clayny.news

AI for transparency
Clay, New York · Monday, September 21, 2026· Sep 21, 2026
Public Records › Micron environmental record › Final EIS

FEIS-Roadmap48

PDF · 899 words · collected 2026-08-07 Official copy↗ Archived PDF Plain text

Typeset from the PDF of the official document (read by OCR) — headings, motions and recorded votes are detected automatically, so spacing may differ from the original. The official copy governs.

Contents · 15 sections
  1. Appendix E, Vol. 2 Part 1
  2. Appendix E, Vol. 2 Part 2
  3. Appendix E, Vol. 3 Part 1
  4. Appendix E, Vol. 3 Part 2
  5. Appendix E, Vol. 3 Part 3
  6. Appendix F, Vol. 1 Part 2
  7. Appendix F, Vol. 2
  8. Appendix F, Vol. 3
  9. Appendix G, Vol. 2
  10. Appendix K, Vol. 2
  11. Appendix M, Vol. 1
  12. Appendix M, Vol. 2
  13. Appendix M, Vol. 3
  14. Appendix M, Vol. 4
  15. Appendix M, Vol. 5

MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Final EIS Topic/Resource Area Appendix

Chapter

ES EXECUTIVE SUMMARY

Appendix A

1.0 INTRODUCTION

A-1: CPO Purpose and Need Factors A-2: Final SEQRA Scope A-3: Summary of NEPA Scoping Comments A-4: Notices A-5: Response to Comments A-6: Comment Matrix and Comments Received

2.0 PROPOSED ACTION AND Appendix B

ALTERNATIVES B-1: Micron Campus Site Selection Background B-2: Construction Phases, and Site B-3: Layout Alternatives B-4: Micron Campus Parking Space Needs B-5: Revised Proposed Project Construction Schedule Details and Impact Analysis Review B-6: Revised Traffic Modeling Technical Memorandum

3.0 ENVIRONMENTAL ANALYSIS Appendix C

C-1: Growth Inducing Effects C-2: REMI Study

3.1 LAND USE, ZONING, AND Appendix D

PUBLIC POLICY D-1: Land Use, Zoning, and Public Policy Methodology D-2: Zoning Regulations D-3: Public Policies D-4: NRCS FPPA Review Documents 1 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Final EIS Topic/Resource Area Appendix

Chapter

3.2 GEOLOGY, SOILS, AND Appendix E, Vol. 1 TOPOGRAPHY E-1: Geology, Soils, And Topography Methodology E-2: Soil Type Descriptions E-3: Topographical Figures E-4: Geotechnical Reports (part 1)

Appendix E, Vol. 2 Part 1

E-4 (cont.): Geotechnical Reports

Appendix E, Vol. 2 Part 2

E-4 (cont.): Geotechnical Engineering Report

Appendix E, Vol. 3 Part 1

E-4 (cont.): Geotechnical Engineering Report

Appendix E, Vol. 3 Part 2

E-4 (cont.): Geotechnical Engineering Report

Appendix E, Vol. 3 Part 3

E-4 (cont.): Geotechnical Engineering Report E-5: Blasting Plan 3.3 WATER RESOURCES Appendix F, Vol. 1 Part 1 F-1: Water Resources Study Area F-2: Legal and Regulatory Setting F-3: Supplemental Information: Affected Environment F-4: Supplemental Information: Environmental Consequences F-5: Water Resources Figures F-6: Jurisdictional Determination F-7: Compensatory Mitigation Plan

Appendix F, Vol. 1 Part 2

F-7 (cont.): Buxton Creek Mitigation Plan

Appendix F, Vol. 2

F-7 (cont.):

2 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Final EIS Topic/Resource Area Appendix

Chapter

Fish Creek Mitigation Plan Upper Caughdenoy Creek Mitigation Plan Lower Caughdenoy Creek Mitigation Plan

Appendix F, Vol. 3

F-7 (cont.):

Oneida River Mitigation Plan Sixmile Creek Mitigation Plan F-8: Draft SWPPP 3.4 BIOLOGICAL RESOURCES Appendix G, Vol. 1 G-1: Biological Resources Methodology G-2: Legal and Regulatory Setting G-3: Supplemental Information: Affected Environment G-4: Draft Biological Assessment G-5: Grassland Breeding Bird Survey

Appendix G, Vol. 2

G-6: Youngs Creek Surveys G-7: USFWS IPaC System Results G-8: NYSDEC EAF Mapper Results G-9: Draft Invasive Species Management Plan G-10: Preliminary Landscape Drawings

3.5 HISTORIC AND CULTURAL Appendix H

RESOURCES H-1: Area of Potential Effect (APE) Figures H-2: NHPA Section 106 Process Summary for the Preferred Action Alternative

3.6 AIR QUALITY Appendix I

I-1: Stationary Source Modeling Executive Summary: Micron Campus 4- Fab Scenario I-2: Mobile Source Methodology I-3: CO & PM Screening Spreadsheets 3 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Final EIS Topic/Resource Area Appendix

Chapter

3.7 GREENHOUSE GAS Appendix J

EMISSIONS, CLIMATE

J-1: Air Application 2 GHG BACT

CHANGE, AND CLIMATE

Analysis

RESILIENCY

J-2: CLCPA Analysis 3.8 SOLID WASTE, HAZARDOUS Appendix K, Vol. 1 WASTE, AND HAZARDOUS K-1: Solid Waste, Hazardous Waste, and MATERIALS Hazardous Materials Methodology K-2: Solid Waste Transfer Stations and Disposal Facilities K-3: Phase I ESA – Main Campus West K-4: Phase I ESA – Main Campus East, Rail Spur Site, and Childcare Site

Appendix K, Vol. 2

K-5: Phase I ESA – Rail Spur Addition K-6: Supplemental Information Environmental Consequences K-7: Draft Soil Materials Management Plan K-8: Micron Construction Waste Management Plan K-9: Micron Hazardous Waste Contingency Plan (Outline) K-10: OCRRA Waste Capacity Availability K-11:2024 Micron Technology, Inc. Sustainability Report K-12: Example Micron Procedures

3.9 HUMAN HEALTH AND Appendix L

SAFETY L-1: Use, Management, and Disposal of Per- and Polyfluoroalkyl Substances at the Micron New York Semiconductor Fabrication Facilities L-2: Relevant OSHA Standards L-3: Micron Emergency Response Management System L-4: Micron Global EHS Construction Performance Standard

3.10 UTILITIES AND SUPPORTING

INFRASTRUCTURE

4 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Final EIS Topic/Resource Area Appendix

Chapter

Appendix M, Vol. 1

Traffic Impact Study

Appendix M, Vol. 2

Traffic Impact Study (cont.) Traffic Impact Study Year 2041 Traffic Operations Summary and Recommendations References

Appendix M, Vol. 3

Traffic Impact Study Appendices TRANSPORTATION AND A. Data and Referenced Documents

3.11

TRAFFIC B. Calibration C. Crash Data D. Model Output

Appendix M, Vol. 4

Traffic Impact Study Appendices (cont.) Referenced Planned Road Improvement Plans Referenced SMTC Models Referenced Studies

Appendix M, Vol. 5

Traffic Impact Study Appendices (cont.) B. Calibration C. Crash Data D. Model Output

Appendix N

N-1: Noise and Vibration Methodology

3.12 NOISE AND VIBRATION N-2: Noise Measurement Data

N-3: Detailed Predicted Constructed and Vibration Impacts N-4: Detailed Traffic Noise Model Results N-5: Traffic Model Receptor Locations

3.13 VISUAL EFFECTS AND Appendix O

COMMUNITY CHARACTER O-1: Visual Effects and Community Character Methodology O-2: Supplemental Information: Affected Environment O-3: Site Visit Viewpoint Photographs

3.14 COMMUNITY FACILITIES, Appendix P

OPEN SPACE, AND P-1: Community Facilities, Open Space, RECREATION and Recreation Methodology P-2: Healthcare Facilities P-3: School Growth Projections 5 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINAL ENVIRONMENTAL IMPACT STATEMENT Final EIS Topic/Resource Area Appendix

Chapter

3.15 SOCIOECONOMIC Appendix Q

CONDITIONS Q-1: Socioeconomic Conditions Assessment Methodology Q-2: Supplemental Information: Affected Environment Q-3: Supplemental Information: Environmental Consequences

3.16 ENVIRONMENTAL JUSTICE Appendix R

R-1: Supplemental Methodology R-2: Summary of Public Outreach

5.0 OTHER CONSIDERATIONS

REQUIRED BY SEQRA

 UNAVOIDABLE

SIGNIFICANT ADVERSE

IMPACTS

 IRREVERSIBLE OR

IRRETRIEVABLE

COMMITMENTS OF

ENVIRONMENTAL

RESOURCES

6.0 REFERENCES

8.0 DISTRIBUTION LIST

6

Same source 2025_1105_MicronNY FEIS Final · 2025-11-25
Same source 2025_1105_MicronNY FEIS Appendix A-D · 2025-11-25
Same source 2025_1105_MicronNY FEIS Appendix E Vol_1 · 2025-11-25