chips.
11 A cleanroom is a highly advanced semiconductor design, manufacturing, or testing space built to extremely precise engineering specifications, including strict filtration, temperature, and humidity controls. 1-7 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT (Micron Technology, 2023). This production increase is not achievable through modernizations and expansions at existing domestic Micron locations alone and would necessitate the construction of a new semiconductor manufacturing campus. Figure 1.1-1 illustrates Micron Technology’s proposal to increase the U.S. share of global DRAM manufacturing capacity to a level that meets the U.S. need for domestically produced memory chips.
Figure 1.1-1 Micron Technology Proposal to Increase U.S. DRAM Production Source: Tech Insights (2024); Micron Technology estimates. Percentages are approximations and account for production at all three Micron domestic sites.
As part of its merits review of Micron’s application, the Department of Commerce determined that Micron’s proposal for the construction of a new semiconductor manufacturing campus would achieve domestic memory production at the scale necessary to offset potential disruptions to U.S. economic and national security from the risks described above. Although the Department of Commerce’s final award to Micron only includes direct funding to support Micron’s construction and operation of Fabs 1 and 2, the Department of Commerce based its award decision on Micron’s proposal to establish a full 4-fab cluster by 2041 (which would ramp up to full operational capacity by 2045).
The Department of Commerce’s funding award for the construction of a semiconductor memory facility is based on two factors: (1) the amount of cleanroom space that would be required to achieve an economically viable domestic memory chip output sufficient to meet U.S. economic and national security objectives, based on economic modeling; and (2) by extension, the amount of total building area and site configuration that would be required to support that cleanroom space, accounting for technological, logistical, and cost considerations.
1-8 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT First, based on Micron’s economic model supporting its CHIPS application, the Department of Commerce determined that Micron would need to construct 2.4 million sq. ft. of cleanroom space capable of producing an average of 52,000 wafers per week over the life of the project to achieve the level of domestic memory chip output sufficient to meet U.S. economic and national security objectives. This output and associated cleanroom space requirement is based on Micron’s sources and uses information submitted in support of its CHIPS application, including economic modeling and estimates that Micron prepares as part of its annual long-range Sales and Operations Planning (SNOP) process. Micron uses its SNOP process to forecast overall memory sector market growth based on market intelligence, macro trends from new technologies such as AI, virtual reality, 5G wireless proliferation, and many other factors. Based on its product mixes and technological capabilities, such as the number of bits it can manufacture per wafer, Micron then determines how many wafers would be required to meet DRAM market demand, which in turn determines the cleanroom space required to meet that demand. 12 Second, the Department of Commerce determined that Micron would need to construct four fabs co-located at a single site with sufficient supporting infrastructure and utility capacity in order to accommodate the 2.4 million sq. ft. of cleanroom space necessary to achieve the required level of domestic DRAM production in a configuration that would be technically and economically practicable. Due to the nature of the technology, infrastructure, and utilities needed to support advanced cleanrooms, semiconductor fabrication facility building space ranks among the most expensive types of real estate globally by cost per square foot. This constraint requires large-scale semiconductor facilities to be simultaneously: (a) large enough to achieve a utilization rate of their expensive facility infrastructure capable of justifying their capital cost, known as the capital asset utilization (CAU) rate; and (b) compact enough with buildings efficiently designed to meet precise sizing, engineering, and interoperability specifications while minimizing overall building, utility, and equipment costs. 13 Based on the above considerations and Micron’s sources and uses information submitted in support of its CHIPS application, the Department of Commerce determined that without the ability to build four co-located fabs, Micron’s proposal would incur prohibitive additional costs and operational inefficiencies, which would likely force Micron to withdraw its application and pursue a memory campus in a lower-cost geography outside of the U.S. Therefore, the Department of Commerce determined that a 4-fab memory campus with an efficient layout at a single location would be required to ensure an economically and commercially viable operation that would meet 12 AI workloads require high-bandwidth memory (HBM) chips, which take more steps to produce than traditional DRAM chips, such as double-data rate (DDR) 4 and DDR 5 products. HBM products require more manufacturing steps due to their speed requirements, the need to stack HBM chips into modules using Through-Silicon-Via technology, and other performance requirements. Each AI module (i.e., an AI product containing a logic chip plus memory chips) requires dozens of HBM chips. Micron plans to manufacture a mix of these products in NY, and the HBM requirements for these products are anticipated to create upward pressure on the amount of cleanroom space required to meet the growing market demand, which is why Micron has announced an additional fab in Idaho (Narasimhan, 2024).
13 Additionally, Micron projects that have been announced for Virginia and Idaho are co-located with Micron’s existing manufacturing and R&D/Headquarters respectively. These expansion projects do not rely on the same efficiencies of scale that are required for the construction of a greenfield site like the Proposed Project. Unlike the Proposed Project, the expansion projects can rely on existing infrastructure, site components and existing cleanroom space.
1-9 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT the Department of Commerce’s economic and national security responsibilities under the CHIPS Act.
Figure 1.1-2 below shows the competitive position the Proposed Project’s fabs would occupy compared to major competitors, based on total campus cleanroom space. The x-axis shows each competitor’s campus location, and the y-axis shows the campus cleanroom space in sq. ft. The figure shows an alternating progression of companies building larger campuses as they work to stay ahead of the competition, reflecting a market trend that has since surpassed 2-fab and 3-fab campuses (1.2-1.8 million sq. ft. of cleanroom space) toward campuses crossing the 4-fab threshold (2.4 million sq. ft. or more of cleanroom space). Competitors also are continuing to add capacity to existing campuses over time.
Figure 1.1-2 Proposed Project and Competitor Campus Cleanroom Space Sources: Micron Technology (n.d.); SEMI World Fab Forecast Report (SEMI, 2025). Note: estimates assume standard large memory campus fab cleanroom sizes of 600,000 sq. ft.
In sum, CPO considered the totality of the specific memory chip factors described above as part of its decision-making process under the CHIPS Act, including the risks to national and economic security posed by a lack of U.S.-based large-scale memory chip production capacity, and the fab cluster and size benchmarks necessary to establish a technologically and economically viable domestic memory chip production capacity.
As noted above, this section states Micron’s purpose and need in accordance with SEQRA. Micron’s purpose and need for the Proposed Project are to construct and operate a state-of-the-art, economically viable semiconductor manufacturing facility. In coordination with CPO and OCIDA,
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT and based on its SNOP process, Micron determined that the only feasible method of establishing an economically viable large-scale memory chip production facility in the U.S. would be to develop a 4-fab facility on a single site capable of efficiently increasing Micron’s U.S.-based DRAM production 12-fold from current levels to 52,000 wafers per week, which also would ensure a resilient domestic supply of DRAM chips consistent with CHIPS Incentives Program and New York Green CHIPS Program objectives.
Micron identified the WPCP as a suitable location for the Proposed Project based on the site’s ability to accommodate a 4-fab footprint and its proximity to the utility, transportation, and human resources infrastructure necessary to achieve the economies of scale the Proposed Project would require. Accordingly, Micron proposes to lease and ultimately purchase the WPCP from OCIDA and to construct and operate a 4-fab facility at that location.
CPO and OCIDA jointly prepared this Final EIS to evaluate the potential environmental effects of the Proposed Project as required under NEPA and SEQRA. Specifically, CPO prepared the EIS to identify and assess the reasonably foreseeable environmental effects of the Proposed Action and a reasonable range of alternatives, facilitate public involvement and informed agency decision-making, and recommend appropriate mitigation measures. OCIDA prepared the EIS to consider the environmental effects of the Proposed Action and alternatives equally with social and economic factors before it or any involved State or local agency may issue SEQRA findings and exercise discretionary decision-making or funding authority with respect to the Proposed Project, and to propose mitigation measures to avoid or minimize adverse environmental effects to the maximum extent practicable.
CPO and OCIDA agreed to act as joint lead agencies under NEPA and SEQRA. The U.S. Army Corps of Engineers (USACE) and the U.S. Environmental Protection Agency (USEPA) agreed to act as cooperating agencies under NEPA based on their jurisdiction by law and special expertise with respect to evaluating the environmental effects of the Proposed Action and alternatives. The FHWA and the U.S. Fish and Wildlife Service (USFWS) agreed to act as participating agencies in the development of the EIS. The Onondaga Nation agreed to be a participating entity in the development of the EIS. OCIDA coordinated input from several State and local agencies into the EIS. The EIS provides a basis for coordinated Federal, State, Tribal, and local input and review in a single document. The following sections describe the specific roles of each entity in the environmental review process.
On behalf of the Department of Commerce, CPO is responsible under the CHIPS Act for determining whether to provide Federal funding to Micron to support the Proposed Project. CPO has special expertise in evaluating the environmental effects of semiconductor manufacturing and is the lead Federal agency responsible for preparing this EIS under NEPA. CPO also is the lead agency for purposes of consultations under Section 106 of the National Historic Preservation Act (NHPA) and Section 7 of the Endangered Species Act (ESA).
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
OCIDA is the lead agency responsible for preparing this EIS under SEQRA, based on its role in the proposed lease and subsequent sale of WPCP to Micron, the potential granting to Micron of financial assistance within the meaning of New York General Municipal Law § 854(14), and the potential undertaking of property condemnation pursuant to the New York EDPL. OCIDA is also coordinating input from other State and local agencies.
1.2.1.3 U.S. Army Corps of Engineers USACE has jurisdiction and authority under Section 404 of the Clean Water Act (CWA), which regulates the discharge of dredged or fill material into waters of the U.S., and Section 10 of the Rivers and Harbors Act, which regulates work or structures in, over, or under navigable waters of the U.S. USACE agreed to act as a cooperating agency in the preparation of the EIS so that it may rely on the content of the EIS and its appendices for making permit decisions regarding discharges of dredged or fill material into waters of the U.S. associated with the Proposed Project and the Connected Actions. The Proposed Project would occur within the USACE Great Lakes and Ohio River Division, Buffalo District. Staff from the Buffalo District cooperated with the lead agencies to prepare the EIS.
USACE will obtain the views of Tribal Nations, natural resource agencies, and the public prior to reaching its decisions on the Proposed Project. As an element of its review, USACE must consider whether the Proposed Project represents the least environmentally damaging practicable alternative, which requires the avoidance, minimization, and mitigation of unavoidable impacts on waters of the U.S. The EIS contains information USACE may use to support this review. USACE will decide whether to adopt the EIS based on an independent review of the document and whether it satisfies USACE’s comments. USACE may prepare a separate ROD to formally document its decisions with respect to the Proposed Project, including decisions based on CWA Section 404(b)(1) analyses and environmental mitigation commitments.
1.2.1.4 U.S. Environmental Protection Agency USEPA agreed to act as a cooperating agency in the preparation of the EIS. Pursuant to Section 309 of the Clean Air Act (CAA), USEPA is responsible for reviewing and commenting in writing on the environmental effects of the Proposed Action and alternatives identified in the EIS. USEPA also has regulatory responsibilities under the CWA Section 404 and Section 401 water quality certification processes and is responsible for reviewing Micron’s applications for CAA Title V facility operating permits.
FHWA agreed to act as a participating agency in the preparation of the EIS based on its special expertise in analyzing transportation and traffic studies and analyses.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT 1.2.2.2 U.S. Fish and Wildlife Service USFWS agreed to act as a participating agency in the development of the EIS based on its special expertise in evaluating effects on aquatic and terrestrial wildlife and their habitats. Pursuant to the ESA Section 7 consultation process, CPO is consulting with USFWS to ensure that the Proposed Action is not likely to jeopardize the continued existence of any Federally listed threatened or endangered species or destroy or adversely modify designated critical habitat. As part of the Section 7 consultation process, USFWS will prepare a Biological Opinion concerning the take of Federally listed species.
The Onondaga Nation elected to participate in the development of the EIS as a participating entity, to contribute its Indigenous Knowledge and special expertise in Haudenosaunee and Onondaga culture and the interrelationship of the natural world in this geographic area.
OCIDA determined that the Proposed Project is a Type I action under SEQRA requiring the preparation of an EIS and a coordinated review among all involved and interested State and local agencies. 14 As lead agency under SEQRA, OCIDA considered the interests and concerns of all such agencies and coordinated their input in the EIS. Table 1.2-1 lists the State and local involved and interested agencies and their roles with respect to the Proposed Project. Table 1.2-1 State and Local Involved and Interested Agencies Agency Role Involved Agencies New York State Department of Responsible for permits and authorizations related to air quality, Environmental Conservation wetlands, threatened and endangered species, water withdrawal, (NYSDEC) coastal erosion management, water discharges from on-site and off- site land disturbance, discharges associated with industrial activity, direct discharge to New York State waters, CWA Section 401 water quality certification, hazardous substance petroleum and chemical bulk storage, and importation of fill material. Empire State Development, Responsible for review and approval Micron’s Green CHIPS and including the New York State Excelsior Jobs Tax Credit Program applications. Department of Economic Development and the New York State Urban Development Corporation (ESD) New York Department of State Responsible for issuing decision on Coastal Zone Management Act (NYSDOS) (CZMA) Federal consistency.
14 See 6 NYCRR § 617.6(b)(3).
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT New York State Department of Operates and maintains the State transportation system that would Transportation (NYSDOT) serve the Proposed Project. Responsible for assessing Proposed Project effects on State transportation facilities, evaluating proposed mitigation measures, and issuing permits for work affecting State highways, such as highway work permits and use and occupancy permits.
New York State Office of Serves as the State Historic Preservation Officer for purposes of Parks, Recreation and Historic NHPA Section 106 consultation.
Preservation (OPRHP) New York Office of General Responsible for construction permit and easement to occupy Services (NYSOGS) underwater lands.
New York Power Authority Responsible for approving ReCharge NY program and high-load (NYPA) factor energy allocations for the Proposed Project. New York State Canal Responsible for issuing use and occupancy permits, easements, and Corporation work permits related to water line crossings.
Onondaga County Department Operates and maintains the County transportation system that would of Transportation (OCDOT) serve the Proposed Project. Responsible for assessing Proposed Project effects on County transportation facilities, evaluating proposed mitigation measures, and issuing permits for work affecting County highways, such as work permits and use and occupancy permits.
Onondaga County Water Responsible for expanding capacity of and extending potable water Authority (OCWA) lines to serve the Proposed Project.
Considering proposed water supply system upgrades and installation of new water transmission mains to serve the Proposed Project. Onondaga County Department Responsible for development and construction of proposed new of Water Environment industrial wastewater treatment plant (IWWTP) and industrial Protection (OCDWEP) wastewater and reclaimed water conveyance to serve the Proposed Project.
Responsible for submitting application to NYSDEC for modification of OCDWEP Oak Orchard Wastewater Treatment Plant (OOWWTP) site’s State Pollutant Discharge Elimination System (SPDES) permit, including permit modifications associated with any on-site water reclamation treatment processes.
Responsible for decisions pertaining to OCDWEP industrial pretreatment program as approved by USEPA.
Town of Clay Town Board Responsible for zoning amendments, special use permits, and discontinuance of Town road.
Town of Clay Planning Board Responsible for site plan / subdivision approval (re-subdivision of multiple parcels) and municipal separate storm sewer system and Stormwater Pollution Prevention Plan (SWPPP) approval. Town of Cicero Planning Board Responsible for subdivision approval.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Interested Agencies New York State Department of Responsible for approval of Article VII application for proposed Public Service (NYSDPS) / National Grid electric transmission electricity improvements and New York State Public Service 401 water quality certification (see Section 3.3, Water Resources). Commission (NYSPSC) New York State Energy Collaborating with ESD in review of Micron’s Green CHIPS and Research and Development Excelsior Jobs Tax Credit Program applications. Authority (NYSERDA) Onondaga County Department General consultation.
of Planning City of Syracuse General consultation.
Syracuse Metropolitan General consultation and approval actions to add to official regional Transportation Council transportation plans.
(SMTC) Town of Cicero Town Board Referral per General Municipal Law.
After OCIDA received an Application for Financial Assistance from Micron, it held a public meeting and circulated a notice of intent to all involved agencies to serve as SEQRA lead agency on July 28, 2023. No objection to that notice was received during the subsequent 30-day comment period. On September 14, 2023, OCIDA issued a Positive Declaration indicating the need for an EIS and scheduled a public scoping meeting to be held on October 11, 2023. The Notice of SEQRA Positive Declaration, Availability of Draft SEQRA Scope, and Public Scoping Session was published in the Environmental Notice Bulletin on September 20, 2023. Notice of the public scoping meeting was placed in The Post Standard (Syracuse.com), the primary newspaper of general circulation serving the Central New York region, on September 19, 2023. OCIDA posted the Draft SEQRA Scope and information on the Proposed Project on its website (https://ongoved.com/).
The comment period for the SEQRA scoping process was extended beyond the required 30 days from September 20, 2023, to October 31, 2023. During this period, OCIDA held the public scoping meeting at 6:30 p.m. on October 11, 2023, to obtain input from the public. Everyone who registered or asked to speak was given the opportunity to submit a verbal comment. The scoping meeting provided simultaneous Spanish and American Sign Language interpretation; no additional language translation services or special needs assistance were requested. Comments also were accepted during the scoping period via electronic mail to micron@ongov.net and via U.S. Mail, Attn: Micron Project, Onondaga County Industrial Development Agency, 335 Montgomery Street, 2nd Floor, Syracuse, NY 13202.
In total, 39 individuals, organizations, and agencies provided comments during the public comment period, including written comment letters from USFWS and NYSDEC. OCIDA considered each comment received during the SEQRA scoping period to determine the final scope
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT of the Draft EIS under SEQRA and inform the related technical analyses and environmental resources to be evaluated. On December 14, 2023, OCIDA adopted the Final SEQRA Scope, which was made available to the previously noticed agencies and posted on OCIDA’s website. A copy of the Final SEQRA Scope is included in Appendix A-2.
USACE was initially the lead Federal agency for the Proposed Project under NEPA and published a Notice of Intent (NOI) to Prepare an EIS and conduct a public scoping meeting in the Federal Register on March 5, 2024. USACE also mailed 191 scoping letters to interested parties and stakeholders, including: adjacent property owners to the proposed Micron Campus; elected State, County, City, and Town officials; Federal and State agencies; and the Onondaga Nation, the Oneida Indian Nation, the Oneida Nation of Wisconsin, the Wyandotte Nation, the Tuscarora Nation, and the Cayuga Nation. USACE held a public scoping meeting at the Clay Town Hall in Clay, NY on Tuesday, March 19, 2024, with the cooperation of CPO and OCIDA. Approximately 175 individuals participated, and 23 individuals made verbal comments regarding the Proposed Project. The public comment period on the NOI and NEPA scoping closed on April 5, 2024. By subsequent agreement with USACE, CPO became the lead Federal agency for the Proposed Project on behalf of the Department of Commerce on April 6, 2024.
CPO considered each comment received during the NEPA scoping period and coordinated with OCIDA and USACE to determine the final scope of the Draft EIS under NEPA and inform the related technical analyses and environmental resources to be evaluated. For a summary of the comments that CPO and USACE received during the NEPA scoping period, see Appendix A-3.
CPO filed the Draft EIS with USEPA for issuance of a Notice of Availability in the Federal Register and mailed the Notice of Availability to the parties on the mailing list (Chapter 8, Distribution List). In addition, on June 25, 2025, OCIDA adopted the Draft EIS as complete for the purposes of commencement of public review and set an August 11, 2025, deadline for the receipt of public comments. On that same date, OCIDA adopted a Public Hearing Resolution and filed the Draft EIS with the Chief Executive Officer of the Town of Clay and the Town of Cicero and published the Notice of Availability in the Environmental Notice Bulletin and The Post- Standard. The Notices of Availability explained how to access the Draft EIS on CPO’s and OCIDA’s websites, announced a 45-day period for the public to comment on the Draft EIS, and explained how electronic or written comments can be submitted to CPO and OCIDA.
In addition, the Notices of Availability provided notice that a public hearing to take verbal comments on the Draft EIS would be held on July 24, 2025, from 10AM – 1PM, 2PM – 5PM and 6PM-9PM at the Liverpool High School Auditorium, 4338 Wetzel Road, Liverpool, New York, 13090.
Comments on the Draft EIS were accepted in writing, either by first class mail or electronic mail, or as part of the July 24, 2025, Public Hearing. In total, there were approximately 1270 comment submissions received from the general public on the Draft EIS, some of which were duplicates, from a total of approximately 1050 commenters, some in support of the Proposed Project and Connected Actions and others opposed, which includes three comments from local
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT elected officials. In addition, comments were received from 12 federal, state and local agencies.
Table 1.4-1 identifies the major permits, approvals, and consultations required for the Proposed Project and Connected Actions. Micron is responsible for obtaining all permits, approvals, or other authorizations required for the Proposed Project, regardless of whether they appear in Table 1.4-1.
Table 1.4-1 Permits, Approvals, and Consultations Permit / Approval Agency Description Federal CWA Section 404 USACE Permit required for the discharge of dredged or fill material permit into waters of the U.S. (WOTUS), including wetlands (33 U.S.C. § 1344).
Rivers and Harbors USACE Permit required for structures and/or work in or affecting Act Section 10 navigable WOTUS (33 U.S.C. § 403).
permit ESA Section 7 USFWS Formal consultation with Biological Opinion and potential Consultation Incidental Take Statement issued by USFWS authorizing incidental take of endangered species (16 U.S.C. § 1536). NHPA Section 106 NYSHPO Consultation with consulting parties regarding effects of an Consultation undertaking on historic properties and development of a programmatic agreement (54 U.S.C. § 306108). State and Local Financial assistance OCIDA Approval of application for certain financial assistance; approval of lease and sale of the WPCP, as authorized under law (General Municipal Law Chapter 24). Financial assistance ESD Refundable tax credits under New York’s Green CHIPS Excelsior Jobs Tax Credit Program (Green CHIPS Act (S. 9467 / A. 10507)).
Authorizations for NYSOGS Approval of a lease, easement, or other interest for structures in state- structures and appurtenances in, on, or above state-owned owned lands under lands under water (Public Lands Law Articles 2 and 6; 6 water NYCRR Part 428).
Work and/or NYS Canal Permits for work in and/or occupancy on Canal property Occupation Permit Corporation (Public Authorities Law Chapter 43-A, Title 1, Section 1005-B).
Certificate of NYSDPS / Approval of application for certificate (Public Service Law Environmental NYSPSC Article 7) (exempt from SEQRA review; NYSDPS conducts Compatibility and a separate environmental review).
Public Need
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Incidental Take NYSDEC Permit required for incidental take of state-listed species Permit (ECL Article 11; 6 NYCRR Part 182).
Stream Disturbance NYSDEC Permit required for any change, modification, or disturbance or Modification of any protected stream, its bed or banks, or to remove from permit its bed or banks sand, gravel, or other material (ECL Article 15; 6 NYCRR § 608.2).
Protection of Waters NYSDEC Permit required to excavate or place fill in waters protected permit by the State (ECL Article 15; 6 NYCRR § 608.5). Water Supply / NYSDEC Permit required for the construction, operation, or Withdrawal Permit maintenance of a water withdrawal system (ECL Article 15; 6 NYCRR Part 601).
SPDES Discharge NYSDEC SPDES permit required to discharge or cause a surface or Permit groundwater discharge of any pollutant from any outlet or point source into the waters of the State (ECL Article 17; 6 NYCRR Part 750).
SPDES Multi-Sector NYSDEC Permit for industrial activities that discharge stormwater to General Permit surface waters of the state must obtain coverage under (MSGP) MSGP (ECL Article 17; 6 NYCRR Part 750). SPDES General NYSDEC Construction activities with soil disturbance of one or more Permit for acres must obtain coverage under the General Permit for Construction Stormwater Discharges from Construction Activities (ECL Activities Article 17; 6 NYCRR Part 750).
Reclaimed water NYSDEC Registration required for use of reclaimed wastewater or registration greywater (ECL Article 15).
SPDES Discharge NYSDEC SPDES permit to discharge or cause a surface or Permit, Septic groundwater discharge, and approval of plans for septic System Approval disposal system (ECL Article 17; 6 NYCRR Part 750). CWA Section 401 NYSDEC / Certification that activity will not violate state water quality Water Quality NYSDPS standards (33 U.S.C. § 1341).
Certification CAA Title V permit NYSDEC Permit required to construct and operate a facility that is considered a major source of air emissions that are at or above certain thresholds (New York Environmental Conservation Law (ECL) Article 19).
Activities on NYSDEC Permit or letter of permission required to conduct activities wetland and on wetlands or adjacent areas not specifically exempted adjacent areas from regulation (ECL Article 24; 6 NYCRR Parts 663-664). Collection, Disposal NYSDEC Permit for generators and transporters of hazardous wastes and Treatment of (ECL Article 27; 6 NYCRR Part 373).
Refuse and Other Solid Wastes
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Beneficial Use NYSDEC Permit for the beneficial use of large quantities of imported Determination excavated materials that are not mined or purchased (ECL Article 27; 6 NYCRR Parts 360-365).
Hazardous NYSDEC Registrations or license for facilities that store hazardous Substances and substances or petroleum above threshold quantities (ECL Petroleum Bulk Articles 17 and 40; 6 NYCRR Parts 597, 598, 610, 613). Storage Permits State air facility NYSDEC State air facility permits are required for facilities with permit / registration potential air emissions that are below major source thresholds, but above 50% of the level that would make them a major source. Air facility registrations are required for facilities with regulated air emissions that are below criteria for either State facility permits or Title V permits (ECL Article 19; 6 NYCRR Part 201).
Temporary NYSDOT Permit for new or temporary access to a state highway or for Roadway Access activities conducted within the right of way of a NYS permit highway (NYS Highway Law Article III, § 52). Access or Right-of- OCDOT Permit for construction or modification of buildings, Way permit driveway, and means of access related to County roads (NYS Highway Law Article VI, § 136).
County wastewater OCDWEP Waste discharge permit to connect to or discharge into the discharge permit County sewer system (Onondaga County Administrative Code Article XXII, Section 22, et seq.; Appendix 11-A, Sections 1153 g, j, 11.67, 11.68, 11.79) and pursuant to
Relating to the Use of the Public Sewer System issued by the County of Onondaga, Department of Water Environment Protection.
County Planning Onondaga Review and recommendation by the Onondaga County Review and County Planning Planning Department relative to the discretionary approvals Recommendation Department required by the Towns of Clay and Cicero (General Municipal Law Section 239).
Zoning Amendment Town of Clay Approval by Town Board of a Petition for Change of Zone, Town Board amending the zoning ordinance, and to reclassify the zoning district (Town of Clay Code Section 230). Subdivision Town of Clay Review and approval of applications for subdivision of land approval Planning Board (Town of Clay Code Chapter 200, Chapter 230 § 230- 26.B.(2) (Subdivision of Land).
Site Plan Review Town of Clay Review and approval of site plans (Town of Clay Code § Planning Board 230-26.B.(4)).
Special Use Permit Town of Clay Review and approval of applications for special use permits Planning Board (Town of Clay Code § 230-26.B.(3); §§ 230-27, generally).
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Subdivision of Land Town of Cicero Review and approval of applications for subdivision of land Planning Board (Chapter 185, Code of the Town of Cicero).
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
This EIS evaluates the Proposed Action and a No Action Alternative. The Proposed Action is identified and referred to in this EIS as the Preferred Action Alternative because it is the alternative that would best meet CPO’s purpose and need under NEPA and Micron’s purpose and need under SEQRA. The Preferred Action Alternative would encompass the Proposed Project and Connected Actions described in Section 2.1 below. The No Action Alternative, as well as three alternatives that were considered but dismissed from further consideration, are discussed in Section 2.2. The WPCP was selected as the site for the proposed Micron Campus following independent site selection processes conducted over time by the State of New York, Onondaga County, and Micron. For a summary of these site selection processes, see Appendix B-1.
The Preferred Action Alternative would consist of: (1) the Proposed Project, which would include the construction and operation by Micron of the Micron Campus, the Rail Spur Site, and the Childcare Site, and the leasing and operation by Micron of the Warehouse Site; and (2) the Connected Actions, which would include the expansion of certain existing utility properties and the construction and operation of various utility improvements by National Grid, OCWA, OCDWEP, and others to support the electricity, natural gas, water supply, wastewater, and telecommunication needs of the Proposed Project. 15 The build-out of the Proposed Project and Connected Actions would occur over a 16-year period, based around the construction of the four fabs at the Micron Campus. Although some components of the Preferred Action Alternative have undergone extensive planning, the details of some of the later Connected Actions are still in the planning stages. For additional information and analysis of the estimated resource demands of the Proposed Project and Connected Actions, see Section 3.10 (Utilities and Supporting Infrastructure).
Figure 2.1-1 on the next page shows a map of the components of the Proposed Project and Connected Actions. On the following pages, Figure 2.1-2 shows the boundary of the proposed Micron Campus, which would total approximately 1,377 acres, including the 1,339-acre WPCP, a 28-acre South Finger area, the nine-acre Burnet Road right-of-way (ROW), and a one-acre jack and bore site, 16 and Figure 2.1-3 shows the construction timeline for the Proposed Project and Connected Actions.
Table 2.1-1, following the figures, briefly describes the Proposed Project and Connected Action components, which are described in detail in Sections 2.1.1 through 2.1.9.
15 For purposes of this EIS, the term “Connected Action” (synonymous with the term “related action” under SEQRA) refers to a Federal, State, or local activity that would not proceed without construction and operation of the Proposed Project and is therefore considered in this EIS along with the Proposed Project.
16 Although the discussion of the Affected Environment in the EIS generally refers to the WPCP to describe the existing location where the proposed Micron Campus would be built, the Micron Campus also would include the additional properties and acreages adjacent to the current WPCP as described above. 2-1 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-1 Proposed Project and Connected Actions 17 Source: Light Gray Canvas (Esri, 2025a): Esri, TomTom, Garmin, FAO, NOAA, USGS, © OpenStreetMap contributors, and the GIS User Community.
17 Disturbance areas that overlap between different project components are only counted a single time for the environmental analyses in Chapter 3.
2-2 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-2 Proposed Micron Campus Boundary Source: Light Gray Canvas (Esri, 2025a): Esri, TomTom, Garmin, FAO, NOAA, USGS, © OpenStreetMap contributors, and the GIS User Community.
2-1 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-3 Proposed Project and Connected Actions Construction Timeline Sources: Micron Technology (n.d.); National Grid (n.d.); OCWA (n.d.); and OCDWEP (n.d.). Note: Phases 1 and 2 of the OCWA improvements and Stages 1 and 2 of the OCDWEP improvements would be timed to serve Phase 1 (Fabs 1-2) and Phase 2 (Fabs 3-4) of the Micron Campus. The Warehouse Site is not shown but Micron would anticipate leasing warehouse space for a 7-10-year term beginning in April 2026. 2-2 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Table 2.1-1 Proposed Project and Connected Actions Component Description Approx. Area Timing Proposed Project Micron Campus Micron proposes to lease and ultimately purchase from OCIDA the 1,339- 1,377 acres 2025-2029 (Fab 1) acre WPCP located at 5171 NYS Route 31 in Clay, NY. The WPCP, 2028-2030 (Fab 2) together with the approximately 28-acre South Finger (part of Town of 2033-2035 (Fab 3) Cicero tax parcel 091.-01-02.1), which would provide access from U.S. 2039-2041 (Fab 4) Route 11, and the approximately nine-acre Burnet Road ROW, would form the central component of the Micron Campus, which also would 2041-2045 (ramp-up include an approximately one-acre jack and bore site (Town of Clay tax to full production) parcel 048.-01-02.1), which would be solely used for utility lines. The proposed Micron Campus (1,377 total acres) would consist of a semiconductor manufacturing facility with four DRAM production fabs, ancillary support facilities, driveways, parking, and ingress and egress roads with access from NYS Route 31, U.S. Route 11, and Caughdenoy Road and would be constructed in phases over a 16-year period. The facility would reach full production in 20 years.
Rail Spur Site Micron proposes to construct a rail spur and conveyance facility from late 38 acres Q4 2025 to 2025 to the middle of 2026 on approximately 38 acres west of 8625 Q2 2026 Caughdenoy Road, Clay, NY (Town of Clay tax parcel 046.-02-03.2) to convey fill and other aggregate construction material to the Micron Campus.
Childcare Site Micron proposes to construct a childcare center from 2026-2028 and a 31 acres 2026-2028 healthcare center and a recreation center from 2030-2031 on an (Childcare) approximately 31-acre parcel at 9100 Caughdenoy Road, Brewerton, NY 2030-2031 (Town of Clay tax parcel 042-01-13.0). (Healthcare Micron would plan to construct an expansion of the childcare center within and Recreation) a portion of the proposed Childcare Site from 2037-2038. 2037-2038 (Childcare Expansion) Warehouse Site Micron proposes to lease 360,000-500,000 sq. ft. (8.3-11.5 acres) of 8-11 acres Lease in April 2026 existing warehouse space in an industrially zoned area at a to-be- (expected) determined location within 20 miles of the Micron Campus.
2-3 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Connected Actions Electricity National Grid proposes to expand the existing Clay Substation and 39 acres Q4 2025 to construct new 345kV electric transmission lines and eight new Q4 2027 underground duct banks to connect to the Micron Campus.
Natural Gas National Grid proposes to expand an existing gas regulator station (GRS) 3.1-mile gas line Q4 2025 to and construct a new natural gas distribution line from the regulator station Q4 2028 to the Micron Campus.
Water Supply OCWA proposes to undertake two phases of water system capacity and 2.5-mile raw water 2026-2034 (Phase 1 / transmission upgrades to supply water to the Micron Campus. Phase 1 transmission main to serve Fabs 1-2) would involve upgrades to the Lake Ontario Water Treatment Plant 22-mile clear water 2034-2040 (Phase 2 / (LOWTP), Raw Water Pump Station (RWPS), and Terminal Campus in transmission main to serve Fabs 3-4) Clay, plus construction of an approximately 2.5-mile raw water 5-mile eastern branch transmission main from the pump station to the LOWTP for water supply transmission main redundancy, an approximately 22-mile clear water transmission main and upgrades to running parallel to the existing transmission main from the LOWTP to the existing OCWA Terminal Campus, and an approximately 5-mile transmission main parallel utility properties to the existing Eastern Branch Transmission Main. Phase 2 would involve additional upgrades and potential transmission lines based on need. Wastewater OCDWEP proposes to undertake two stages of wastewater treatment 36 acres (existing 2026-2029 (Stage 1 / system capacity and conveyance upgrades to serve the Micron Campus. utility property) to serve Fabs 1-2) Stage 1 would involve a bridging project at the existing OOWWTP to 2033-2035 (Stage 2 / receive sanitary wastewater and temporarily accommodate startup to serve Fabs 3-4) industrial wastewater from the Micron Campus as OCDWEP constructs a new IWWTP and water reuse facilities on 36 acres of its existing 76-acre Oak Orchard site, plus construction of a new industrial wastewater conveyance from the Oak Orchard site to the Micron Campus. Stage 2 would expand and upgrade the IWWTP to serve additional campus industrial wastewater flows.
Telecomm. Fiber optic telecommunication lines would be re-routed to serve the 1-2 miles (cable 2026 Micron Campus. extensions) Sources: Micron Technology (n.d.); National Grid (n.d.); OCWA (n.d.); OCDWEP (n.d.). 2-4 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
The Micron Campus is the primary component of the Proposed Project. Micron proposes to construct a semiconductor manufacturing facility on 1,377 acres, which includes the WPCP, the Burnet Road ROW, the South Finger, and the one-acre jack and bore site for utility lines. The facility would include four fabs built in phases over an approximately 16-year period as shown in Table 2.1-2. The construction period (2025-2041) would conclude with completion of the Fab 4 buildings.
Table 2.1-2 Micron Campus Fab Construction Schedule Building Construction Ready for Operations Phase Fab Construction Start Equipment Start End Phase 1A Fab 1 Q4 2025 Q2 2028 Q2 2028 Q1 2029 Phase 1B Fab 2 Q3 2028 Q3 2030 Q4 2030 Q4 2030 Phase 2A Fab 3 Q3 2033 Q3 2035 Q4 2035 Q4 2035 Phase 2B Fab 4 Q2 2039 Q2 2041 Q3 2041 Q3 2041 Source: Micron Technology. Note: Fab 4 building construction would end in Q3 2041, with final site work continuing into late 2041, internal equipment fit out continuing in 2042, and ramp up to full production by 2045. In Table 2.1-2, “Construction Start” refers to when large scale site preparation and construction would begin; the “ready for equipment” dates are when semiconductor manufacturing equipment and tools would be installed inside the fab buildings; “Building Construction End” refers to the completion of the fab building; fab operations would then start soon after. The fabs would be built sequentially from west to east. When external construction of a fab building is completed, internal construction would continue as semiconductor manufacturing equipment and tools are installed inside. While internal construction begins on one fab, external construction of the next fab would begin. This process would result in continuous construction activity on the Micron Campus from 2025 to 2041. For schematics showing the sequential build-out of the four phases, see Appendix B-2.
For a visual rendering of the final Micron Campus, see Figure 2.1-4 on the next page. Following the rendering, Sections 2.1.1.2 through 2.1.1.5 provide additional information on Micron Campus site preparation, foundation work, and building erection; the main components of the campus; and its estimated construction and operational labor force requirements. For a more detailed description of the site preparation process, see Section 3.2 (Geology, Soils, and Topography). For more detailed information on the anticipated effects of site preparation and construction work for the Micron Campus relating to transportation, traffic, noise, and other aspects of the surrounding local community, see Sections 3.11 (Transportation and Traffic), 3.12 (Noise and Vibration), 3.13 (Visual Effects and Community Character), and 3.14 (Community Facilities, Open Space, and Recreation).
2-5 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-4 Micron Campus Visual Rendering Source: Micron Technology (n.d.).
2-6 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
Preparing the proposed Micron Campus for construction would require approximately 997 acres of ground disturbance, including 445 acres of tree clearing and grubbing. Site preparation activities for Fab 1 at the western limits of the WPCP would start first and would include tree clearing, grubbing, soil excavation and removal, import of fill material, installation of erosion and sediment control, and grading. When tree clearing and site preparation occurs sequentially, the process below would occur over a continuous period of time. However, there will be periods when tree clearing and limited site preparation will occur followed by a pause before more intensive site preparation (see Fab 3 and 4).
In general, site preparation also would incorporate the following activities: • Mobilizing contractors to commence the work within the site boundary and prepare contractor areas for future activity.
• Identifying the limits of tree clearing and flagging and staking all buffer areas, sensitive areas, and wetlands prior to the start of construction.
• Installing temporary erosion and sediment controls, stormwater management areas, and stormwater infrastructure.
• Establishing site access points and installing perimeter fencing for security. • Setting up infrastructure at the site, including contractor offices, laydown areas, precast yards, and personnel parking.
• Constructing haul roads into and out of the site and setting up traffic arrangements. • Performing site clearing and landscape grubbing work.
• Installing cut-and-fill earthworks to create the necessary level platform areas before foundation work commences.
In general, site preparation and construction activity for the Micron Campus would take place seven days a week between the hours of 6 a.m. and 10 p.m. 18 For more detailed information on construction dates, times, and restrictions, see Section 3.12 (Noise and Vibration).
Foundation work, also described in further detail in Section 3.2 (Geology, Soils, and Topography), would require installation of drilled piers into bedrock followed by concrete work to pour and form slabs or “pads” for the fab buildings. At this stage, Micron also would perform any necessary dewatering work and install underground utility lines. After completing foundations 18 Applicable Town of Clay requirements currently do not authorize construction activities during these extended times. Micron is in discussions with the Town of Clay to either modify or obtain a variance from the applicable requirements to facilitate timely construction of the Proposed Project as presented in this EIS and will comply with all applicable noise ordinances. See Section 3.12 (Noise and Vibration) for more information. 2-7 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT and any necessary fill and grading, Micron would place topsoil and seed disturbed areas for regrowth.
At the fab building erection stage, Micron would install pre-cast concrete superstructures (either produced on or off-site) and install enclosures beginning from the lower floors and continuing up to the top of the buildings. Interior partitions and dividing walls would be framed concurrently with building enclosure installation. Following the enclosure of each floor, mechanical, electrical, plumbing, and process system rough-ins would be installed. Finally, Micron would complete interior work, including interior finishes, painting, cabinetry, and installation of plumbing fixtures and appliances.
Final sitework would include completing the building rooftops and installing surrounding landscapes, as well as paving work, site lighting work, and remaining landscaping activity. At full build-out in 2041, the Micron Campus would include 645 acres of new impervious surface, 58 acres of semi-pervious area, and 278 acres of green space within the 997-acre construction disturbance footprint.
For each fab, the foundation work, erection of building shells, and other exterior construction would span roughly a 1-year period. A significant portion of the construction activities during the 16-year construction period would occur inside the fab building shells and, with the exception of equipment deliveries, would not be visible or exposed to surrounding residents or the general public.
Figure 2.1-5 below provides a site plan of the Micron Campus. Following the site plan, Table 2.1-3 provides descriptions of the main components of the campus.
2-8 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-5 Micron Campus Site Plan Source: Micron Technology (n.d.).
2-9 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Table 2.1-3 Micron Campus Components Component Plan Marker Area Description Fabrication FAB 4.8 million sq. Micron proposes to construct four fabs, each with an identical footprint of approximately 27.5 Buildings (4) ft. acres or 1.2 million sq. ft. (600,000 sq. ft. of cleanroom space and 600,000 sq. ft. for the supporting building infrastructure and utilities needed to operate the fab), for a total footprint for all four fabs of 4.8 million sq. ft. at full build-out in 2041. By constructing the fabs sequentially in phases, Micron would be able to begin chip manufacturing at the Micron Campus as soon as Fab 1 becomes operational. The four fabs would be constructed in close proximity to each other with the same layout, orientation, and finished floor elevation, and would be successively connected as they are constructed to form the “spine” of the manufacturing facility, to maximize efficiencies and flows across the fabs and the production efficiency of the facility as a whole. Each fab would have a typical height of approximately 148 ft., with the tallest small individual roof penthouses reaching a height of 160 ft. Operations at each fab would include raw material receiving, memory chip manufacturing, and final product storage and shipping. Manufacturing operations would commence upon completion of construction and equipment installation and testing. Administration A 478,000 Four administration buildings to the south of the probe buildings (see below), each approximately Buildings (4) sq. ft. 105 ft. tall with a 119,500 sq. ft. footprint, would provide office space supporting the estimated 2,000 manufacturing employees at each fab. Probe Buildings B 730,400 Four probe buildings to conduct electrical testing on manufactured chips before they are shipped (4) sq. ft. would each have an approximately 182,600 sq. ft. (4.2 acre) footprint and approximately 85,000 sq. ft. of cleanroom space on the upper floor (for a total 340,000 sq. ft. of cleanroom space). These buildings also include a small number of emergency generators. Central Utilities C 1.8 million sq. Four central utility buildings (CUBs), one dedicated to each fab, would house the systems required Buildings (4) ft. to deliver the utilities necessary to produce the chips, including HVAC, electrical transmission equipment, water purification and recycling, and chemical/specialty gas delivery systems. Each CUB would be 73 ft. tall with a 441,210 sq. ft. (10.1 acre) footprint consisting of multiple individual utility plant modules to house the heating, cooling, compressed air, electrical equipment, and emergency generators (approximately 60 per CUB) serving the surrounding buildings associated with each fab. A small number of emergency generators would also be located outside the CUB at other locations on campus, including emergency fire pump engines.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Electrical Yards D 700,000 Four electrical yards and substations, one for each fab, each with a 175,000 sq. ft. (4-acre) and Substations sq. ft. footprint, would be constructed on the north sides of the fabs, and would supply the electrical (4) needs for full fab operations.
Hazardous E 2.1 million Eight hazardous process materials buildings, each with a 525,000 sq. ft. (12 acre) footprint, would Process sq ft. store and dispense specialized chemicals and gases for manufacturing and would be arranged as Materials four groupings of two buildings each, with identical footprints and configurations, located between Buildings (8) Fabs 1 and 2 and Fabs 3 and 4.
Water and F 2.46 million Six WWT facilities would be constructed in four identified WWT locations, each with a 615,000 Wastewater sq. ft. sq. ft. (14.1 acre) footprint, one for each fab and biological treatment (BIO) facility (see below), Treatment and would ensure that incoming water meets Micron’s high-purity specifications for (WWT) manufacturing, provide treatment for on-site reuse, and ensure that outgoing wastewater meets Facilities (6) quality requirements for treatment at the wastewater treatment and renewal facility. Bulk Gas Yards G 1.88 million Four bulk gas yards, each with an approximately 455,000 sq. ft. (10.5 acre) footprint, 170 ft. tall (4) sq. ft. columns, and cold box units, would be constructed north of the fab buildings. The gas yards would be used to isolate oxygen, argon, and nitrogen from the ambient air for use in the fabrication process, which is more efficient than trucking in gases. Industrial H 216,554 An on-site industrial wastewater facility and pump station would provide an alternative collection Pretreatment sq. ft. area for incoming treated and reclaimed water from the OCDWEP IWWTP that does not meet Wastewater specifications or if outgoing water chemistry or volume exceeds Micron’s standards for delivery to Facility (1) the IWWTP.
Biological I 731,808 Four BIO facilities, each with a 182,952 sq. ft. (4.2 acre) footprint, would remove dissolved Wastewater sq. ft. organic contaminants and nutrients from wastewater prior to sending the wastewater to the Treatment IWWTP.
Facility (4) Backflow J 15,000 Two 7,500 sq. ft. backflow prevention buildings would ensure that site water could not flow back Prevention sq. ft. into the OCWA water mains. One would be located at the southwest corner where the water mains Building (2) enter the site near the intersection of NYS Route 31 and Caughdenoy Road, supporting Fabs 1 and 2, and the second would be located on the southeast corner to support Fabs 3 and 4.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Surface Parking K 1.36 million 11,600 parking spaces, 19 four bus stops, and seven access roads would be constructed on the (4), sq. ft. campus, including four 500-space surface parking lots south of the administration and probe Structured buildings and four 2,400-space structured parking areas (indicated with a diagonal hatch on Figure Parking (4), and 2.1-5), totaling 8.19 million sq. ft. (188 acres) of new impervious area associated with paved Access Roads surface parking and site access roadways. (7) Three of the access roads would enter the campus from Caughdenoy Road near the Rail Spur Site, three from NYS Route 31, and one from U.S. Route 11 on the east side of the campus, traversing land area within the Town of Cicero. As the construction phases progress from west to east and fab operations begin, the use of the access roads would shift from construction to permanent employee access. Micron would implement site traffic plans to ensure safety during construction phases of the campus build-out. Rooftop Solar N/A N/A Micron would install approximately 4 megawatt (MW) of solar panels on the roofs of the parking Energy garages, WWT buildings, and BIO buildings. Stormwater SMP (#) 2.9 million sq. Stormwater management practice (SMP) areas would be constructed throughout the campus to Management ft. detain and treat stormwater runoff from its approximately 645 acres of newly created impervious Practice Areas surfaces. SMPs would include wet extended detention ponds (SMPs 01, 03, 11, 12, 13, 14, 15, and (15) 17 in Figure 2.1-5) and filtration bioretention (SMPs 02, 05, 07, 08, 09, 10, and 16). 20 The SMPs would be built in phases along with the campus construction phases and would be sized according to hydrologic and hydraulic modeling conducted for the site. Source: Micron Technology (n.d.).
19 The number of parking spaces would accommodate an anticipated workforce of approximately 9,005 employees, contractors, and temporary workers, along with snow storage, events, and visitor needs. For additional information on the Micron Campus parking space needs, see Appendix B-4. 20 SMP 04 and SMP 06 were never assigned and are therefore intentionally omitted from Figure 2.1-5.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
As shown in Figure 2.1-6 on the next page, construction of the Micron Campus would require approximately 4,200 construction workers on-site daily during peak construction periods lasting roughly six months for each fab, with the actual number of construction workers on-site fluctuating depending on the type of work being conducted.
Micron Campus operations would require at least 2,000 manufacturing employees for each fab, with the total number of manufacturing employees increasing sequentially as each fab comes online. Once Fab 1 becomes operational in 2029, there would be five manufacturing employee shifts, one working Monday through Friday from 8 a.m. to 5 p.m. and four shifts working overlapping 11.5-hour shifts to support the continuous 24-hour, seven day per week manufacturing operation. Fabs 2 through 4 would use the same shifts as they come online.
Information on the local labor market suggests that approximately 2,000 local workers may be available for each phase of the Micron Campus construction, which could help reduce the number of construction crews traveling to Clay, NY from other geographical locations. For additional information on construction employee considerations, see Section 3.15 (Socioeconomic Conditions) and Appendix Q.
Construction workers and manufacturing employees engaged in building the successive phases of the four-fab campus would be co-located at the campus until full build-out in 2041. Overall, the number of workers on-site would continually increase until construction and internal outfitting of Fab 4 is complete, at which point the on-site construction workforce would be reduced to a continuous nominal presence required for implementation of each new memory chip production technology node.
The headcount on the Micron Campus would peak in 2041 (12,436 employees and workers) as construction of Fab 4 is completed. During 2042, when Fab 4 would be outfitted internally for full production, the headcount would remain elevated. From 2043 to 2045, as the campus ramps up to full production, the operational workforce would increase while the construction workforce would decrease.
At full production in 2045, the operational headcount of the Micron Campus, including manufacturing, business, and administrative employees, would be 9,005 employees, with a nominal remaining presence of approximately 300 construction workers.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-6 Proposed Project On-Site Construction, Operation, and Total Headcount (2025-2045) Source: Micron Technology (n.d.). Note: Although Fab 4 construction would end in Q3 2041, Fabs 3 and 4 would not ramp up to full production until 2045.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
The Rail Spur Site is a component of the Proposed Project. Micron proposes to construct a rail spur and construction material conveyance facility on approximately 38 acres west of 8625 Caughdenoy Road, Clay, NY to economically transport fill and other aggregate construction material to the Micron Campus by rail.
Due to existing soil conditions at the WPCP that would be unsuitable for large building construction, as part of the construction process for the Micron Campus, Micron would need to excavate and remove 1.5 million cubic yards (CY) of soil from the WPCP and import 9 million CY of fill or other aggregate construction material to the site in order to provide sufficient clean and stable soils on which to construct the Micron Campus facility foundations. For a detailed explanation of this process, see Section 3.2 (Geology, Soils, and Topography).
Micron therefore proposes to build the Rail Spur Site as part of the Proposed Project to facilitate a more efficient construction timeline, minimize the need to rely on transportation of construction material by truck over the Proposed Project’s 16-year construction period, and avoid or minimize the environmental effects such truck transportation would cause, particularly effects relating to increased transportation emissions, noise, and traffic congestion.
For the proposed Rail Spur Site location, Micron has purchased two contiguous parcels of land adjacent to the western side of the WPCP between the CSX Railroad line and Caughdenoy Road (Town of Clay tax parcels 046.-02-03.2 and 046.-01-19.1).
Construction of the proposed Rail Spur Site would start in Q4 2025 and take approximately seven months, concluding in Q2 2026 with operations also starting in Q2 2026. Construction would require approximately 22 acres of tree clearing, approximately 24 acres of ground disturbance, the excavation and removal of 85,000 CY of soil, the import of 150,000 CY of fill, the laying of 4.3 acres of impervious surface, and the construction of approximately 7,300 sq. ft. of new building space. Micron would re-use excavated soil and fill material in construction of the site, and transport unusable or excess material for off-site reuse, to the greatest extent practicable, subject to relevant approvals and disposal site capacity.
All construction staging and activity would be contained within the Rail Spur Site property boundaries except for those elements of the conveyance system that would extend east across Caughdenoy Road onto the Micron Campus. Site clearing and associated construction activities would not commence until Micron has obtained all applicable permits and approvals. Construction activities on the Rail Spur Site would be limited to between 6 a.m. to 10 p.m. daily. 21 21 Applicable Town of Clay requirements currently do not authorize construction activities during these extended times. Micron is in discussions with the Town of Clay to either modify or obtain a variance from the applicable requirements to facilitate timely construction of the Proposed Project as presented in this EIS and will comply with all applicable noise ordinances. See Section 3.12 (Noise and Vibration) for more information.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
The Rail Spur Site would be operated by an independent contractor pursuant to an agreement with Micron. Construction material for the Micron Campus would be sourced off-site and arrive at the Rail Spur Site by rail car on the CSX Railroad line. Rail cars would be anticipated to transport up to 1,500 short tons per hour of aggregate materials to the site for off-loading of material from the rail cars onto an aggregate conveyance system comprised of belt conveyors designed to move material up and over Caughdenoy Road onto the Micron Campus.
Each day, one set of 60 rail cars would be off-loaded at the Rail Spur Site, while another set of 60 rail cars returns to the aggregate supply sources, and a third set of 60 rail cars is in transport from the sources to the Rail Spur Site. This rotating activity would occur until aggregate material is no longer required for a particular construction phase.
The Rail Spur Site would operate daily from 6 a.m. to 10 p.m. for receiving arriving and departing rail cars, and off-loading aggregate material from the rail cars onto the conveyor system. Off-loading would continue until aggregate is no longer required for a particular construction phase. The independent contractor would operate two rail off-loaders in rotation to off-load a set of 60 rail cars in a 16-hour period each day, during the 6 a.m. to 10 p.m. daily window. The rail spur and conveyance system would remain active during each of the four fab construction phases (i.e., from Q4 2025 to Q2 2028, Q3 2028 to Q4 2030, Q3 2033 to Q4 2035, and Q2 2039 to Q3 2041). As construction of each phase of the Micron Campus transitions from the site preparation and foundation stage to the structural stage, mobile elements of the aggregate conveyance system would either be removed or would remain in place unused, until construction of the next phase of the Micron Campus commences.
During the structural stage of construction for each fab, the rail spur would continue to be used to bring off-site manufactured construction materials to the Micron Campus, such as pre-cast concrete and facades. These materials would be trucked a short distance from the Rail Spur Site to the Micron Campus and the Childcare Site. Once a fab becomes operational, the rail spur may also be used to bring in equipment and non-hazardous materials required for semiconductor manufacturing. The Rail Spur Site would not be used to transport any hazardous materials for use in Micron Campus operations.
The Rail Spur Site would include the following components: rail siding, rail yards, and an off-loading track and facility; the aggregate materials conveyance system; an office building and trailer; a locomotive shed; paved access roads and a parking area; paved storage areas; a backup stockpile area; a stormwater management area; and lighting. Figure 2.1-7 on the next page provides a site plan, and Table 2.1-4 provides additional detail on the components.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-7 Rail Spur and Aggregate Materials Conveyance System Plan Source: Ramboll Americas Engineering Solutions, Inc. (Ramboll; 2025a)
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Table 2.1-4 Rail Spur Site Components Component Description Rail Siding, Rail A rail siding track would be located east of and parallel to the CSX Railway Yards, and Off- mainline with a 70-rail car storage capacity, two railyards (A and B) with a loading Track and combined storage capacity for 165 additional rail cars, and an off-loading Facility track and facility with storage capacity for 15 additional rail cars. The Rail Spur Site would require this total 250-rail car storage capacity to facilitate the required daily off-loading rate for the Micron Campus construction schedule. Two rail off-loaders would run in series capable of off-loading construction material from 60 rail cars in a 16-hour period each day, from 6 a.m. to 10 p.m. Each day, one set of 60 rail cars would be off-loaded at the Rail Spur Site, while another set of 60 rail cars returns to the aggregate supply sources, and a third set of 60 rail cars is in transport from the sources to the Rail Spur Site. Rail transport and receiving activity at the Rail Spur Site would be limited to 6 a.m. to 10 p.m. daily. This rotating activity would occur until aggregate is no longer required for a particular construction phase. Aggregate Materials An aggregate materials conveyance system would be constructed on-site Conveyance System capable of transporting up to 1,500 short tons per hour of aggregate materials from the Rail Spur Site over Caughdenoy Road onto the Micron Campus. The two-pronged system would be comprised of 23 belt conveyors, the majority of which would be modular and could be re-positioned as necessary. The central component of the system would be a 42-inch wide, 825-foot-long stationary conveyor with side guards to convey materials up and over Caughdenoy Road with an 18-foot clearance. The conveyor would be used solely for the construction phases on the Micron Campus.
The conveyor would require concrete foundations for the head and tail sections supporting the 100-foot-long clear-span section crossing over the roadway. The modular conveyor segments on the land on either side of Caughdenoy Road would be built on 12 inches of crushed stone on top of geogrid. The central stationary conveyor would feed a telescoping radial conveyor that would discharge aggregate materials onto the Micron Campus. A smaller conveyance system would serve the backup stockpile area (described below). All conveyors would meet mine duty specifications. To reduce noise, rubber disk return rollers and urethane or rubber liners would be used in high impact areas. To reduce dust at transfer points, head chutes would be installed, and coverings would be used at loading zones and over Caughdenoy Road.
Office Building and A detached temporary double-wide trailer would be located on-site to oversee Trailer operations while a permanent 2,300 sq. ft. office building is constructed. The trailer would be removed after construction of the office building is complete. Locomotive Shed A 5,000 sq. ft. locomotive shed would be located at the southern end of the rail yard. The shed would be used for maintenance of the rail cars as necessary. The shed would not include any sewer drains; all fluids generated on-site would be captured in a sump and hauled off-site when disposal becomes necessary.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Paved Access Roads An access driveway would extend west from Caughdenoy Road to the office and Parking Areas building and a 30-space surface parking lot. Internal access roads would run from along the eastern edge of the rail yard and off-loading track to the locomotive shed.
Paved Storage Area A 20,000 sq. ft. non-aggregate materials storage area would be located immediately east of the locomotive shed. This area would be used to temporarily store prefabricated concrete components that would be delivered by rail before being transported to their final installation locations. The size of the area was determined based on the estimated number and size of precast pieces needed per day.
Backup Stockpile A 75,000-CY stockpile area allowing for rail car off-loading activities would Area be maintained in the event of an unexpected equipment failure with the main conveyance system. Aggregate material would be loaded onto the backup stockpile access road and gravel staging area along the northeast portion of the Rail Spur Site boundary, then trucked a short distance across Caughdenoy Road to the Micron Campus until main conveyance system operations are re- established.
Stormwater Micron would provide stormwater management on the Rail Spur Site. Site Management Area plans currently propose stormwater management facilities, including two stormwater management areas, which would be designed in accordance with the sizing criteria outlined in the 2024 NYS Stormwater Design Manual. Approval and sizing of these areas is subject to NYSDEC and Town of Clay review.
Source: Micron Technology (n.d.).
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
The Childcare Site is a component of the Proposed Project. Micron proposes to construct a childcare center, healthcare center, and recreation center, along with associated workforce amenities and site infrastructure, on an approximately 31-acre parcel three quarters of a mile northwest of the proposed Micron Campus, at 9100 Caughdenoy Road, Brewerton, NY (Town of Clay tax parcel 042-01-13.0). The Childcare Site would serve the childcare, healthcare, and recreational needs of the anticipated 9,300-member labor force that would commute to and from the Micron Campus at its full operational capacity in 2045.
Construction of the childcare center would start in early Q3 2026 and conclude in 2028, before Fab 1 operations would begin in Q1 2029. Construction of the healthcare and recreation centers would occur later, from Q2 2030 to Q2 2031, and would plan to open in Q2 2031 when the employee base at the Micron Campus would grow large enough to support the need for those facilities. All construction staging and activity would be contained within the Childcare Site property boundaries. Site clearing and associated construction activities would not commence until Micron has obtained all applicable permits and approvals.
Construction of the Childcare Site would occur on predominantly vacant land but would require the removal a vacant former residence and associated barn foundation at the site’s southernmost boundary once all relevant approvals are obtained, followed by construction over time as noted above of the childcare, healthcare, and recreation centers, as well as an athletic field, a sewage disposal system, and 208 surface parking spaces.
Site development would require a total area of disturbance of 13 acres with no tree clearing, excavation and removal of 50,000 CY of soil and import of 25,000 CY of fill, and construction of 2.6 acres of impervious surface, which would include 40,000 sq. ft. (0.9 acres) of new buildings and parking spaces. To comply with Town of Clay zoning regulations, all proposed structures would be less than 50 feet in height and all required setbacks would be met. Each building would be equipped with its own septic tank and pump station, with sanitary wastewater directed via piping to a sewage disposal system and leaching field.
In addition to the childcare, healthcare, and recreation centers, the Childcare Site would include a soccer field, a tennis/pickleball court, the sewage disposal system and leaching field, stormwater management areas, a pedestrian walkway and bridge, and lighting. Figure 2.1-8 on the next page provides a site plan, and Table 2.1-5 following the figure provides additional detail on the site components.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-8 Childcare Site Source: Ramboll Americas Engineering Solutions, Inc (Ramboll, 2025b).
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Table 2.1-5 Childcare Site Components Component Description Childcare The childcare center would include a 25,000 sq. ft. (0.6 acre) structure and a 64,120 Center sq. ft. (1.5 acre) parking lot, entrance drive and bridge spanning a linear wetland, 22 and sidewalk, with 80 paved parking spaces (60 long-term parking spaces and 20 drop-off / pick-up spaces) and an access drive shared with the recreation center, entering from Caughdenoy Road. 23 Healthcare The healthcare center would include a 10,000 sq. ft. (0.2 acre) structure and a 21,630 Center sq. ft. parking lot, entrance drive, and sidewalk, with 60 paved parking spaces and a dedicated access drive from Caughdenoy Road.
Recreation The recreation center would include a 5,000 sq. ft. (0.1 acre) structure and a 23,660 Center sq. ft. parking lot, entrance drive, and sidewalk, with 68 paved parking spaces and would share the childcare center’s access drive.
Playground A 15,000 sq. ft. playground would be located behind the childcare center. Soccer Field An 86,400 sq. ft. (2 acre) soccer field would be located north of the recreation center. Tennis / A 3,200 sq. ft. tennis / pickleball court would be located north of the recreation Pickleball center.
Court Sewage Leach A 41,100 sq. ft. (0.9 acre) sewage disposal system (a leach field) would be located at Field the rear of the parcel north of the soccer field.
Stormwater Based on sizing criteria contained in the 2024 NYS Stormwater Design manual, site Management plans currently propose approximately 55,380 sq. ft. (1.3 acres) of stormwater Areas management facilities, including four bioretention areas and a wet pond, but approval and sizing of these areas is subject to NYSDEC and Town of Clay review. Pedestrian A 500-sq. ft. access walkway would extend from the healthcare center and associated Walkway and parking spaces to the recreational fields and would include a bridge spanning a linear Bridge wetland.
Lighting For safety, exterior illumination would include 70 lights, including 27-foot-tall, downward directional warm white LED lights along internal roads, parking areas, and around buildings, and 80-foot-tall stadium-style cool white LED lights bordering the soccer field and tennis courts.
Future Approximately 10,000 sq. ft. of undeveloped land in the rear yard of the childcare Expansion center adjacent to the playground would be set aside for potential future expansion Area needs.
Source: Micron Technology (n.d.).
22 The bridge would be designed and constructed in accordance with NYSDEC specifications to avoid impacts to wetlands.
23 The childcare center would require removal of a small amount of non-jurisdictional wetlands.
MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT
The Warehouse Site is a component of the Proposed Project. Micron proposes to lease 360,000-560,000 sq. ft. (8 to 11 acres) of existing off-site warehouse space in an industrially zoned area at a to-be-determined location within 20 miles of the Micron Campus. Micron would directly lease the warehouse space or would subcontract with a third-party logistics company to lease the space and manage warehousing operations. The warehouse space would have a minimum interior clearance height of 32 feet to support optimal vertical stacking for storage. The purpose of the Warehouse Site would be to store manufacturing equipment and materials, including spare equipment such as robots, hardware consumables, electronics parts, and components related to Extreme Ultraviolet Lithography (EUV) and other process tools. Materials stored may include Chemical Mechanical Planarization (CMP) pads and raw silicon wafers. No hazardous materials would be stored within the warehouse space. Micron anticipates leasing the warehouse space for a 7-10-year term beginning in April 2026.
Certain electrical infrastructure improvements are Connected Actions. National Grid is a natural gas and electric transmission and distribution company that provides service to Clay, NY. National Grid owns the Clay Substation located to the northwest of the WPCP across the CSX Railroad line and the electric transmission line and ROW that runs to the north of the WPCP. To supply the estimated electricity needs of the Micron Campus, National Grid proposes to undertake phased construction based on interconnection approval from NYISO. The electricity improvements that would be required for the proposed Micron Campus are subject to approval under a separate, ongoing regulatory proceeding before the NYSPSC relating to the 345kV electric transmission lines. 24
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