2025_1105_MicronNY FEIS Final Redline

Micron Semiconductor Manufacturing Project, Clay, NY FinalDraft Environmental Impact Statement EISX-006-55-CPO-001 | June, 2025 U.S. Department of Commerce, CHIPS Program Office Onondaga County Industrial Development Agency U.S. Army Corps of Engineers U.S. Environmental Protection Agency MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT

FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT FOR MICRON

SEMICONDUCTOR MANUFACTURING FACILITY

FinalDraft Environmental Impact Statement Designation:

EISX-006-55-CPO-001

Title of Proposed Action: FinalDraft Environmental Impact Statement (EIS) for the Micron Semiconductor Manufacturing Facility Project Location: Town of Clay, Onondaga and Oswego Counties, New York Joint Lead Agencies: U.S. Department of Commerce and Onondaga County Industrial Development Agency (OCIDA) NEPA Cooperating Agencies: U.S. Army Corps of Engineers (USACE), and U.S. Environmental Protection Agency (USEPA) NEPA Participating Agencies: U.S. Fish and Wildlife Service (USFWS),) and U.S. Department of Transportation (USDOT), and , Federal Highway Administration (FHWA) NEPA Participating Entity: Onondaga Nation SEQRA Involved Agencies: New York State Department of Environmental Conservation (NYSDEC), Empire State Development, including the New York State Department of Economic Development and the New York State Urban Development Corporation (ESD), New York Department of State (NYSDOS), New York State Department of Transportation (NYSDOT), New York State Office of Parks, Recreation and Historic Preservation (OPRHP), New York State Office of General Services (NYSOGS), New York Power Authority (NYPA), New York State Canal Corporation, Onondaga County Department of Transportation (OCDOT), Onondaga County Water Authority (OCWA), Onondaga County Department of Water Environment Protection (OCDWEP), Town of Clay Town Board, Town of Clay ZoningPlanning Board, Town of Clay

Planning Board, and Town of Cicero Planning Board

Affected Regions: Onondaga, Oswego, Cayuga, Madison, Oneida, and Seneca Counties, New York, and the territories of the Onondaga Nation and the Haudenosaunee Confederacy Further Information: NEPA: National Institute of Standards and Technology, Creating Helpful Incentives to Produce Semiconductors (CHIPs) Program Office (CHIPSNEPA@chips.gov) SEQRA: Robert Petrovich, Executive Director; Onondaga County Industrial Development Agency, 335 Montgomery Street, Floor 2M, Syracuse, NY 13202 (Micron@ongov.net) Public Comment Period Close August 11, 2025 Date:

i MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT

TABLE OF CONTENTS

0.0 Executive Summary .............................................................................................. 0-0 0.1 Overview ....................................................................................................... 0-0 0.2 Proposed Project and Connected Actions .................................................... 0-20-1 0.3 Alternatives .................................................................................................... 0-5 0.4 Environmental Analysis .................................................................................. 0-6 0.5 Cumulative Effects ................................................................................ 0-160-15 0.6 Unavoidable Significant Adverse Effects ...................................................... 0-16 0.7 Irreversible or Irretrievable Commitments of Environmental Resources .. 0-180-17 1.0 Introduction .......................................................................................................... 1-1 1.1 Purpose and Need ...................................................................................... 1-61-5 1.2 Preparation of the EIS ........................................................................... 1-131-11 1.3 Public Review and Comment ................................................................. 1-171-15 1.4 Permits, Approvals, and Consultations ................................................... 1-181-16 2.0 Proposed Action and Alternatives ........................................................................ 2-1 2.1 Proposed Project and Connected Actions ......................................................... 2-1 2.2 Alternatives ........................................................................................... 2-452-43 3.0 Environmental Analysis........................................................................................ 3-1 3.1 Land Use, Zoning, and Public Policy .............................................................. 3-2 3.2 Geology, Soils, and Topography ............................................................ 3-373-35 3.3 Water Resources .................................................................................... 3-623-56 3.4 Biological Resources ............................................................................3-1153-95 3.5 Historic and Cultural Resources .......................................................... 3-1603-137 3.6 Air Quality ......................................................................................... 3-1803-147 3.7 Greenhouse Gas Emissions, Climate Change, and Climate Resiliency .. 3-2183-183 3.8 Solid Waste, Hazardous Waste, and Hazardous Materials .................... 3-2553-216 3.9 Human Health and Safety ................................................................... 3-2913-251 3.10 Utilities and Supporting Infrastructure ................................................ 3-3023-262 3.11 Transportation and Traffic .................................................................. 3-3263-282 3.12 Noise and Vibration ............................................................................ 3-3973-346 3.13 Visual Effects and Community Character ............................................ 3-4613-404 3.14 Community Facilities, Open Space, and Recreation ............................. 3-5003-443 3.15 Socioeconomic Conditions .................................................................. 3-5223-465 3.16 Environmental Justice ......................................................................... 3-5613-504 3.17 Summary of Effects ............................................................................ 3-5883-531 4.0 Cumulative Effects ............................................................................................... 4-1 4.1 Definition of Cumulative Effects .................................................................... 4-1 4.2 Scope of Cumulative Effects Analysis ............................................................. 4-1 4.3 Cumulative Effects Analysis ......................................................................... 4-12 5.0 Other Considerations Required by SEQRA ......................................................... 5-1 5.1 Unavoidable Significant Adverse Effects ........................................................ 5-1 5.2 Irreversible or Irretrievable Commitments of Environmental Resources ........... 5-3 6.0 References ............................................................................................................. 6-1 7.0 List of Preparers ................................................................................................... 7-1 7.1 NEPA Lead Agency - U.S. Department of Commerce ...................................... 7-1 7.2 SEQRA Lead Agency – Onondaga County Industrial Development Agency ..... 7-2 7.3 Third-Party NEPA Contractors ....................................................................... 7-2 7.4 Project Proponent – Micron Technology, Inc. .................................................. 7-9 ii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT 8.0 Distribution List ................................................................................................... 8-1 8.1 Federal Agencies ............................................................................................ 8-1 8.2 Indigenous Nations ......................................................................................... 8-1 8.3 SEQRA Involved Agencies ............................................................................. 8-2 8.4 SEQRA Interested Agencies ........................................................................... 8-4 iii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT

LIST OF FIGURES

Figure 1.0-1 Proposed Project Location Map ............................................................................................ 1-3 Figure 1.1-1 Micron Technology Proposal to Increase U.S. DRAM Production .................................1-91-8 Figure 1.1-2 Proposed Project and Competitor Campus Cleanroom Space ..................................... 1-111-10 Figure 2.1-1 Proposed Project and Connected Actions .............................................................................. 2-2 Figure 2.1-2 Proposed Micron Campus Boundary ...............................................................................2-22-3 Figure 2.1-3 Proposed Project and Connected Actions Construction Timeline ....................................2-22-4 Figure 2.1-4 Micron Campus Visual Rendering ...................................................................................2-72-8 Figure 2.1-5 Micron Campus Site Plan............................................................................................. 2-102-11 Figure 2.1-6 Proposed Project On-Site Construction, Operation, and Total Headcount (2025- 2045) .................................................................................................................................................2-152-16 Figure 2.1-7 Rail Spur and Aggregate Materials Conveyance System Plan .....................................2-182-19 Figure 2.1-8 Childcare Site ...............................................................................................................2-222-23 Figure 2.1-9 Electricity Improvements ............................................................................................. 2-262-26 Figure 2.1-10 Proposed Natural Gas Line and Clay Substation Expansion......................................2-282-28 Figure 2.1-11 Proposed Water Supply Improvements ......................................................................2-302-30 Figure 2.1-12 Proposed Raw Water Pump Station Upgrades ...........................................................2-332-33 Figure 2.1-13 Proposed LOWTP Upgrades and Transmission Mains ..............................................2-342-34 Figure 2.1-14 Proposed Terminal Campus and Eastern Branch Upgrades .......................................2-352-35 Figure 2.1-15 Proposed Eastern Branch Connection to Micron Campus .........................................2-362-36 Figure 2.1-16 Proposed OWWTP Expansion and New IWWTP .....................................................2-392-39 Figure 2.1-17 Proposed Industrial Wastewater and Reclaimed Water Conveyance .........................2-432-41 Figure 2.2-1 Reduced Scale Alternative Layout ...............................................................................2-472-45 Figure 2.2-2 U.S. Route 11 Access Elimination Layout ...................................................................2-492-47 Figure 3.1-1 Existing Land Uses in Land Use Study Area ........................................................................ 3-4 Figure 3.1-2 Other Announced or Planned Projects in Land Use Study Area ........................................... 3-5 Figure 3.1-3 Farmland Classes within Land Use Study Area .................................................................. 3-12 Figure 3.1-4 Farmland Classes at Proposed Project and Connected Action Locations ........................... 3-13 Figure 3.1-5 Farmland Classes at Oak Orchard Site and OCWA Terminal Campus ........................3-153-14 Figure 3.1-6 Farmland Classes at OCWA Lake Ontario Water Treatment Plant .............................. 3-163-15 Figure 3.1-7 Agricultural Districts within Land Use Study Area......................................................3-173-16 Figure 3.1-8 Agricultural Districts at Oak Orchard Site and OCWA Terminal Campus ...................3-193-17 Figure 3.1-9 Agricultural Districts at OCWA Lake Ontario Water Treatment Plant .........................3-203-18 Figure 3.1-10 Current Zoning in Land Use Study Area ....................................................................3-223-20 Figure 3.1-11 Land Use Changes Due to the Proposed Project ........................................................3-273-25 Figure 3.1-12 Zoning District Change on Micron Campus .............................................................. 3-313-29 Figure 3.2-1 Depth to Bedrock at Boring Locations .........................................................................3-403-38 Figure 3.2-2 Soils at Proposed Project Sites and Clay Substation Expansion Area..........................3-463-41 Figure 3.2-3 Soils at Oak Orchard Site and OCWA Terminal Campus ............................................3-473-42 Figure 3.2-4 Bedrock Removal Locations ........................................................................................3-553-49 Figure 3.4-1 Micron Campus Ecological Communities ................................................................. 3-1183-97 Figure 3.4-2 Rail Spur Site Ecological Communities ..................................................................... 3-1193-98 Figure 3.4-3 Childcare Site Ecological Communities.....................................................................3-1203-99 Figure 3.4-4 Effects on Ecological Communities at Micron Campus .......................................... 3-1373-116 Figure 3.5-1 Proposed Project Direct and Indirect APEs .............................................................. 3-1633-139 Figure 3.5-2 Direct and Indirect APE (OCWA LOWTP) .............................................................3-1653-140 Figure 3.5-3 Direct and Indirect APE (OCWA Terminal Campus) ...............................................3-1673-141 Figure 3.5-4 Direct and Indirect APE (IWWTP) ..........................................................................3-1693-142 Figure 3.6-1 Stationary and Regional (Mobile) Air Quality Study Area ......................................3-1883-154 Figure 3.7-1 Overview of GHG Emissions Scopes across Value Chain .......................................3-2233-188 iv MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Figure 3.7-2 Average Scope 1 (Direct) GHG Emissions 2014-2022 Semiconductor Industry (NAICS 334412) by Gas and Percentage of Total Emissions .......................................................3-2253-189 Figure 3.7-3 New York GHG Emissions by Economic Sector, 1990-2022, in MMT CO2e 1 .......3-2273-190 Figure 3.9-1 NIOSH Hierarchy of Controls..................................................................................3-2933-253 Figure 3.10-1 2023 Load Zone C Net Electricity Generation .......................................................3-3043-264 Figure 3.10-2 NYISO 2030 Base Case Large Load Projection (Fabs 1-2) ...................................3-3093-269 Figure 3.10-3 Planned Solar Panel Locations ...............................................................................3-3133-271 Figure 3.10-4 Micron Industrial Wastewater Reclamation Process ..............................................3-3213-278 Figure 3.10-5 Proposed Project Water Life Cycle ........................................................................3-3223-279 Figure 3.11-1 Study Area: Transportation Network ......................................................................3-3283-284 Figure 3.11-2 Roadway Characteristics ........................................................................................3-3323-288 Figure 3.11-3 Freeway LOS (Existing Conditions) ......................................................................3-3333-289 Figure 3.11-4 Intersection LOS (Existing Conditions) .................................................................3-3343-290 Figure 3.11-5 Bicycle and Pedestrian Facilities ............................................................................3-3363-292 Figure 3.11-6 Transit Routes .........................................................................................................3-3393-295 Figure 3.11-7 Freeway LOS (No Action Alternative in 2027) ......................................................3-3443-300 Figure 3.11-8 Intersection LOS (No Action Alternative in 2027) .................................................3-3453-301 Figure 3.11-9 Freeway LOS (No Action Alternative in 2031) ......................................................3-3463-302 Figure 3.11-10 Intersection LOS (No Action Alternative in 2031) ...............................................3-3473-303 Figure 3.11-11 Freeway LOS (No Action Alternative in 2041) ....................................................3-3483-304 Figure 3.11-12 Intersection LOS (No Action Alternative in 2041) ...............................................3-3493-305 Figure 3.11-13 Freeway LOS (Preferred Action Alternative in 2027) ..........................................3-3533-307 Figure 3.11-14 Intersection LOS (Preferred Action Alternative in 2027) .....................................3-3543-308 Figure 3.11-15 Freeway LOS (Preferred Action Alternative in 2031) ..........................................3-3593-312 Figure 3.11-16 Intersection LOS (Preferred Action Alternative in 2031 ......................................3-3603-313 Figure 3.11-17 Freeway LOS (Preferred Action Alternative in 2041) ..........................................3-3673-318 Figure 3.11-18 Intersection LOS (Preferred Action Alternative in 2041) .....................................3-3683-319 Figure 3.11-19 Freeway LOS (Preferred Action Alternative with recommended mitigations in 2031) .............................................................................................................................................3-3753-326 Figure 3.11-20 Intersection LOS (Preferred Action Alternative with recommended mitigations in 2031) .............................................................................................................................................3-3763-327 Figure 3.11-21 Freeway LOS (Preferred Action Alternative with Recommended Mitigation 2041) .3-3833- 332 Figure 3.11-22 Intersection LOS (Preferred Action Alternative with Recommended Mitigation 2041) .............................................................................................................................................3-3843-333 Figure 3.11-23 Recommended Mitigations...................................................................................3-3953-344 Figure 3.12-1 Typical Outdoor Noise Levels ................................................................................3-4013-350 Figure 3.12-2 Typical Levels of Ground-Bourne Vibration ..........................................................3-4023-351 Figure 3.12-3 Micron Campus and Rail Spur Construction Site Construction and Operations Study Area.....................................................................................................................................3-4083-357 Figure 3.12-4 Childcare Site -Construction and Operations Study Area and Traffic Noise Study Area ...............................................................................................................................................3-4093-358 Figure 3.12-5 Traffic Noise Study Area ........................................................................................3-4103-359 Figure 3.12-6 Noise Measurement Monitoring Locations ............................................................3-4153-364 Figure 3.12-7 Predicted Noise Effects from Construction of Micron Campus .............................3-4233-372 Figure 3.12-8 Predicted Noise Effects from Construction of the Rail Spur Site ..........................3-4253-374 Figure 3.12-9 Predicted Noise Effects from Operation of Micron Campus .................................3-4293-378 Figure 3.12-10 Sensitive Receptors Near Proposed National Grid Substation Expansion ...........3-4403-389 Figure 3.12-11 Sensitive Receptors Near Proposed GRS 147A ...................................................3-4433-391 Figure 3.12-12. Sensitive Receptors Near Proposed Improvements to Oak Orchard WWTP ......3-4473-393 Figure 3.12-13 Sensitive Receptors Near Proposed Improvements to OCWA LOWTP Facility .3-4483-394 v MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Figure 3.12-14 Sensitive Receptors Near Proposed Improvements to OCWA Terminal Campus 3-4503-395 Figure 3.12-15 Proposed Temporary and Permanent Noise Barriers to Abate Significant Effects from the Micron Campus (West) and Rail Spur Site ....................................................................3-4563-400 Figure 3.12-16 Proposed Temporary and Permanent Barriers to Abate Significant Noise Effects from the Micron Campus (East)....................................................................................................3-4583-401 Figure 3.12-17 Proposed Temporary Barriers to Abate Significant Noise Effects from Construction of the Childcare Site ................................................................................................ 3-4593-402 Figure 3.13-1 Visual Effects Study Area and Viewpoints .............................................................3-4643-407 Figure 3.13-2 Clay Substation Expansion Area Viewpoints .........................................................3-4653-408 Figure 3.13-3 Other Connected Action Viewpoints ......................................................................3-4663-409 Figure 3.13-4 Typical Views of Micron Campus Site ................................................................... 3-4683-411 Figure 3.13-5 Typical Views of Rail Spur and Childcare Sites.....................................................3-4693-412 Figure 3.13-6 Viewpoint 71 Photo Simulation .............................................................................3-4743-417 Figure 3.13-7 Viewpoint 61 Photo Simulation .............................................................................3-4753-418 Figure 3.13-8 Viewpoint 73 Photo Simulation .............................................................................3-4763-419 Figure 3.13-9 Viewpoint 77 Photo Simulation .............................................................................3-4773-420 Figure 3.13-10 Viewpoint 35 Photo Simulation ...........................................................................3-4783-421 Figure 3.13-11 Viewpoint 19 Photo Simulation............................................................................3-4803-423 Figure 3.13-12 Viewpoint 67 Photo Simulation ...........................................................................3-4823-425 Figure 3.13-13 Viewpoint 3 Photo Simulation .............................................................................3-4833-426 Figure 3.13-14 Viewpoint 66 Photo Simulation ...........................................................................3-4843-427 Figure 3.13-15 Viewpoint 20 Photo Simulation ...........................................................................3-4853-428 Figure 3.13-16 Viewpoint 7 Photo Simulation .............................................................................3-4873-430 Figure 3.13-17 Viewpoint 75 Photo Simulation ...........................................................................3-4883-431 Figure 3.13-18 Viewpoint 74 Photo Simulation ...........................................................................3-4893-432 Figure 3.13-19 Viewpoint 76 Photo Simulation ...........................................................................3-4903-433 Figure 3.13-20 Viewpoint 52 Photo Simulation ...........................................................................3-4923-435 Figure 3.13-21 Viewpoint 67 Photo Simulation (Rail Spur Site) .................................................3-4943-437 Figure 3.13-22 Viewpoint 72 Photo Simulation ...........................................................................3-4953-438 Figure 3.14-1 Police, Fire, and EMS ............................................................................................3-5013-444 Figure 3.14-2 Healthcare Facilities ............................................................................................... 3-5043-447 Figure 3.14-3 Public School Districts overlapping Study Area ....................................................3-5063-449 Figure 3.14-4 Open Space and Recreational Resources ............................................................... 3-5083-451 Figure 3.14-5 Regional Park System ............................................................................................3-5093-452 Figure 3.15-1 Local Study Area ....................................................................................................3-5243-467 Figure 3.15-2 Regional Study Area............................................................................................... 3-5253-468 Figure 3.15-3 Proposed Project On-Site Micron Campus Construction Jobs (2025–2045)* .......3-5413-484 Figure 3.15-4 Proposed Project On-Site Operational Jobs 2025-2045 .........................................3-5453-488 Figure 3.15-5 Proposed Project Total Jobs 2025-2045 .................................................................3-5473-490 Figure 3.16-1 Environmental Justice Study Area .........................................................................3-5643-507 Figure 3.16-2 DACs and Minority or Low-Income Communities in Study Area.........................3-5663-509 Figure 3.16-3 DACs and Minority or Low-Income Communities Near the Proposed Project and Adjacent Connected Actions .........................................................................................................3-5703-513 Figure 3.16-4 DACs and Minority or Low-Income Communities Near the Connected Actions (Southern Section) ........................................................................................................................3-5713-514 Figure 3.16-5 DACs and Minority or Low-Income Communities Near the Connected Actions (Northern Section) ........................................................................................................................3-5723-515 Figure 4.2-1 Present and Reasonably Foreseeable Actions - Proposed Project Local Area ...................... 4-4 Figure 4.2-2 Present and Reasonably Foreseeable Actions - Regional ...................................................... 4-5 vi MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT

LIST OF TABLES

Table 1.2-1 State and Local Involved and Interested Agencies ........................................................1-151-13 Table 1.4-1 Permits, Approvals, and Consultations ..........................................................................1-191-16 Table 2.1-1 Proposed Project and Connected Actions ..........................................................................2-32-5 Table 2.1-2 Micron Campus Fab Construction Schedule .....................................................................2-52-7 Table 2.1-3 Micron Campus Components ........................................................................................ 2-112-12 Table 2.1-4 Rail Spur Site Components ............................................................................................2-192-20 Table 2.1-5 Childcare Site Components............................................................................................2-232-24 Table 2.1-6 OCWA Phase 1 Improvements (for Fabs 1-2) ............................................................... 2-312-31 Table 2.1-7 OCWA Phase 2 Improvements (for Fabs 3-4) ............................................................... 2-322-32 Table 3.1-1 Legal and Regulatory Setting.................................................................................................. 3-2 Table 3.1-2 Other Announced or Planned Projects in Land Use Study Area ............................................. 3-6 Table 3.1-3 Existing Utility Properties and Proposed Improvements (Connected Actions) ...................... 3-8 Table 3.1-4 Protected Farmland ............................................................................................................... 3-11 Table 3.1-5 Land Use Study Area Zoning District Descriptions.......................................................3-233-21 Table 3.1-6 Existing Utility Property Zoning ...................................................................................3-243-22 Table 3.2-1 Legal and Regulatory Setting.........................................................................................3-373-35 Table 3.2-2 Soil Types at Proposed Project and Connected Action Sites .........................................3-483-43 Table 3.2-3 Slopes by Percentage at Proposed Project and Connected Action Locations ................3-513-46 Table 3.2-4 Bedrock Removal Locations and Volumes ....................................................................3-563-50 Table 3.2-5 Best Management Practices ...........................................................................................3-603-54 Table 3.3-1 Laws and Regulations ....................................................................................................3-693-59 Table 3.3-2 Permits and Approvals ...................................................................................................3-703-60 Table 3.3-3 Federal and State Wetland Types ...................................................................................3-723-62 Table 3.3-4 Wetland Functions and Services ....................................................................................3-733-63 Table 3.3-5 Federal, State, and Non-Jurisdictional Wetland Acreages .............................................3-783-65 Table 3.3-6 Delineated Federal Jurisdictional Surface Waters..........................................................3-843-68 Table 3.3-7 Anticipated Direct Losses of Jurisdictional Wetlands (Proposed Project) .....................3-893-73 Table 3.3-8 Potential Indirect Effects on Remaining Wetlands ........................................................3-913-74 Table 3.3-9 Anticipated Direct Losses of Federal Jurisdictional Streams.........................................3-933-76 Table 3.3-10 Potential Indirect Effects on Remaining Rivers and Streams ......................................3-933-76 Table 3.3-11 Proposed Stormwater Management Practices ............................................................3-1033-84 Table 3.3-12 BMPs for Protection of Water Resources ..................................................................3-1063-88 Table 3.3-13 Proposed Federal Wetland and Surface Water Mitigation ......................................... 3-1123-92 Table 3.3-14 Micron Mitigation Plan Timeline............................................................................... 3-1133-93 Table 3.4-1 Existing Ecological Communities and Dominant Vegetation (Proposed Project) .....3-1213-100 Table 3.4-2 Existing Ecological Communities (Clay Substation Expansion Area) ......................3-1253-104 Table 3.4-3 Existing Land Cover Types (Other Connected Actions) ............................................3-1263-105 Table 3.4-4 Potentially Occurring Special Status Species Based on Search Results ....................3-1283-107 Table 3.4-5 Potentially Occurring Special Status Species Based on Presence of Suitable Habitat ....3-1313- 110 Table 3.4-6 Effects on Ecological Communities (Proposed Project) ............................................ 3-1353-114 Table 3.4-7 Effects on Ecological Communities (Micron Campus) ............................................. 3-1363-115 Table 3.4-8 Construction Effects on Ecological Communities (Micron Campus) ........................ 3-1383-117 Table 3.4-9 Anticipated CPO Effect Determinations (Proposed Project) .....................................3-1433-122 Table 3.4-10 Projected Land Cover Loss Due to Induced Growth by 2041 .................................3-1543-132 Table 3.4-11 Best Management Practices .....................................................................................3-1553-133 Table 3.4-12 Mitigation Measures for Protected Bat Species .......................................................3-1573-135 Table 3.6-1 National Ambient Air Quality Standards ...................................................................3-1823-148 Table 3.6-2 East Syracuse and Rochester Background Air Quality Concentrations .....................3-1903-156 vii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Table 3.6-3 Summary Existing Emission Totals in Study Area in 2020 (Tons)1...........................3-1913-157 Table 3.6-4 Summary of Mobile On-Road & Off-Road Emissions in New York State in 2020 (Tons)1 ...........................................................................................................................................3-1923-158 Table 3.6-5 Regional Mobile Source Pollutant Burdens and Mobile Source Air Toxics Burdens (Tons Per Year) – No Action .........................................................................................................3-1933-159 Table 3.6-6 Stationary Source Construction Potential Emissions Summary (tpy)........................3-1953-161 Table 3.6-7 Estimated Micron Campus Post-Control Emissions Summary (tpy)1 .......................3-1983-163 Table 3.6-8 OCDWEP IWWTP Operation Emissions Summary (tpy) .........................................3-1983-164 Table 3.6-9 Summary of Percent Increase in Emissions from the Proposed Project ....................3-2003-165 Table 3.6-10 NAAQS Results .......................................................................................................3-2033-168 Table 3.6-11 SGC and AGC Results .............................................................................................3-2043-169 Table 3.6-12 Annual Construction Emissions (tpy) ......................................................................3-2063-171 Table 3.6-13 Construction Emissions Compared to New York State Totals .................................3-2073-172 Table 3.6-14 Regional Mobile Source Criteria Pollutant Emissions ............................................3-2083-173 Table 3.6-15 Regional 2031 Criteria Pollutant Change in Emissions Compared to New York State Totals .............................................................................................................................................3-2093-174 Table 3.6-16 Micron Campus PM Design Concentrations in 2041 (µg/m3) ................................. 3-2113-176 Table 3.6-17 Site 1 Combined Mobile and Stationary Sources PM Design Concentrations in 2041 (µg/m3) ..........................................................................................................................................3-2123-177 Table 3.6-18 Site 2 Combined Mobile and Stationary Sources PM Design Concentrations in 2041 (µg/m3) ..........................................................................................................................................3-2133-178 Table 3.6-19 Site 3 Combined Mobile and Stationary Sources PM Design Concentrations in 2041 (µg/m3) ..........................................................................................................................................3-2143-179 Table 3.6-20 BMPs for Air Quality ............................................................................................... 3-2163-181 Table 3.7-1 National GHG Emissions Standards for Passenger Cars and Light Trucks for Model Years 2023-2026 ...........................................................................................................................3-2203-185 Table 3.7-2 Greenhouse Gas Global Warming Potentials .............................................................3-2223-187 Table 3.7-3. 30-year Climate Normals at the USW00014771 Syracuse Hancock International Airport Station1 .............................................................................................................................3-2303-192 Table 3.7-4 Risk and Vulnerability1 .............................................................................................. 3-2323-194 Table 3.7-5 Regional Mobile Source Vehicle Miles Traveled (VMT) and GHG Emissions – No Action............................................................................................................................................3-2343-196 Table 3.7-6. Annual Scope 1 (Direct) Construction Emissions from Fuel Combustion1 (Metric Tons per Year) ............................................................................................................................... 3-2363-198 Table 3.7-7 GHG Construction Emission Factors for Micron Fab (GWP100) .............................3-2373-199 Table 3.7-8. OCDWEP IWWTP Construction GHG Emissions (GWP100) ................................ 3-2383-200 Table 3.7-9 GHG Emissions from Scope 3 Upstream Fuel Production and Transport for Construction1 (Metric Tons per Year) ...........................................................................................3-2393-201 Table 3.7-10 Proposed Project Total GHG Emissions (GWP20) ..................................................3-2423-204 Table 3.7-11 Proposed Project Total GHG Emissions (GWP100) ................................................3-2433-205 Table 3.7-12 Regional Mobile Source VMT and GHG Emissions ...............................................3-2463-208 Table 3.7-13. Project Design GHG Reduction Measures – Quantified GHG Emissions Reductions1 ...................................................................................................................................3-2523-214 Table 3.7-14. BMPs for GHGs and Climate Change ....................................................................3-2543-215 Table 3.8-1 Legal and Regulatory Setting.....................................................................................3-2573-218 Table 3.8-2 Relevant Permits, Licenses, and Registrations ..........................................................3-2593-220 Table 3.8-3 Proposed Project Construction-Related Non-Hazardous Solid Waste and Reusable or Recyclable Material ......................................................................................................................3-2653-226 Table 3.8-4 Proposed Project Operation-Related Solid Waste vs. Reusable or Recyclable Material .3-2713- 232 Table 3.8-5 Industrial and Commercial Materials for Micron RRR Program .............................. 3-2743-235 viii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Table 3.8-6 Micron Campus Operation-Related Hazardous Waste...............................................3-2753-236 Table 3.8-7 Hazardous Waste Accumulation Quantities by Fab ...................................................3-2763-237 Table 3.8-8 Hazardous and Universal Waste Disposal and RRR Management Methods .............3-2763-237 Table 3.8-9 Hazardous Material Types, Hazards, and Controls ....................................................3-2813-242 Table 3.8-10 Hazardous Materials ................................................................................................ 3-2823-242 Table 3.8-11 IWWTP Chemical Bulk Storage Quantities.............................................................3-2843-245 Table 3.8-12 Induced Growth Incremental MSW Projections ......................................................3-2853-246 Table 3.8-13 Best Management Practices .....................................................................................3-2883-249 Table 3.9-1 Legal and Regulatory Setting.....................................................................................3-2913-251 Table 3.9-2 Micron Campus Process Hazards and Risk Management Measures .........................3-2963-256 Table 3.9-3 Micron Campus Example Hazard Control Measures ................................................3-2983-258 Table 3.9-4 Micron Campus Additional IH Program Measures....................................................3-2993-259 Table 3.9-5 BMPs for Human Health and Safety .........................................................................3-3013-261 Table 3.10-1 Estimated Proposed Project Annual Electricity Consumption .................................3-3103-269 Table 3.10-2 Estimated Proposed Project Annual Peak Natural Gas Consumption .....................3-3143-272 Table 3.10-3 Estimated Proposed Project Average Freshwater Usage ..........................................3-3163-274 Table 3.10-4 Estimated Proposed Project Annual Industrial Wastewater Discharge ....................3-3193-276 Table 3.10-5 BMPs for Utilities and Supporting Infrastructure ....................................................3-3243-281 Table 3.11-1 Transportation Legal and Regulatory Setting ..........................................................3-3263-282 Table 3.11-2 LOS at Intersections .................................................................................................3-3303-286 Table 3.11-3 LOS at Freeways ......................................................................................................3-3303-286 Table 3.11-4 Significant Impacts Criteria .....................................................................................3-3313-287 Table 3.11-5 Intersections with High Delays (Existing Conditions).............................................3-3353-291 Table 3.11-6 Existing Bus Transit Services ..................................................................................3-3373-293 Table 3.11-7 No Action Alternative Results Summary (2027, 2031 and 2041) ............................3-3433-299 Table 3.11-8 Impacted Freeway Segments (No Action Alternative vs. Preferred Action Alternative in 2027) .........................................................................................................................................3-3553-309 Table 3.11-9 Impacted Intersections (No Action Alternative vs. Preferred Action Alternative in 2027) .............................................................................................................................................3-3553-309 Table 3.11-10 Impacted Freeway Segments (No Action Alternative vs. Preferred Action Alternative in 2031) ......................................................................................................................3-3613-314 Table 3.11-11 Impacted Intersections (No Action Alternative vs. Preferred Action Alternative in 2031) .............................................................................................................................................3-3613-314 Table 3.11-12 Impacted Freeway Segments (No Action Alternative vs. Preferred Action Alternative in 2041) ......................................................................................................................3-3693-320 Table 3.11-13 Impacted Intersections (No Action Alternative vs. Preferred Action Alternative in 2041 AM peak) .............................................................................................................................3-3703-321 Table 3.11-14 Impacted Intersections (No Action Alternative vs. Preferred Action Alternative in 2041 PM peak) .............................................................................................................................. 3-3713-322 Table 3.11-15 Impacted Freeway Segments Comparison - 2031..................................................3-3783-328 Table 3.11-16 Impacted Intersections Comparison – 2031 ...........................................................3-3783-328 Table 3.11-17 Impacted Freeway Segments Comparison - 2041..................................................3-3853-334 Table 3.11-18 Impacted Intersections Comparison – 2041 AM Peak ...........................................3-3863-335 Table 3.11-19 Impacted Intersections Comparison – 2041 PM Peak ...........................................3-3873-336 Table 3.12-1 Potential Sources of Noise and Vibration from the Preferred Action Alternative....3-3973-346 Table 3.12-2 Noise and Vibration Terms and Concepts ................................................................ 3-3983-347 Table 3.12-3 Local Noise and Vibration Requirements and State and Federal Guidance ............3-4033-352 Table 3.12-4 Construction Vibration Damage Criteria .................................................................3-4073-356 Table 3.12-5 Noise and Vibration Peak Period Analysis Scenarios .............................................. 3-4113-360 Table 3.12-6 Existing Conditions: Summary of Measured Noise Levels at Monitoring Areas ....3-4163-365 Table 3.12-7 Modeled Existing Baseline Traffic Noise Exposure ................................................3-4183-367 ix MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Table 3.12-8 Summary of Predicted Noise Exposure from Construction of Micron Campus ......3-4213-370 Table 3.12-9. Predicted Noise Effect from Construction of Rail Spur Site ..................................3-4243-373 Table 3.12-10 Predicted Noise Exposure from Construction of Childcare Site ............................3-4263-375 Table 3.12-11 Predicted Noise Exposure from Operation of Micron Campus .............................3-4273-376 Table 3.12-12 Preferred Action Alternative: Summary of Predicted Traffic Noise Exposure Above Significance Threshold1 ................................................................................................................3-4323-381 Table 3.12-13 Summary of Predicted Significant Construction and Operation Effects of the Preferred Action Alternative1 ........................................................................................................3-4343-383 Table 3.12-14 Summary of Noise Exposure and Increases Over Ambient Levels of the Preferred Action Alternative .........................................................................................................................3-4363-385 Table 3.12-15 Summary of Proposed Noise Abatement Measures ...............................................3-4603-403 Table 3.13-1 Legal and Regulatory Setting...................................................................................3-4623-405 Table 3.13-2 Representative Photo Simulations of Views of Micron Campus .............................3-4733-416 Table 3.14-1 Police, Fire, and EMS .............................................................................................. 3-5023-445 Table 3.14-2 Healthcare Facilities.................................................................................................3-5053-448 Table 3.14-3 Public School District Enrollment in Study Area ....................................................3-5073-450 Table 3.14-4 Open Space and Recreational Resources in Study Area ..........................................3-5103-453 Table 3.14-5 Fire and EMS Incidents at Micron Technology Boise, ID Facility ..........................3-5153-458 Table 3.14-6 Five-County Region Public School Enrollment.......................................................3-5193-462 Table 3.14-7 Estimated Changes in School-Aged Children from 2020-2041............................... 3-5203-463 Table 3.14-8 Best Management Practices .....................................................................................3-5213-464 Table 3.15-1 Town of Clay 2025 Adopted Budget........................................................................3-5323-475 Table 3.15-2 Town of Cicero 2025 Final Budget ..........................................................................3-5333-476 Table 3.15-3 School Districts that Service the Local Study Area 2023-2024 Budgets and Enrollment Trends.........................................................................................................................3-5353-478 Table 3.15-4 Connected Actions – Responsible Parties and Beneficiaries ...................................3-5443-487 Table 3.15-5 Induced Household Growth Projections Exceeding 10 Percent of Existing Household Estimates .....................................................................................................................3-5493-492 Table 3.15-6 Projected Supply Chain Jobs by Industry ................................................................ 3-5533-496 Table 3.15-7 Projected Jobs Supporting Household Spending .....................................................3-5543-497 Table 3.16-1 Regulatory Setting ...................................................................................................3-5613-504 Table 3.16-2 DAC Tracts within 5 Miles of Proposed Project and/or ½ Mile of Connected Actions 3-5733- 516 Table 3.17-1 Summary of Effects .................................................................................................3-5883-531 Table 4.2-1. Present and Reasonably Foreseeable Actions ........................................................................ 4-6 Table 4.3-1 - Summary of Predicted Effect of Cumulative Traffic Mitigation Scenario C on Traffic Noise Impacts1 ......................................................................................................................4-294-28 Table 4.3-2 Cumulative Household Growth Projections by County and Select Municipalities Exceeding 10 percent of 2023 Household Estimates ........................................................................4-334-32 x MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT

LIST OF ABBREVIATIONS AND ACRONYMS

Abbreviations/ Definition Acronyms µg/m³ Micrograms per Cubic Meter 3D NAND Three dimensional “not and” AADT Annual Average Daily Traffic ACGIH American Conference of Governmental Industrial Hygienists ACHP Advisory Council on Historic Preservation ACM Asbestos-Containing Material ACS American Community Survey AED semi-automatic defibrillator AERMAP AERMOD Terrain Pre-processor AERMET AERMOD Meteorological Pre-processor AERMOD AMS/EPA Regulatory Model AERR Air Emissions Reporting Rule AFFF aqueous film forming foam AGC Annual Guideline Concentration AHA American Heart Association AI artificial intelligence AJD Approved Jurisdictional Determination AKRF AKRF, Inc.

AMHS Automated Material Handling System AMR American Medical Response APE Area of Potential Effects ARM2 Ambient Ratio Method 2 ASCE American Society of Civil Engineers AQCR Air Quality Control Region ASOS Automated Surface Observing System xi MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT AST Aboveground Storage Tank ASTM American Society for Testing and Materials ATR automatic traffic recorder BACT Best Available Control Technology BBA Breeding Bird Atlas BEI Biological Exposure Indices BGEPA Bald and Golden Eagle Protection Act BIO biological treatment BA Biological Assessment BLS Bureau of Labor Statistics BMPs best management practices BOS Boston Consulting Group BPIP-PRIME Building Profile Input Program ( BRT Bus Rapid Transit BUD Beneficial Use Determination C&D Construction and Demolition Debris CAA Clean Air Act CAAS Commission on Accreditation of Ambulance Services Cadna-A Computer Aided Noise Abatement CAU capital asset utilization CBC Christmas Bird Count CBS Chemical Bulk Storage CCARP Climate Change and Resilience Plan CDD Construction and demolition debris CEC Community Engagement Committee CECPN Certificate of Environmental Compatibility and Public Need CEHAs Coastal Erosion Hazard Areas xii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT CEJST Climate and Economic Justice Screening Tool CEQ Council on Environmental Quality CF4 carbon tetrafluoride CFR Code of Federal Regulations CGP Construction General Permit (or General Permit for Stormwater Discharges from Construction Activity) CH4 Methane CHIPS Creating Helpful Incentives to Produce Semiconductors CIF Community Investment Fund CJWG Climate Justice Working Group Clay Fire Clay Fire Department CLCPA Climate Leadership and Community Protection Act CME CME Associates, Inc.

CMP Chemical Mechanical Planarization; Coastal Management Program CNY Central New York CNYRPDB Central New York Regional Planning and Development Board CNYREDC Central New York Regional Economic Development Council CO Carbon monoxide CO2 Carbon Dioxide CO2e CO2 equivalents County Onondaga County CP Commissioner Policy CPI Consumers Price Index CPO CHIPS Program Office CPR cardiopulmonary resuscitation CPT Cone Penetration Testing CRIS Cultural Resource Information System CRRA Community Risk and Resiliency Act xiii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT CRT Crisis Management Team CSD Central School District CSX Freight Rail Owner CT Census Tract CUB(s) central utility building(s) CVD Chemical Vapor Deposition CWA Clean Water Act CWMP Construction Waste Management Plan CY cubic yards CZMA Coastal Zone Management Act DA Department of the Army DAC Disadvantaged Community DACAT Disadvantaged Communities Assessment Tool DAR Department of Air Resources dB Decibels dBA Decibel A-weighted level DDI Diverging Diamond Interchange DEM Office Onondaga County Department of Emergency Management DEP Division of Environmental Permits DNL Daytime Nighttime Equivalent Sound Level descriptor DRAM dynamic random-access memory DSL Digital Subscriber Line EAF Environmental Assessment Form ECL Environmental Conservation Law ECS Syracuse University College of Engineering and Computer Science EDPL New York State Eminent Domain Procedure Law EDR Environmental Design & Research xiv MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT eGRID Emissions & Generation Resource Integrated Database EHS Environmental, Health, and Safety EIS Environmental Impact Statement EMD Emergency Medical Dispatch EMS Emergency Medical Services EMT Emergency Medical Technician EMT-B Emergency Medical Technician-Basic EO Executive Order EPCRA Emergency Planning and Community Right-to-Know Act ERCs Emission Reduction Credits ERMS Emergency Response Management System ERT Emergency Response Team ESA Endangered Species Act ESD Empire State Development ETC Estimated Time of Completion EUV extreme ultraviolet EV electric vehicle fab fabrication facilities fab memory fabrication unit Fab Fabrication Building(s) FEIS Final Environmental Impact Statement FEMA Federal Emergency Management Agency F-Gases Fluorinated Gases FHWA Federal Highway Administration FIFRA Federal Insecticide, Fungicide, and Rodenticide Act FIRMs flood insurance rate maps FLM Federal Land Manager xv MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT FSL Forecast Systems Laboratory FPPA Farmland Protection Policy Act FRA Federal Railroad Administration FSMS Fiscal Stress Monitoring System FTA Federal Transit Administration FTTH Fiber to the Home FWS Fish and Wildlife Service GC General Contractor GDP gross domestic product GEH Geoffrey E. Havers GHG Greenhouse Gas(es) GHS United Nations Globally Harmonized System of Classification and Labelling of Chemicals GIS Geospatial Information System GML General Municipal Law GNM Great Northern Mall gpm gallons per minute GRS Gas Regulator Station GW gigawatt GWh gigawatt-hours GWP100 20-year basis Global Warming Potential GWP20 100-year basis Global Warming Potential HAP(s) Hazardous Air Pollutant(s) HAZWOPER Hazardous Waste Operations and Emergency Response HCM Highway Capacity Manual HDD horizontal directional drilling HDM Highway Design Manual HFCs Hydrofluorocarbons xvi MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT HI Hazards Index HMTA Hazardous Materials Transportation Act HPM Hazardous Process Materials HRSA Health Resources and Services Administration HTF Heat Transfer Fluid HUCs Hydrologic Unit Codes HUD United States Department of Housing and Urban Development HWCP Hazardous Waste Contingency Plan IDLH Immediately Dangerous to Life and Health IH Industrial Hygiene IND Industrial IPaC Information for Planning and Consultation IPCC Intergovernmental Panel on Climate Change ISHD Integrated Surface Hourly Data ISO International Organization for Standardization IWTP Iindustrial wWastewater dDischarge pPermit IWWTP Industrial Wastewater Treatment Plant JEDEC Joint Electron Device Engineering Council JHA Job Hazard Analysis JPA Joint Permit Application kV kilovolt KSYR Syracuse Hancock International Airport L10 Sound level that is exceeded ten percent of the time (90th percentile) LAER Lowest Achievable Emission Rate lbs pounds LCD Liquid Crystal Display Lday Daytime noise level xvii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT LDN Average noise level over a 24-hour period (DNL) LEED Leadership in Energy and Environmental Design LEHD Longitudinal Employer-Household Dynamics LEPC Local Emergency Planning Committee Leq Equivalent Noise Level LF linear feet Lnight Nighttime noise level LOD Limit of Disturbance LOS Level of Service LOWTP Lake Ontario Water Treatment Plant LQG Large Quantity Generator LRTP Long Range Transportation Plan LSWMP Local Solid Waste Management Plan LWRP Local Waterfront Revitalization Program MASW Multichannel Analysis of Surface Waves MBR membrane biological reactor MBTA Migratory Bird Treaty Act MCF thousand cubic feet MCL maximum contaminant levels MDth thousand dekatherms megafabs mega-fabrication facilities MERP Modeled Emission Rates for Precursors MEMS Micro-electromechanical Systems MG million gallon MGD million gallons per day Micron Micron New York Semiconductor Manufacturing LLC mmt Millions of metric tons xviii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT MOE measure of effectiveness MOSF Major Oil Storage Facility MOVES Motor Vehicle Emission Simulator MOVES4 Motor Vehicle Emission Simulator MPA Metropolitan Planning Area mph mile(s) per hour MSAT Mobile Source Air Toxics MSGP Multi-Sector General Permit MSW municipal solid waste Mt Megatonne MTP Metropolitan Transportation Plan MW Megawatt N2O Nitrous Oxide NAAQS National Ambient Air Quality Standards NABTU North America’s Building Trades Unions NAC FHWA Noise Abatement Criteria NAICS North American Industry Classification System NAVAC North Area Volunteer Ambulance Corps NCEI National Centers for Environmental Information NEI National Emissions Inventory NEPA National Environmental Policy Act NESHAP National Emission Standards for Hazardous Air Pollutants NF3 nitrogen trifluoride NFPA National Fire Protection Association NHL National Historic Landmarks NHPA National Historic Preservation Act NIMS/ICS National Incident Management System/Incident Command System xix MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT NIOSH National Institute for Occupational Safety and Health NIST National Institute of Standards and Technology NLCD National Land Cover Database NLUS Northern Land Use Study NNSR Nonattainment New Source Review NO2 Nitrogen dioxide NOAA National Oceanic and Atmospheric Administration NOFO Notice of Funding Opportunity NOI Notice of Intent NOVA Northern Onondaga Volunteer Ambulance NOX Oxides of Nitrogen NPDES National Pollutant Discharge Elimination System NRCS Natural Resources Conservation Service NRHP National Register of Historic Places NSPS New Source Performance Standards NSR New Source Review NWS National Weather Service NY New York NYCDOT New York City Department of Transportation NYCRR New York Codes, Rules, and Regulations NYISO New York Independent System Operator NYNHP New York Natural Heritage Program NYPA New York Power Authority NYS New York State NYSEDC New York State Economic Development Council NYSDEC New York State Department of Environmental Conservation NYSCIA New York State Climate Impacts Assessment xx MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT NYSDOH New York State Department of Health NYSDOL New York State Department of Labor NYSDOS New York Department of State NYSDOT New York State Department of Transportation NYSDPS New York State Department of Public Service NYSED New York State Education Department NYSERDA New York State Energy Research & Development Authority NYSRHP New York State Register of Historic Places NYSHPA The New York State Historic Preservation Act of 1980 NYSHPO New York State Historic Preservation Office NYSOGS New York Office of General Services NYSOSC Office of the New York State Comptroller NYSPSC New York State Public Service Commission NYSTA New York State Thruway Authority O3 Ozone OCDOT Onondaga County Department of Transportation OCDWEP Onondaga County Department of Water Environment Protection OCIDA Onondaga County Industrial Development Agency OCM BOCES Onondaga-Cortland-Madison Board of Cooperative Educational Services OCRRA Onondaga County Resource Recovery Agency OCRRF Onondaga County Resource Recovery Facility OCWA Onondaga County Water Authority OCWRC Onondaga County Water Redevelopment Corporation OECD Organisation for Economic Co-operation and Development OEL Occupational Exposure Limit OHWM ordinary high water mark OLM Ozone Limiting Method xxi MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT OOWWTP Onondaga Oak Orchard Wastewater Treatment Plant OPHRP Office of Parks, Recreation, and Historic Preservation OSHA Occupational Safety and Health Administration OTR Ozone Transport Region Pb Lead PBS Petroleum Bulk Storage pc/mi/ln passenger cars per mile per lane PCBs polychlorinated biphenyls PCE Passenger Car Equivalent pcphpl passenger cars per hour per lane PDD Planning Development Districts PEECs Process Equipment Exhaust Conditioners PEJAs Potential environmental justice areas PEL Permissible Exposure Limit PEM palustrine emergent PFAS per- and polyfluoroalkyl substances PFCs Perfluorocarbons PFO palustrine forested PFOA perfluorooctanoic acid PFOS perfluorooctane sulfonic acid Phase I ESA Phase I Environmental Site Assessment PHF peak hour factor PILOT Payment In Lieu of Taxes PJD preliminary jurisdictional determination PM Particulate Matter PM10 Particulate matter with an aerodynamic diameter smaller than or equal to 10 micrometers xxii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT PM2.5 Particulate matter with an aerodynamic diameter smaller than or equal to 2.5 micrometers POM Polycyclic Organic Matter POTW publicly owned treatment works POW palustrine open water POU point-of-use ppb Parts per billion PPE Personal Protective Equipment ppm Parts per million PPV Peak Particle Velocity PSD Prevention of Significant Deterioration PSL Public Service La PSM Process Safety Management PSS palustrine scrub/shrub PTE Potential to Emit PTP Pre-Task Plan PTW Permit-to-Work PUB palustrine unconsolidated bottom PV Photovoltaic Cell PWL Sound Power Level QCEW Quarterly Census of Employment and Wages QEP Qualified Environmental Professional RA-1OO Residential/Agricultural RACT Reasonably Available Control Technology Ramboll Ramboll Americas Engineering Solutions, Inc.

RBLC Reasonably Available Control Technology/Best Available Control Technology/Lowest Achievable Emission Rate Clearinghouse RCNM Roadway Construction Noise Model xxiii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT RCR Rock Cut Road RCRA Resource Conservation and Recovery Act RCTOs rotor-concentrator thermal oxidizers RECs Renewable energy credits RMEI Regional Economic Models, Inc.

REMI Regional Economic Models, Inc.

RMP Risk Management Plan; Risk Management Program RMSE root mean squared error RMW Regulated Medical Waste ROD Record of Decision ROI Region of Influence ROW right-of-way RRR reuse, recycle, and recovery RTOR right turn on red RWPS Raw Water Pump Station SF6 sulfur hexafluoride S/NR State/National Register SCF standard cubic feet SCSD Syracuse City School District SEMI S2 Semiconductor Equipment and Materials International Standard 2 SEMI-NY Semiconductor Manufacturing Initiative SEQR State Environmental Quality Review SEQRA State Environmental Quality Review Act SERC State Emergency Response Commission SERCs State Emergency Response Commissions SF6 sulfur hexafluoride SFHA special flood hazard areas xxiv MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT SFR saturation flow rate SGC Short-term Guideline Concentration SGEIS Supplemental Generic Environmental Impact Statement SHER Safety, Health, & Essential Rights SHIA Syracuse Hancock International Airport SHPO State Historic Preservation Office SIA Semiconductor Industry Association SIP State Implementation Plan SIRS Student Information Repository System SMMP Soil and Materials Management Plan SMP(s) stormwater management practice(s) SMTA Syracuse Metropolitan Transportation Authority SMTC Syracuse Metropolitan Transportation Council SNOP Sales & Operations Planning SO2 Sulfur dioxide SPCC Spill Prevention Control and Countermeasure SPDES State Pollutant Discharge Elimination System SPL Sound Pressure Level SPL Lmax Maximum Sound Pressure Level SPR Spill Prevention Report SPT Standard Penetration Testing sq. ft. square feet SR State Register of Historic Places SSAs sole source aquifers SSURGO Soil Survey Geographic STAMP Science, Technology, and Advanced Manufacturing Park STPH short tons per hour xxv MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT SUNY State University of New York SWPPP Stormwater Pollution Prevention Plan T&E Threatened and Endangered TAZ traffic analysis zone TEM Transportation Environmental Manual TGM Toxic Gas Monitoring TIS Traffic Impact Study TLV Threshold Limit Value TMA trimethylaluminum TMC turning movement count TNM FHWA Traffic Noise Model TNW Traditional Navigable Waterways tpy Tons per year TRI Toxics Release Inventory TSCA Toxic Substances Control Act TTR Transportation Technical Report TWT The Wetland Trust U.S. United Stations States USCB U.S. Census Bureau (USCB) USDOT United States Department of Transportation USACE United States Army Corps of Engineers USEPA United States Environmental Protection Agency USFWS U.S. Fish and Wildlife Service USGS United States Geological Survey UST Underground Storage Tank UVIR Ultraviolet Infrared v/c volume-to-capacity ratio xxvi MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT VCC vehicle classification count VdB Vibration decibel level VMT Vehicle Miles Traveled V-NAND vertical “not and” VOC Volatile Organic Compound(s) VSQG Very Small Quantity Generator WBV Water bath vaporizer WMA(s) Wildlife Management Area(s) WOPW water output per week WOTUS Waters of the U.S.

WPCP White Pine Commerce Park WQV water quality volume WSCs Workplace Safety Committees WTE Waste-to-Energy WWTP Wastewater Treatment Plant ZID Zone of Immediate Dilution xxvii MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT

0.0 EXECUTIVE SUMMARY

0.1 OVERVIEW

The Creating Helpful Incentives to Produce Semiconductors (CHIPS) for America Act is a set of bipartisan legislation that was enacted in 2020 and 2022 to revitalize the semiconductor manufacturing industry in the United States and accelerate domestic production of cutting-edge logic and memory chips. Under the authority of the CHIPS Act, the U.S. Department of Commerce created the CHIPS Program Office (CPO) to administer the CHIPS Incentives Program, which aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security.

The Onondaga County Industrial Development Agency (OCIDA) is authorized to develop commerce and industry and advance job opportunities in the State of New York. In addition, the State has committed to attracting new semiconductor manufacturing and related material supplier projects to the State through measures such as the New York Green CHIPS Program and the Green CHIPS Excelsior Jobs Tax Credit Program.

On June 14, 2023, Micron New York Semiconductor Manufacturing LLC (Micron), a wholly owned subsidiary of Micron Technology, Inc., submitted an application to OCIDA requesting certain financial assistance pursuant to New York General Municipal Law § 854(14). Micron’s application, as amended and restated, includes the lease and eventual purchase of the White Pine Commerce Park (WPCP) in Clay, New York and the undertaking of potential property condemnation pursuant to the New York Eminent Domain Procedure Law.

On August 18, 2023, Micron filed an application with CPO for direct funding under the CHIPS Incentives Program’s February 28, 2023, Notice of Funding Opportunity (NOFO) for the purpose of constructing commercial semiconductor fabrication facilities in Clay, New York. On December 5, 2024, the U.S. Department of Commerce approved Micron’s application for an award under the NOFO. The purpose and need for CPO’s Proposed Action are to fulfill the Department of Commerce’s statutory responsibilities under the CHIPS Act, including the requirement to provide Federal financial assistance to covered entities1 to incentivize investment in facilities and equipment in the U.S. for the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment.2 Specifically, Micron proposes to construct and operate a large-scale, state-of-the -art dynamic random-access memory (DRAM) semiconductor manufacturing facility (the Micron Campus) at the WPCP. Micron also proposes to construct a rail spur and construction material conveyance facility to reduce truck trips and support construction of the Micron Campus (the Rail Spur Site) and a childcare center, healthcare center, and recreationrecreational center (the 1 The term “covered entity” means a nonprofit entity, a private entity, a consortium of private entities, or a consortium of nonprofit, public, and private entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment. 15 U.S.C. § 4651(2).

2 15 U.S.C. § 4652(a)(1).

0-0 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Childcare Site) to serve its employees, and to lease existing warehouse space within 20 miles of the Micron Campus (the Warehouse Site). The Micron Campus, Rail Spur Site, Childcare Site, and Warehouse Site are collectively referred to as the Proposed Project. The Proposed Project also would require utility and infrastructure improvements to meet its electricity, natural gas, water supply, wastewater, and telecommunications needs, collectively referred to as the Connected Actions.

The construction of the Proposed Project would take place in stages over approximately 16 years. Subject to the receipt of all applicable permits, authorizations, and approvals, Micron would mobilize for initial site preparation for the Proposed Project beginning in the fourth quarter of 2025, with the first two DRAM manufacturing facilities (Fabs 1 and 2) estimated to be operational by 2029 and 2030, respectively, and the remaining fabs (Fabs 3 and 4) estimated to be operational by 2035 and 2041, respectively. The manufacturing facility would ramp up to full production output by 2045. The Connected Actions would be constructed on a parallel schedule to meet the utility needs for the Proposed Project as it scales up over the 16-year construction period. The Proposed Project would be supported by more than $100 billion of private investment over the course of the next two decades, with a first phase of investment of $20 billion planned by the end of this decade. At full operational capacity in 2045 the Proposed Project would generate more than 9,000 permanent on-site operational jobs and spur the creation of approximately 40,000 additional jobs in the regional economy and throughout New York State, including vendor, supply chain, construction, and community jobs. Upon completion, the Proposed Project would be the largest domestic producer of DRAM chips, which have crucial applications in military equipment, cybersecurity technology, the aerospace industry, artificial intelligence (AI), and other cutting- edge uses, as well as more common areas of the domestic consumer economy.

CPO and OCIDA jointly prepared this FinalDraft Environmental Impact Statement (EIS) to evaluate the reasonably foreseeable environmental effects of the Proposed Project and Connected Actions pursuant to the National Environmental Policy Act of 1969 (NEPA), 42 U.S.C. §§§ 4321 et seq., and the State Environmental Quality Review Act (SEQRA), as codified at N.Y. Envtl. Conserv. Law §§§ 8-0101 et seq. and its implementing regulations at 6 N.Y.C.R.R. Part 617. The purpose of the EIS is to identify and assess the reasonably foreseeable environmental effects of the Proposed Project and Connected Actions and a reasonable range of alternatives, facilitate public involvement and informed agency decision-making, and recommend appropriate mitigation measures. The EIS provides a basis for coordinated Federal, State, Indigenous Nation, and local input and review in a single document.

The EIS includes five main chapters. Chapter 1 provides a detailed introduction to CPO and OCIDA and their roles as the joint lead agencies for the environmental review of Micron’s Proposed Project under NEPA and SEQRA, along with information on other agencies and interested parties involved in the environmental review. Chapter 2 provides a comprehensive overview of the various components of the Proposed Project and Connected Actions and a discussion of the alternatives that CPO and OCIDA considered. Chapter 3 is divided into 16 sections analyzing the reasonably foreseeable effects of the Proposed Project and Connected Actions on various resource areas. Chapter 4 analyzes the reasonably foreseeable cumulative effects of the Proposed Project and Connected Actions. Chapter 5 discusses the unavoidable significant adverse effects and the irreversible or irretrievable commitments of environmental resources that would occur if the Proposed Project and Connected Actions are implemented. 0-1 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT This Executive Summary provides a high-level overview of the Proposed Project and Connected Actions, the alternatives CPO and OCIDA considered, and the environmental effects on the resource areas analyzed in Chapters 3-5.

0.2 PROPOSED PROJECT AND CONNECTED ACTIONS

Micron proposes to construct a semiconductor manufacturing facility on an approximately 1,377-acre site consisting primarily of the current WPCP, in Onondaga County, New York. The area surrounding the WPCP is sparsely populated with relatively low-density residential development, mostly along Caughdenoy Road and Verplank Road west of the WPCP. I-81 is located a little more than one mile east of the WPCP. The WPCP is approximately seven miles north of the City of Syracuse. Although a majority of the Micron Campus would be contained within the Town of Clay, a small portion would be in the Town of Cicero.

The Micron Campus would include four DRAM production fabs, ancillary support facilities, driveways, parking, and ingress and egress roads with access from New York State (NYS) Route 31, U.S. Route 11, and Caughdenoy Road. Each fab would occupy approximately 1.2 million square feet (sq. ft.) of land and contain approximately 600,000 sq. ft. of semiconductor cleanroom manufacturing space. The fabs would be supported by central utility buildings, warehouse space, and product testing space.

The Proposed Project would involve the development of three additional properties with uses ancillary to the Micron Campus: an approximately 38-acre parcel on the west side of Caughdenoy Road in the Town of Clay for the Rail Spur Site; an approximately 3130-acre parcel located at 9100 Caughdenoy Road in the Town of Brewerton for the Childcare Site; and leasing of 360,000-500,000 sq. ft. of existing warehouse space for the Warehouse Site in an industrially zoned area at a location to be determined within 20 miles of the Micron Campus.

Construction of the Connected Actions would include expansion of certain existing utility properties and the construction and operation of various utility improvements by National Grid, Onondaga County Water Authority (OCWA), Onondaga County Department of Water Environment Protection (OCDWEP), and others to support the electricity, natural gas, water supply, wastewater, and telecommunication needs of the Proposed Project. To supply the estimated electricity needs of the Micron Campus, National Grid proposes to expand the existing footprint of the Clay Substation (located to the northwest of the WPCP across the CSX Railroad line) toward the north and east by approximately 10 acres. To supply the estimated natural gas demands of the Micron Campus, National Grid proposes to construct an approximately 3.1-mile long, 16-inch diameter below-grade (underground) natural gas distribution line from its existing Gas Regulator Station (GRS) 147 at 4459 NYS Route 31 to the Micron Campus and to construct a new GRS 147A at the same address.

OCWA proposes to undertake two phases of water system capacity and transmission upgrades to supply water to the Micron Campus. Phase 1 would involve upgrading the Raw Water Pump Station (RWPS) and Lake Ontario Water Treatment Plant (LOWTP) in Oswego and the Terminal Campus in the Town of Clay and constructing new water transmission mains from these facilities to the Micron Campus. Phase 2 would involve additional upgrades and transmission lines based on future needs. None of OCWA’s proposed water infrastructure upgrades that are needed to meet Micron Campus water demands would require permanent land acquisition.

0-2 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT OCDWEP proposes to undertake two stages of wastewater infrastructure and capacity improvements to serve the Micron Campus. Stage 1 would involve interim “bridging” projects at the existing OCDWEP Oak OrchardOnondaga Wastewater Treatment Plant (OOWWTPOWWTP) to receive startup industrial wastewater flows and potentially initial manufacturing industrial flows from construction of Phase 1 of the Micron Campus (Fabs 1-2) while OCDWEP constructs a new Industrial Wastewater Treatment Plant (IWWTP) and reclaimed water facilities at its 76-acre Oak Orchard site. Stage 1 would also involve construction of a new conveyance between the Micron Campus and the Oak Orchard site to send pretreated industrial wastewater to the IWWTP and return reclaimed water to the Micron Campus. Stage 2 would expand and upgrade the IWWTP to serve additional campus industrial wastewater flows from Phase 2 of the Micron Campus build- out (Fabs 3-4) and provide additional reclaimed water back to the Micron Campus.

To supply telecommunication and broadband internet connectivity to the Micron Campus Micron would make use of two existing fiber optic lines along Caughdenoy Road and NYS Route 31 accessible via two fiber optic connection entry points within a mile of the WPCP, one at the intersection of Caughdenoy and Verplank Roads, and one at the intersection of Caughdenoy Road and NYS Route 31. The existing fiber optic lines currently serve a cell tower on the southern portion of the WPCP, just north of NYS Route 31.

0-3 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Proposed Project and Connected Actions Source: Light Gray Canvas (Esri, 2025a): Esri, TomTom, Garmin, FAO, NOAA, USGS, © OpenStreetMap contributors, and the GIS User Community.

0-4 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT

0.3 ALTERNATIVES

NEPA and SEQRA require agencies to consider a reasonable range of alternatives to a proposed action. The range of alternatives CPO and OCIDA considered in this EIS are the Preferred Action Alternative (construction of the Proposed Project and Connected Actions), the No Action Alternative, a Reduced Scale Manufacturing Alternative, a U.S. Route 11 Access Elimination Alternative, and six Micron Campus Site Layout Alternatives. Following an extensive examination of each alternative based on a defined set of criteria, CPO and OCIDA determined that the Preferred Action Alternative is the only alternative that would meet CPO’s purpose and need under NEPA and Micron’s purpose and need under SEQRA.

No Action Alternative Under the No Action Alternative, the WPCP would remain in its current condition pending future development proposals. OCIDA acquired all parcels on the WPCP, the vast majority of which are presently vacant, for the specific purpose of creating an industrial park (as analyzed in the WPCP 2021 Supplemental Generic Environmental Impact Statement). The No Action Alternative would delay OCIDA’s long-standing objective to bring high-tech facilities and high paying jobs to Onondaga County at the WPCP until such time as OCIDA identifies another suitable development proposal for the property. The Rail Spur and Childcare Sites would remain vacant properties. The existing utility authorities would not undertake utility improvements, outside those already planned as part of the systems’ long term maintenance or need to obtain easements for the Connected Actions.

Reduced Scale Manufacturing Alternative CPO and OCIDA considered reduced scale manufacturing alternatives in coordination with Micron. As described in Chapters 1-2, reduced scale alternatives, including two- and three-fab configurations, would not be able to achieve the level of economically viable domestic memory chip output sufficient to meet CPO U.S. economic and Micron’s purpose and need.national security objectives. A reduced scale manufacturing alternative would incur significantly higher costs per unit of DRAM produced than a full-scale four-fab campus and would not meet Micron or CPO’s economic sustainability needs.. Without a single campus capable of achieving 52,000 chip wafersthat level of output per week, Micron also would not be able to facilitate co-location and efficient operation of semiconductor manufacturing supply chain expertise and supplier delivery operations in the vicinity, which would impede the Proposed Project’s operational efficiency by making it more difficult to obtain critical materials and keep production high and costs low through collaborative engineering. Further, a reduced scale alternatives would require constructing and operating additional fabs at other locations, above and beyond what is already being contemplated, which would have additional environmental effects. Based on the above factors, reduced scale manufacturing alternatives would not be economically viable or meet CPO and Micron’sCPO’s purpose and need and were not carried forward for further evaluation. U.S. Route 11 Access Elimination Alternative In coordination with Micron, CPO and OCIDA considered a potential site layout alternative for the proposed Micron Campus that would eliminate driveway access to the campus from U.S. Route 11. Eliminating the driveway would avoid the disturbance of 2.3 acres of federal 0-5 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT jurisdictional wetlands, including 0.71 acres of State jurisdictional wetlands accounted for within the 2.3 acres of federal jurisdictional wetlands. The site access driveway from U.S. Route 11, however, would be a vital access point to the Micron Campus and would ensure sufficiently streamlined construction traffic movement to avoid interference with local traffic patterns, particularly during construction of Fabs 2 through 4. Further, the driveway would distribute site access more effectively across the area roadway network and would mitigate post-construction traffic effects from campus operations. Therefore, CPO and OCIDA did not carry this site layout alternative forward for further analysis in the EIS.

Micron Campus Site Layout Alternatives In coordination with Micron, CPO and OCIDA considered a further series of potential site layout alternatives for the proposed Micron Campus to determine whether a different layout of the fabs and supporting buildings from the Preferred Action Alternative site layout would result in fewer effects to waterbodies and wetlands on the WPCP. Specifically, six site layout alternatives were considered in addition to the Preferred Action Alternative. However, CPO and OCIDA determined that none of the site layout alternatives besides the Preferred Action Alternative would be technically or economically feasible or practicable because each would create inefficiencies that would prevent the Micron Campus from achieving the semiconductor wafer output necessary to achieve commercial viability. In addition, CPO and OCIDA found that all of the site layout alternatives besides the Preferred Action Alternative would result in the permanent loss of an equivalent amount or additional acres of federal jurisdictional wetlands.

0.4 ENVIRONMENTAL ANALYSIS

CPO and OCIDA considered the environmental resources that may be affected by the Proposed Project and Connected Actions. Best management practices (BMPs) were proposed to avoid and minimize potential effects where feasible. The EIS also identifies the mitigation measures that CPO, OCIDA, or other parties may require Micron to commit to or undertake to mitigate significant adverse effects.

The remainder of this section provides high-level summaries of the environmental analyses for each resource area discussed in the EIS.

Land Use, Zoning, and Public Policy Construction of the Proposed Project and Connected Actions would convert existing vacant land and residential land uses to industrial use over a 16-year timeframe. Although these activities would not result in significant adverse effects on land use, the Proposed Project, and the Micron Campus in particular, would nevertheless represent a significant direct change to existing land use. This change, however, would still be consistent with the I-2 zoning designation for the WPCP. Moreover, the Proposed Project would comply with zoning regulations and the terms and conditions of any necessary local approvals, would be consistent with relevant public policies, and would fulfill several public policy goals relating to economic development and industrial use of the WPCP. The growth inducing effects of the Preferred Action Alternative would result in significant changes to land use but would continue to be subject to local discretionary approvals and planning policies, including applicable measures to avoid or minimize adverse development effects. Therefore, the Preferred Action Alternative would not result in any significant adverse 0-6 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT effects with respect to zoning or public policies and would likely result in beneficial effects by fulfilling economic development policy goals.

Geography, Soils, and Topography Construction of the Proposed Project would include removal of substantial volumes of soil and bedrock, and extensive fill and grading of more than 1,000 acres across the Micron Campus, Rail Spur Site, and Childcare Site, plus activity across additional sites and utility routes to construct the Connected Actions, resulting in permanent changes to these resources. These construction activities would be conducted in accordance with Micron’s Soilsoil and Materials Management Plan (SMMP)materials management plan as well as State Pollutant Discharge Elimination System (SPDES) program requirements, including preparation of a Stormwater Pollution Prevention Plan (SWPPP). With these required BMPs and mitigation plans in place, significant adverse effects on existing geology, soils, and topography would be avoided.

Water Resources Construction of the Proposed Project and Connected Actions would result in significant adverse effects on wetlands and surface water through the anticipated permanent loss of approximately 200 acres of federal jurisdictional wetlands and 7,828 linear feet (LF) of jurisdictional surface water features, of which approximately 193 acres of federal jurisdictional wetlands and 6,283 LF of jurisdictional surface water features are associated with the Proposed Project. Construction of the Proposed Project and Connected Actions would not result in significant adverse effects from stormwater or significant adverse effects on groundwater, floodplains, or coastal resources. Post-construction operation of the Proposed Project and Connected Actions would not result in significant adverse effects on water resources. The Preferred Action Alternative could potentially result in significant growth inducing effects on wetlands and surface water in the five-county Central New York (CNY) Region (defined as Onondaga, Oswego, Madison, Cortland, and Cayuga Counties) (five-county region) over time, but these changes would be gradual and would be subject to applicable permitting processes for other activities.

Mitigation would be required under Section 404 of the Clean Water Act and Article 24 of the Environmental Conservation Law to address the anticipated permanent losses of federal and State jurisdictional wetlands and surface water features. Under a proposed mitigation plan, Micron would enhance, establish, or restore a total of 422.14 acres of wetlands and 14,030 LF of stream features across six mitigation sites located within a nine-mile distance to the northwest of the WPCP, an approximately 2:1 mitigation ratio. Overall, approximately 1,341 acres of land within the Oneida River watershed would be protected in perpetuity under the mitigation plan. Additionally, Micron would purchase nine in-lieu fee program credits.

Biological Resources Construction of the Proposed Project and Connected Actions would result in significant adverse effects on biological resources. This would include significant adverse effects on Federal and State listed threatened and endangered species, including the Indiana bat, northern long-eared bat, tricolored bat, northern harrier, and short-eared owl. Post-construction operation of the Proposed Project and Connected Actions would not result in significant adverse effects on 0-7 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT biological resources. The Preferred Action Alternative has low potential to result in significant growth inducing effects on biological resources in the five-county region over time. Micron would be required to implement several BMPs to avoid or minimize effects on biological resources, including wintertime tree clearing, tree marking, retention of onsite roosting and foraging habitat where feasible, noise and lighting reduction to reduce the potential for disturbance of bats in adjacent areas of habitat, water quality protection, and biological monitoring , among others.and limited nighttime construction, among others. Mitigation would be required to reduce unavoidable significant adverse effects of the Proposed Project on Federal and State listed bat species and State listed grassland birds. Micron would purchase and permanently protect twice the amount of roosting habitat that would be lost due to Proposed Project and Connected Action construction and would fund research and monitoring efforts to benefit science-based bat species conservation and management programs in New York State. Additionally, Micron and The Wetland Trust (TWT) have proposed to purchase 650 acres of sufficiently high-quality habitat for permanent protection and to restore and manage the habitat as grassland for 15 years (in 3-year cycles) to achieve the 3:1 net conservation benefit ratio required by the State.

Historic and Cultural Resources CPO is serving as the lead Federal agency for the Section 106 consultation process under the National Historic Preservation Act (NHPA) for the Proposed Project and Connected Actions. CPO, in consultation with the New York State Historic Preservation Office (NYSHPO), the Advisory Council on Historic Preservation (ACHP), and other consulting parties, including Indigenous Nations with an interest in potentially affected areas, has identified areas of potential effect (APE) for both historic architectural properties and archaeological resources. CPO has proposed a finding of no adverse effect with respect to one historic architectural property and is continuing to review information on other historic architectural properties in consultation with NYSHPO. CPO also is in the process of preparing a Programmatic Agreement (PA) for the Proposed Project and Connected Actions that will implement a phased identification process to defer the final identification and evaluation of archaeological resources. Micron has completed Phase 1A Archaeological Studies and is in the process of completing Phase 1B Archaeological Investigations, which may continue to be conducted during the federal and State agency reviews of the Proposed Project and Connected Actions. CPO determined that Indigenous Nation monitoring is warranted during archaeological testing and Micron is continuing to coordinate with Indigenous Nation monitors as part of the archaeological investigations. Because the Section 106 process is ongoing, Micron would not be authorized to begin construction of the Proposed Project until all consulting parties are afforded an opportunity to comment on whether historic properties (including historic architectural properties and archaeological resources) would be adversely affected and CPO reviews and approves the results of any further applicable historic architectural surveys or archaeological investigation work. Induced growth throughout the five-county region has the potential to affect historic architectural properties and archaeological resources. Although it cannot be predicted exactly when, or to what degree, induced growth would affect historic architectural properties, any future development requiring discretionary approvals would be required to comply with Section 106 of the NHPA or Section 14.09 of the New York State Historic Preservation Act (NYSHPA). 0-8 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Air Quality Construction activities associated with the Proposed Project components would result in temporary adverse effects on air quality. Based on applicable air quality regulatory and permitting requirements, stationary sources associated with the Proposed Project would not cause or contribute to an exceedance of any of the applicable National Ambient Air Quality Standards (NAAQS), short-term guideline concentrations (SGC), or annual guideline concentrations (AGC). The stationary and mobile source emissions from construction and long-term operation of the Proposed Project also would not have a significant adverse effect on air quality. The potential effects on air quality from induced growth under the Preferred Action Alternative would not cause a significant adverse effect within the five-county region.

To avoid and minimize effects on air quality during construction and operations, Micron would be required to implement BMPs to control the potential for fugitive dust emissions and off- site transport of dust, reduce emissions of air pollutants, control the potential for emissions of volatile chemicals, and minimize the ambient emissions of sulfur compounds. With these avoidance and minimization efforts and compliance with all applicable federal and State regulations as well as permit conditions mandated by NYSDEC, the Proposed Project would not result in significant adverse air quality effects.

Greenhouse Gas (GHG) Emissions, Climate Change, and Climate Resiliency Construction and operation of the Proposed Project and Connected Actions, including indirect, upstream, and downstream activities, land use changes, and induced growth, would result in significant increases in GHG emissions and potentially significant contributions to climate change. The greatest contributing factor to GHG emissions would be the operation of the four fabs at the Micron Campus. The Proposed Project would incorporate project design GHG reduction measures to control and reduce GHG emissions from the manufacturing process. Micron would be required to implement additional BMPs to further avoid and minimize GHG emissions and effects on climate change and climate resiliency during construction and operation. Although Micron has committed to controlling direct GHG emissions to the maximum extent practicable, the Preferred Action Alternative would result in significant adverse effects on climate change. Micron would commit to purchasing 100 percent% carbon-free electricity utilizing power purchase agreements and renewable energy credits (RECs). NYSDEC iswill be reviewing Micron’s Climate Leadership and Community Protection Act (CLCPA) analysis for consistency with New York State’s ability to meet its statewide GHG emission limits. NYSDEC may require additional or revised climate-related mitigation measures under the CLCPA.

The Preferred Action Alternative is not anticipated to present significant climate resiliency risks. The Proposed Project and Connected Actions also would be designed and engineered to withstand effects of the changing climate, in accordance with applicable laws and regulations, and New York State and public utility climate policies.

Solid Waste, Hazardous Waste, and Hazardous Materials The Preferred Action Alternative would result in the generation of substantial quantities of solid and hazardous waste and use of substantial quantities of hazardous materials, primarily associated with the construction and operation of the Micron Campus. Solid waste disposal 0-9 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT facilities in the five-countyCentral New York (CNY) region are anticipated to be able to accommodate the solid waste flows from the Proposed Project with certain permit modifications and expansions. Micron’s reuse, recycle, and recovery (RRR) Program and other waste minimization procedures would also help reduce waste-to-landfill volumes from the Proposed Project.

The Micron Campus would manage hazardous waste in compliance with all applicable federal and State requirements and would contract with private haulers to collect and safely transport hazardous waste to off-site treatment, storage, and disposal facilities authorized to collect such waste, including relevant out-of-state facilities. Micron would further manage hazardous and universal materials through its RRR Program to the greatest extent practicable to reduce the volume of material that would need to be managed as hazardous waste.

Accordingly, the Preferred Action Alternative would not result in significant adverse effects relating to the generation of solid or hazardous waste or the management of hazardous materials. Micron would be required to implement several BMPs to address solid and hazardous waste generation and the use of hazardous materials over time and minimize the amount of waste that is generated and requires disposal. Therefore, significant adverse effects are not anticipated, and no mitigation measures are required.

Human Health and Safety The Preferred Action Alternative, and the construction and operation of the Micron Campus in particular, would pose potential human health and safety risks based on hazards to construction workers and hazards present in the semiconductor manufacturing process. However, Micron would develop and implement a comprehensive set of procedures to manage these risks in accordance with all applicable laws and regulations, and consistent with established environmental health and safety (EHS) programs Micron has implemented at its other facilities. Although potential incidents cannot be ruled out, given the comparatively low incident rate in the semiconductor industry and the risk management programming Micron would implement as part of the Proposed Project, the human health and safety risks to construction workers, employees, and the surrounding community are low. Therefore, the Preferred Action Alternative is not anticipated to result in significant adverse effects on human health or safety.

Micron would be required to implement BMPs to address the potential human health and safety effects of Proposed Project construction and operations, including requiringrequire construction contractors to submit fatigue management plans in the event overtime work is required, maintain a crisis management plan with established mustering locations, maintain onsite Micron emergency response, and partner with local fire and EMS to provide documentation of hazardous materials stored on-site and coordinate emergency response readiness and preparedness. With implementation of these BMPs, the Preferred Action Alternative would not result in significant adverse effects on human health and safety.

Utilities and Supporting Infrastructure The Preferred Action Alternative would likely would have significant effects on electricity and transmission demand in Load Zone C, due to a potentially earlier and greater exceedance of local generation capacity compared to the No Action Alternative. However, long-term grid and

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT transmission planning by the appropriate entities is expected to ensure adequate capacity to meet future electricity demands, regardless of where the generation occurs.

Micron anticipates that over the course of the long-term construction of the Micron Campus the agencies with jurisdiction over New York State’s energy generation and transmission resources will plan and implement measures to meet Micron’s forecasted energy demand and the demands of other users of energy in the State. However, neither Micron, nor the leadfederal or State agencies issuing this EIS, have jurisdiction over regional or statewide planning for future electricity demand (including the future demands of the Proposed Project), or for determining the precise measures that will be undertaken in the future to ensure that those demands are met. The authority for ensuring that such demands are met are delegated to separate State and regional electricity planning entities with their own public administrative and adjudicatory processes. Though the effects of the Preferred Action Alternative are anticipated to be significant, they are not anticipated to be adverse due to the ongoing electricity planning processes.

Although natural gas demand under the Preferred Action Alternative would require system upgrades and expanded infrastructure, coordinated long-term planning between Micron and National Grid is expected to ensure sufficient delivery capacity, resulting in no significant adverse effects on natural gas supply or capacity.

The Proposed Project would have no significant adverse effect on water usage and capacity, as necessary system upgrades, permitting, and infrastructure development led by OCWA and local water authorities are expected to maintain adequate capacity. Wastewater treatment needs, including both sanitary and industrial wastewater, would be accommodated by existing and planned infrastructure, including construction of the IWWTP, avoiding any significant adverse effects on wastewater treatment capacity.

Finally, the Preferred Action Alternative would not result in any significant adverse effects on broadband internet connectivity or telecommunications infrastructure, as existing systems are expected to meet both current and future Proposed Project related and regional demand. Transportation and Traffic The Preferred Action Alternative would result in significant adverse effects on transportation and traffic in the surrounding areas during certain periods of construction and operation. Many of these effects, however, would be addressed through mitigation measures developed with input from agencies with jurisdiction to implement such measures. The years 2027, 2031, and 2041, along with their multimodal effects, were analyzed, as well as recommended mitigation scenarios.

Significant traffic effects are anticipated at intersections and freeway segments in forecast year 2027. No significant transportation improvements are anticipated to be able to be built by 2027 in response to the Proposed Project. The significant effects from traffic would increase as the Preferred Action Alternative construction advances, such that a greater number of intersections and freeway segments would be significantly affected in 2031 and 2041. In the 2041 forecast year, ten segments and 27 intersections would be significantly affected by the Preferred Action Alternative.

If implemented, the recommended mitigation measures listed below would be anticipated

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT to sufficiently mitigate these effects on transportation and traffic for the forecast years 2031 and 2041 below significance levels, except for five intersections for forecast year 2041. Significant effects at these locations were determined to be unmitigable due to the number of improvements already presented by the mitigation measures and the infeasible geometric modifications that would be necessary to mitigate effects below significance levels.

• NYS Route 31 – Widening from one lane to two lanes in each direction between U.S. Route 11 and Morgan Road.

• NYS Route 31/I-81 Interchange – Re-configuring the existing interchange to a Diverging Diamond Interchange (DDI) with three lanes in each direction on NYS Route 31. • Sneller Road/I-81 Interchange – Constructing a new interchange connecting I-81 with Sneller Road and U.S. Route 11.

• U.S. Route 11 – Widening from one lane to two lanes in each direction between NYS Route 31 and Sneller Road.

• New Access Road – Constructing a new four-lane access road (New Access Road) between NYS Route 481 and Caughdenoy Road, north of NYS Route 31, paralleling the CSX railroad.

• New Access Road/NYS Route 481 Interchange – Constructing a new interchange between the New Access Road and NYS Route 481, located just east of the CSX railroad mainline, with a new roundabout at the New Access Road and Maple Road intersection.

• Caughdenoy Road/NYS Route 481 Ramp – Constructing a new access ramp providing additional southbound to westbound movement from Caughdenoy Road to NYS Route 481 with a new roundabout at the intersection of Caughdenoy Road and Maple Road. Ultimately, the recommended traffic mitigation measures are within the jurisdiction of federal, State, and local transportation agencies and would be subject to detailed design and approval, including applicable environmental review, by New York State Department of Transportation (NYSDOT) and Federal Highway Administration (FHWA).

Noise and Vibration Noise from construction and operation of the Micron Campus, Rail Spur Site, and Childcare Site would exceed one or both of the thresholds for significant adverse effects at 51 of the 138 individual sensitive receptors in the noise and vibration study areas closest to the Proposed Project, including an apartment complex and nursing home east of the proposed Micron Campus, five residences north and south of the Rail Spur Site west of Caughdenoy Road, and three residences across the street from the Childcare Site.

To avoid and minimize predicted noise effects, Micron would be required to implement BMPs as part of the Proposed Project, including the use of vibratory drilling as opposed to pile driving, installation of ground level noise barriers and rooftop shielding elements, berms, sound attenuators or low noise packages on equipment, and strategic equipment locations. Even with the proposed BMPs, significant noise effects would exist such that additional noise mitigation

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT measures would be required. Micron has proposed noise mitigation measures to sufficiently reduce these effects to below significance thresholds. Noise barriers would be constructed within the Micron Campus property boundaries to abate significant adverse construction and operation noise, and enclosures would be installed around rooftop equipment on the Micron Campus to abate significant adverse operational noise. Micron also would construct permanent noise barriers on the Rail Spur Site to abate noise from rail spur operations. As needed, additional refinement to these mitigations will be implemented based on noise monitoring to ensure efficacy. Micron would offer to construct temporary noise barriers within its property boundaries for affected property owners and would consult owners about aesthetic considerations, such as landscaping, and for ideas about other potentially effective mitigation measures.

Significant traffic noise effects would be anticipated to occur primarily from traffic on the main roadway corridors to the Micron Campus, including NYS Route 31, Caughdenoy Road, NYS Route 481, and U.S. Route 11. Although noise barriers were considered as a potential noise mitigation measure, in most cases, the construction of noise barriers to mitigate elevated traffic noise is not feasible, because property and driveway access to the roadways must be maintained. All significant construction and operation noise and significant traffic noise at identified receptors associated with the Preferred Action Alternative could be mitigated to below significance thresholds. However, significant traffic noise effects at approximately 520 dwelling unit equivalents could be mitigated to below significance thresholds. These effects would be concentrated in areas directly to the west, south, and east of the Micron Campus and along the main roadway corridors to the Micron Campus, including NYS Route 31, Caughdenoy Road, NYS Route 481, and U.S. Route 11. Nearly all these receivers are located adjacent to and access their properties from these roads. These significant adverse noise impacts are expected to further increase if the recommended traffic improvements are implemented.

Visual Effects and Community Character The Preferred Action Alternative, and construction and operation of the Micron Campus and Rail Spur Site in particular, would be highly visible from certain surrounding areas and would produce noticeable visual effects from multiple viewpoints. Visual effects would be most apparent from viewpoints closest to the Micron Campus, but would become less apparent or would not occur beyond approximately a half-mile distance from the site. Overall, these visual effects would be significant from the standpoint of viewers at closer distances. Separately, there would be no significant aesthetic impacts on any designated aesthetic resources in range of the Proposed Project or Connected Actions. Lastly, the Preferred Action Alternative would result in changes to community character based on the combination of the visual effects, such as increased traffic and noise, and the effects of induced growth (reflecting an overall change from a low-density, rural, and undeveloped area to a site with a large industrial manufacturing facility). However, these changes would be consistent with community character as expressed in local land use regulations, policies, and plans.

Changes in visibility of the Micron Campus would be minimized through required BMPs including significant setbacks, landscaping, and the use of downward directional, shielded, warm white LED lights. All proposed lighting would be designed and installed in accordance with applicable local regulations.

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Community Facilities, Open Space, and Recreation Construction and operation of the Proposed Project would not result in any significant adverse effects on police services, fire services, EMS, healthcare facilities, or schools, nor would construction and operation of the Proposed Project and Connected Actions have any significant adverse effects on open space or recreational resources. The Preferred Action Alternative would not result in significant adverse growth inducing effects on police services, EMS, healthcare facilities, schools, or open space or recreational resources, but would potentially have significant adverse effects on volunteer fire services in the five-county region.

Micron would engage closely and collaboratively with local fire departments, including Clay Fire and Cicero Fire, to familiarize local fire service personnel with any potential Proposed Project construction hazards such as construction site fuel and chemical storage, jointly prepare to implement BMPs for construction fire safety, and ensure compliance with applicable fire protection code requirements. To ensure continuous front-line coverage during construction of the Proposed Project, Micron would continuously employ construction site safety and EHS personnel to respond to and contain a range of construction incidents and would continuously employ its Emergency Response Team (ERT) to address medical incidents. In addition, as part of the construction of the Proposed Project, Micron would establish a dedicated on-site construction occupational health clinic (separate from the proposed Childcare Site healthcare center) staffed with an occupational medical physician, physician’s assistant, registered nurse, licensed nurse practitioner, physical therapist, and other support staff. The ERT would transport injured construction workers or personnel to the construction clinic for medical care, as appropriate. To address the potential significant adverse effect on volunteer fire services due to the induced growth associated with the Proposed Project, including on Clay Fire and the Town of Clay’s fire response capacity, Micron would commit to pay for and support ongoing Micron- related training efforts with Clay Fire and other local fire departments as a mitigation measure. Similarly, Micron would work with Clay Fire to determine any future need for the development of a full-time professional fire service. The determination of future needs planning could be completed through a feasibility study or similar alternative method.

Construction and operation of the proposed Micron Campus and the National Grid Clay Substation Connected Action expansion would require permanent closure of a portion of the Snow Owls Snowmobile Trail that runs through the two properties.

Socioeconomic Conditions The socioeconomic effects of the Preferred Action Alternative would be significant and beneficial. The Proposed Project would generate substantial new economic activity in the local and regional study areas. It is projected that operations of a 4-fab facility would (i) generate over $10 billion in real GDP impacts within the regional study area, (ii) generate additional tax revenues for the local and regional study areas, (iii) invest $500 million in local and regional initiatives that advance identified community needs, (iv) generate over 4,000 on-site construction jobs over the approximately 16-year construction period, and (v) generate over 9,000 permanent on-site operational jobs.

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT In addition to on-site benefits, the Proposed Project’s construction and operational activities would generate off-site economic activity and additional jobs and labor income within industries supporting Micron’s construction, and within governments and businesses supporting workers’ day-to-day spending. It is anticipated that the Proposed Project would generate over $2 billion in induced disposable personal income in the five-county region by 2035 and over $3.3 billion by 2041. By 2045 the Proposed Project would generate demand for nearly 9,500 jobs at regional supply chain businesses and approximately 23,500 jobs at regional governments, institutions, and businesses supporting the growth in regional household spending (approximately 33,000 off-site jobs in total by 2045). This would increase jobs in numerous industry sectors and increase income opportunities for the regional workforce, a significant benefit of the Proposed Project.

The Preferred Action Alternative’s induced housing demand may lead to short-term rent increases and the potential to indirectly displace residents who cannot afford rent increases. Within the local study area, this has the potential to result in a short-term significant adverse socioeconomic effect. Notwithstanding, this short-term potential significant adverse effect will be addressed through the provision of additional affordable housing supply facilitated by investments from the State of New York through Governor Hochul’s long-term statewide housing approach and New York Housing Compact initiatives; and local initiatives like the Onondaga County Housing Initiative Program (O-CHIP) and the OCIDA’s tax exemption program for housing projects. Micron will continue to work with agencies and local stakeholders to identify specific actionable measures to avoid or minimize the potential for this short-term significant adverse effect on the local housing market.

Environmental Justice The potential for adverse effects from construction and operation of the Preferred Action Alternative on low-income and minority communities, as well as disadvantaged communities (DACs), are expected to be limited to within an approximately 5-mile radius around the Proposed Project sites, and a ½ mile of the Connected Actions. When analyzing the associated DAC burdens at or above the 80th percentile, the Preferred Action Alternative would not cause or increase a disproportionate burden from construction or operation of the Proposed Project or Connected Actions. Similarly, in the low-income and minority communities identified within the study area, the Preferred Action Alternative would not cause or increase a disproportionate burden within those communities, except a potential temporary adverse effect on housing and rent pricing. Instead, the Preferred Action Alternative would produce beneficial effects for the local and regional communities, including identified DACs, by generating thousands of new jobs both on- and off-site through business-to-business supply chain services, stimulating local and regional development through induced residential and worker spending, generating additional tax revenues and, over the 20-year term of the Green CHIPS Community Investment Fund (CIF), by investing $500 million in local and regional initiatives that advance identified community needs. The Preferred Action Alterative includes numerous project design elements and BMPs that avoid or minimize potential adverse environmental effects. For certain resource areas, mitigation measures have been proposed to further reduce potential significant adverse environmental effects (e.g., noise, transportation). With these avoidance, minimization and mitigation measures, the Preferred Action Alternative would not cause or increase a disproportionate pollution burden on low-income and minority communities oras well as DACs.

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT

0.5 CUMULATIVE EFFECTS

SEQRA requires a consideration of cumulative effects. Cumulative effects occur when multiple actions affect the same resource(s) or when the incremental effects of a proposed action add to the effects caused by other past, present, and reasonably foreseeable future actions unrelated to the proposed action. Cumulative effects are most likely to arise when a proposed action and other actions are expected to occur in a similar location over a similar time.

Under the Preferred Action Alternative, although most of the environmental effects of the Proposed Project and Connected Actions would generally occur within the vicinity of the Micron Campus, Rail Spur Site, and Childcare Site or within or adjacent to the Connected Actions, the effects of other present or reasonably foreseeable future actions in the local or regional area, when added to the effects of the Proposed Project and Connected Actions, may potentially result in cumulative environmental effects.

Across all the environmental resources analyzed in this EIS, none of the ongoing or future projects with effects that are cumulative with the Preferred Action Alternative would meaningfully alter or amplify the effects of the Preferred Action Alternative, because the Proposed Project and Connected Actions are the most significant drivers of the environmental effects identified in this EIS. None of the other ongoing or future projects, either individually or cumulatively, would transform an otherwise insignificant effect of the Preferred Action Alternative into a significant effect. Nor would any of the other projects, individually or cumulatively, meaningfully exacerbate any significant effect of the Preferred Action Alternative. Accordingly, there are no significant adverse cumulative effects.

0.6 UNAVOIDABLE SIGNIFICANT ADVERSE EFFECTS

The Preferred Action Alternative would have several significant environmental effects that could reasonably be reduced below the level of significance through implementation of identified mitigation measures. Nevertheless, implementation of the Preferred Action Alternative would result in some unavoidable significant effects that cannot reasonably be avoided or mitigated below the level of significance.

Water Resources The Preferred Action Alternative will necessitate the permanent loss of approximately 193.38 acres of federal jurisdictional wetlands (approximately 174.77 acres of which are State jurisdictional wetlands), and approximately 10.5 acres of non-jurisdictional wetlands at the Micron Campus, Rail Spur Site, and Childcare Site, along with the ecosystem services those wetlands currently provide. Micron, the USACE, and NYSDEC are currently developing a mitigation plan required as a part of the CWA Sec. 404 permitting process, which will include compensatory mitigation requirements to offset the loss of wetlands from implementation of the Proposed Project by creating and preserving wetlands (at a ratio of two acres or greater of created wetlands to each acre that is lost) within the watershed of the Proposed Project. Despite these significant mitigation measures, the loss of wetlands at the Micron Campus and Rail Spur Site is deemedconsidered to be an unavoidable significant adverse impact.

The Preferred Action Alternative also would also have significant effects on localized surface water and stream resources despite the implementation of mitigation measures. As a result

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT of the construction of the Proposed Project, most of the existing stream channels currently located in what would become the Micron Campus Site and Rail Spur Site would be lost. Loss of these surface water and stream resources is considered an unavoidable significant effect of the Preferred Action Alternative.

Biological Resources Construction of the Proposed Project and Connected Actions would result in significant adverse effects on biological resources. This would include significant adverse effects on federal and State listed threatened and endangered species, or species proposed for listing, including the Indiana bat, northern long-eared bat, tricolored bat, northern harrier, and short-eared owl. While mitigation has been proposed to address the effects of the Proposed Project through the preservation of critical habitat located off the Micron Campus, the loss of ecological communities, in particular, and the habitat they provide to these species of special concern, is considered to be an unavoidable significant adverse impact of the Preferred Action Alternative.

Climate Change The GHG emissions that would result from construction and operation of the Proposed Project are expected to be unavoidably significant. Even with significant avoidance and minimization efforts as well as mitigation, GHG emissions associated with operation of the Micron fabs and related facilities will represent a significant increase in overall GHG emissions in the five- county regionFive County Area and New York State. Most of these emissions would be the result of natural gas combustion, energy consumption, and process emissions needed for the DRAM manufacturing process. Natural gas combustion, and the resulting GHG emissions, are considered an unavoidable necessity for implementation of the Preferred Action Alternative.

Transportation The traffic effects of the Preferred Action Alternative are anticipated to be significant during construction of the Proposed Project, which is anticipated to be complete and operational in 2041-2042. NYSDOT anticipates having all necessary roadway improvements in place by 2031 to mitigate traffic effects in the County and region. Significant adverse impacts occurring before that time are considered temporary unmitigated impacts.

The transportation effects of the Proposed Project would be substantially mitigated if the relevant traffic authorities implemented recommended Traffic Mitigation Scenario C, which would implement a broad array of traffic improvements specifically designed to reduce the severity of the Proposed Project’s traffic effects, including interchanges, ramps, roadways, and operational equipment upgrades. Implementation of these mitigation measures likely would reduce the traffic effects of the Proposed Project below the level of significance in all but five intersections by 2041, regardless of whether proposed Traffic Mitigation Scenario C is implemented. Those intersections are: (1) NYS Route 31 and I-81 SB Ramp; (2) NYS Route 31 and NYS Route 481 SB; (3) US Route 11 and NYS Route 31; (4) NYS Route 31 and Lakeshore Spur; (5) South Bay Road and NYS Route 31. These significant adverse traffic impacts are considered unavoidable because mitigation below the level of significance would require infeasible roadway reconfiguration. Because it is uncertain whether, or under what circumstances, the recommended Traffic Mitigation Scenario C would be implemented (these measures or similar measures can only be

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT implemented by relevant transportation agencies through separate legal, regulatory, and public processes that are independent from the Lead Agencies and actions considered in this EIS), the Preferred Action Alternative’s transportation effects are presented here as potentially unavoidably significant.

Noise Although noise from construction and operations of the Preferred Action Alternative would be mitigated below significance thresholds primarily through installation of ground-level noise barriers and rooftop enclosures around equipment, the noise effects due to traffic increases associated with the Proposed Project are anticipated to be significant and adverse. Although mitigation will be implemented to the maximum extent practicable, noise associated with traffic cannot be fully mitigated. These unmitigated significant noise impacts are expected to further increase if the recommended traffic measures are implemented.

0.7 IRREVERSIBLE OR IRRETRIEVABLE COMMITMENTS OF

ENVIRONMENTAL RESOURCES

The irreversible and irretrievable commitment of environmental resources to the Preferred Action Alternative consists primarily of resources committed to the physical construction of the Proposed Project, related utility facilities, nonrenewable natural gas resources and other resources consumed by project operations.

The Micron Campus would irretrievably devote approximately 1,000 acres of the 1,377 WPCP and related parcels to approximately five million sq. ft.sf of factory space, associated indoor facilities, and otherwise generally impermeable surface uses. These developable lands would no longer be available for other developments. Wetlands, stream systems, and vegetated areas within the construction area would be irretrievably lost or subsumed in this developed space. Due to the loss of wetlands on site, mitigation areas would be established elsewhere as mandated by the USACE Section 404 and NYSDEC Article 24 permits required to construct the Micron Campus. These mitigation sites would be dedicated to the establishment of additional wetlands. Construction would involve the permanent removal of soil and replacement with approximately nine million cubic yards of fill. Millions of tons of steel and other construction materials would be irreversibly committed to construction of the Proposed Project in these areas and unavailable for other uses.

Operations would necessitate the use of billions of standard cubic feet of natural gas per year, and, depending on the energy mix used to supply the New York Independent System Operator (NYISO) grid over the life of the Proposed Project, any portion of electric supply derived from nonrenewable sources would also represent an irretrievable commitment of nonrenewable energy resources to the Preferred Action Alternative. Though the Proposed Project would utilize and return water to Lake Ontario, which is one of the largest renewable freshwater sources in North America, municipal water supply and wastewater resources would be irretrievably committed to supplying the Proposed Project with fresh water and wastewater delivery, treatment, and disposal. A substantial portion of the water supply, and wastewater infrastructure needed by the Proposed Project will be constructed specifically to meet the demands of the Proposed Project. The resources required to construct these water and wastewater facilities would represent an

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT irretrievable commitment of environmental resources to the Preferred Action Alternative, as would construction of any utility facilities intended for exclusive use by the Proposed Project. These include construction materials associated with OCDWEP’s construction of a new IWWTP for the Proposed Project at the OCDWEP’s Oak Orchard site, expansion of the National Grid Clay Substation and related power line installation to supply the Proposed Project, and gas line and water line infrastructure needed to supply the Proposed Project.

Raw material inputs needed to manufacture the finished DRAM chips also would represent an irretrievable commitment of resources to the Preferred Action Alternative, as would the resources, facilities, and landfill space required to treat and dispose of the solid waste streams associated with the Proposed Project. Construction of the Rail Spur Site and ChildcareChild Care Site similarly would necessitate the irretrievable loss of vegetation, soils, and jurisdictional/non- jurisdictional wetlands, and would occupy developable land that would no longer be available for alternative development. Construction would require the irretrievable commitment of building resources to facilities, roads, loading areas, and impermeable or semi-permeable surfaces that will be unavailable for alternative uses.

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT

1.0 INTRODUCTION

1.0.1 Overview

On August 18, 2023, Micron New York Semiconductor Manufacturing LLC (Micron), a wholly owned subsidiary of Micron Technology, Inc. (Micron Technology), filed an application with the Creating Helpful Incentives to Produce Semiconductors (CHIPS) Program Office (CPO) for direct funding under the CHIPS Incentives Program’s February 28, 2023, Notice of Funding Opportunity (NOFO) for the construction of commercial semiconductor fabrication facilities in Clay New York (CPO, 2023a2023). On December 5, 2024, the U.S. Department of Commerce (Department of Commerce) approved Micron’s application for an award under the NOFO. The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security and is authorized by Title XCIX, CHIPS for America, of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (Pub. L. 116-283), as amended by the CHIPS Act of 2022 (Division A of Pub. L. 117-167) (together referred to as the CHIPS Act). CPO is responsible for implementing the CHIPS Act by providing incentives for investment in semiconductor facilities and equipment in the United States (U.S.).

On June 14, 2023, Micron submitted an application to the Onondaga County Industrial Development Agency (OCIDA) requesting certain financial assistance within the meaning of New York General Municipal Law § 854(14). Micron’s application, as amended and restated, includes the lease and eventual purchase of the White Pine Commerce Park (WPCP) in Clay, New York and the undertaking of potential property condemnation pursuant to the New York Eminent Domain Procedure Law (EDPL)..

OCIDA is authorized and empowered by the provisions of Chapter 1030 of the 1969 Laws of New York, constituting Title 1 of Article 18-A of the General Municipal Law, Chapter 24 of the Consolidated Laws of New York, as amended, Chapter 435 of the Laws of 1970 of the State of New York and Chapter 676 of the Laws of 1975 of the State of New York, as amended, constituting Section 895 of said General Municipal Law to promote, develop, encourage, and assist in the acquiring, constructing, reconstructing, improving, maintaining, equipping, and furnishing of manufacturing, warehousing, research, commercial, and industrial facilities, among others, for the purpose of promoting, attracting, and developing economically sound commerce and industry to advance the job opportunities, health, general prosperity, and economic welfare of the people of the State of New York, to improve their prosperity and standard of living, and to prevent unemployment and economic deterioration. Under this authority, OCIDA acquired and created the WPCP, located at 5171 Route 31, in the Town of Clay, NY 13041, and expanded it to attract large- scale, high-value, and high-tech manufacturing industries that will provide high-paying, sustainable jobs to Onondaga County.

The State of New York is committed to creating 21st century jobs and becoming a global capital for semiconductor manufacturing. New York’s Green CHIPS Program provides a State- level companion incentive program to the Federal CHIPS Incentives Program by offering up to $10 billion in economic incentives to locate new, cutting-edge semiconductor manufacturing and supply chain projects within the state. In addition, New York’s Green CHIPS Excelsior Jobs Tax Credit Program provides certain semiconductor manufacturer tax incentives that are intended to 1-1 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT help attract thousands of jobs and billions of dollars to establish New York as a leader in domestic re-shoring of semiconductor manufacturing. To receive benefits from this tax credit program, a project must be within the semiconductor manufacturing industry, invest at least $3 billion in the State over a 10-year period, create 500 new jobs per project, make commitments to worker and community investments, and include sustainability measures to mitigate the project’s greenhouse gas emissions over its lifetime.

Micron’s proposed activities under Micron’s funding applications to CPO and OCIDA, described below, are collectively referred to in this EIS as the “Proposed Project.” Because CPO and OCIDA determined, during their examination of Micron’s respective applications, and in the case of OCIDA, Part 1 of Micron’s Environmental Assessment Form, that the proposed activities in the applications have the potential to result in at least one significant adverse effect on the environment, CPO and OCIDA prepared this EIS to evaluate the potential environmental effects3 of the Proposed Project pursuant to the requirements of the National Environmental Policy Act of 1969 (NEPA), 42 U.S.C. § 4321 et seq., and the State Environmental Quality Review Act (SEQRA), as codified at N.Y. Envtl. Conserv. Law § 8-0101 et seq. and its implementing regulations at 6 N.Y.C.R.R. Part 617.

The Proposed Project would involve the construction and operation of a semiconductor manufacturing facility with four semiconductor fabrication buildings (“fabs”) at the WPCP

location. The Proposed Project would primarily consist of: (1) construction of the Micron Campus, including the four fabs, ancillary support facilities, ingress and egress roads, driveways, and parking, within a site totaling approximately 1,377 acres; (2) construction of a rail spur and construction material conveyance facility on approximately 38 acres west of 8625 Caughdenoy Road in Clay, NY 13041, to support construction of the Micron Campus (the “Rail Spur Site”); (3) construction of a childcare center, healthcare center, and recreational center on an approximately 31-acre parcel located at 9100 Caughdenoy Road, Brewerton, NY 13029, to support the estimated 9,300 employees who would ultimately work at the completed Micron Campus (the “Childcare Site”); and (4) leasing of 360,000-500,000 square feet (sq. ft..) of existing warehouse space in an industrially zoned area at a location to be determined within 20 miles of the Micron Campus (the “Warehouse Site”). In addition, implementing the Proposed Project would require several utility and infrastructure improvements to meet its electricity, natural gas, water supply, wastewater, and telecommunications needs (the “Connected Actions”).

Chapter 2 of this EIS provides a comprehensive overview of the various components of the Proposed Project and Connected Actions, and discusses CPO’s and OCIDA’s consideration of alternatives. Chapter 3 of the EIS describes the affected environment and analyzes the environmental effects of the Proposed Project and Connected Actions, as well as a No Action Alternative. Chapter 4 analyzes the cumulative environmental effects of the Proposed Project and Connected Actions and the No Action Alternative.

Figure 1.0-1 below shows the Proposed Project’s location in Central New York. 3 For purposes of this EIS, the terms “impacts” and “effects” are synonymous.

1-2 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Figure 1.0-1 Proposed Project Location Map Source: Light Gray Canvas (Esri, 2025a): Esri, TomTom, Garmin, FAO, NOAA, USGS, © OpenStreetMap contributors, and the GIS User Community.

1-3 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Source: Micron Technology.

1-4 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Construction of the Proposed Project would take place over approximately 16 years. Subject to the receipt of CPO and OCIDA authorizations and all other applicable permits, authorizations, and approvals, Micron would mobilize for initial site preparation for the Proposed Project beginning in the fourth quarter of 2025, with the first two fabs (Fabs 1 and 2) estimated to be operational by 2029 and 2030, respectively, and the remaining fabs (Fabs 3 and 4) estimated to be operational by 2035 and 2041, respectively. The manufacturing facility as a whole would ramp up to full production output by 2045. The Proposed Project would be supported by more than $100 billion of private investment over the course of the next two decades, with a first phase of investment of $20 billion planned by the end of this decade (Micron Technology, 2022).

1.0.2 State and Local Background

Central New York and other regions of New York State have experienced a reduction in manufacturing jobs over several decades. In response, starting in the early 1990s, OCIDA and the City of Syracuse started to study potential sites for locating industrial businesses in Onondaga County to increase manufacturing employment. The WPCP was ultimately selected due to its proximity to water and energy infrastructure and highway access, and its zoning classification. OCIDA’s intent in forming the WPCP was buttressed in 1998 with the inception of the New York high-tech Semiconductor Manufacturing Initiative (SEMI-NY) program, a comprehensive effort to encourage semiconductor manufacturing in the State. Thereafter, following decades of unsuccessful efforts to develop the WPCP, OCIDA increased the size of the WPCP to make it more attractive to a broader scope of industries, particularly the semiconductor industry, and bring high-tech and high-paying jobs to Onondaga County.

OCIDA previously conducted multiple studies of the WPCP. In 2021, OCIDA prepared, as lead agency under SEQRA, a Final Supplemental Generic Environmental Impact Statement (SGEIS) that evaluated the contemplated expansion and development of the WPCP for semiconductor manufacturing. As OCIDA determined in its Findings Statement for the SGEIS, high-tech advanced manufacturing holds the promise of transforming the Onondaga County economy through new high-paying jobs, significant financial investment, and increased economic activity, including: (1) the creation of thousands of construction jobs and up to approximately 50,000 permanent jobs; (2) a robust supply chain of companies that will service a high-tech advanced manufacturing organization; (3) a reduction in poverty; and (4) secondary benefits such as increased local small business activity, growth in community civic and cultural organizations, and increased county and municipal investment.

As noted above, OCIDA is authorized to develop commerce and industry and advance job opportunities in the State of New York. To accomplish its stated purposes, OCIDA is authorized to grant financial assistance in connection with the acquisition, construction, and equipping of one or more projects. Accordingly, OCIDA is considering financial assistance for the Proposed Project, the use of eminent domain, and the lease and subsequent sale of the WPCP to Micron to construct and operate the Proposed Project.

Also as noted above, New York State has committed to attract new semiconductor manufacturing and related material supplier projects to the State through measures such as the New York Green CHIPS Program and the Green CHIPS Excelsior Jobs Tax Credit Program. New York State is considering providing financial support and tax incentives to Micron under the Green CHIPS Act and the Green CHIPS Excelsior Jobs Tax Credit Program to support construction and 1-5 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT operation of the Proposed Project within New York State.

1.1 PURPOSE AND NEED

This EIS will support decision-making among the Federal, State, and local agencies responsible for evaluating the Proposed Project pursuant to their respective legal and regulatory authorities. In accordance with NEPA, this section states the purpose and need for CPO’s proposed action relating to the Proposed Project. In accordance with SEQRA, this section also states Micron’s purpose and need for the construction and operation of the Proposed Project.

1.1.1 CPO Purpose and Need

On December 10, 2024, the Department of Commerce announced final direct funding awards of up to $6.165 billion under the CHIPS Incentives Program to support Micron Technology’s plans to construct two semiconductor manufacturing facilities in New York and one semiconductor manufacturing facility in Idaho (Department of Commerce, 2024). On June 12, 2025, the Department of Commerce announced a final direct funding award of up to $275 million under the CHIPS Incentives Program to support Micron Technology’s plans to expand and modernize a semiconductor manufacturing facility in Virginia and an amendment to the original agreement to include one additional semiconductor manufacturing facility in Idaho. The disbursement of Federal financial assistanceawards under the terms of the CHIPS Incentives Program final award to Micron for Micron’s Proposed Project in Clay, New York (referred to in this FinalDraft EIS as CPO’s “Proposed Action”) is subject to Micron’s completion of certain Proposed Project milestones, including the requirement for Micron to obtain certain applicable permits, authorizations, and approvals for the Proposed Project. The disbursement of Federal financial assistanceawards for the Proposed Project is subject to CPO’s completion of a Final EIS and issuance of a Record of Decision (ROD) under NEPA.

The purpose and need for CPO’s Proposed Action are to fulfill the Department of Commerce’s statutory responsibilities under the CHIPS Act, including the requirement to provide Federal financial assistanceawards to covered entities4 to incentivize investment in facilities and equipment in the U.S. for the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment.5 In awarding CHIPS direct funding, the Department of Commerce must give priority to ensuring that a covered entity receiving such funding will: (1) manufacture semiconductors necessary to address gaps and vulnerabilities in the domestic supply chain across a diverse range of technology and process nodes; and (2) provide a secure supply of semiconductors necessary for the national security, manufacturing, critical infrastructure, and 4 The term “covered entity” means a nonprofit entity, a private entity, a consortium of private entities, or a consortium of nonprofit, public, and private entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment. 15 U.S.C. § 4651(2).

5 15 U.S.C. § 4652(a)(1).

1-6 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT technology leadership of the U.S. and other essential elements of the economy of the U.S.6 Pursuant to these statutory responsibilities, the Department of Commerce considers applications under the CHIPS Incentives Program NOFO for commercial semiconductor facilities consistent with several program priorities, including economic security, national security, and commercial viability (CPO, 2023a, pp. 13-17).2023, p. 13-17). The Department of Commerce gives priority under the NOFO to applications for mature-node facilities that support the resilience of semiconductor supply chains for critical manufacturing industries in the U.S., including computer and electronics manufacturing facilities (CPO, 2023 p 16, 74-75). This category includes leading-edge facilities that manufacture logic or memory chips7 that utilize the most advanced front-end fabrication processes and achieve the highest transistor and power performance. For memory chip production, this includes facilities capable of producing three-dimensional “not-and” (3D NAND) flash memory technology (also known as vertical NAND or V-NAND) that stacks memory cells vertically in multiple layers, which enables production of faster, more efficient, and more energy-saving memory and dynamic random-access memory (DRAM) chips (CPO, 2023a). Memory chips using DRAM technology have crucial applications in military equipment, cybersecurity technology, the aerospace industry, artificial intelligence (AI), and other cutting- edge uses, as well as more common areas of the domestic consumer economy.8 However, the global structure of the semiconductor supply chain is vulnerable to critical points of failure that create the risk of geopolitical tensions and large-scale supply interruptions, which could impair access to suppliers or customers. For example, South Korea currently has a 44 percent share of the global memory chip market. Therefore, expanding or “onshoring” domestic advanced semiconductor manufacturing capacity in key areas such as memory is critical to enhancing the resilience of the U.S. semiconductor supply chain to potential global disruptions (Varas et al., 2021). This need is particularly critical given that current DRAM production in the U.S. represents less than one percent of global DRAM production (Tech Insights, 2024). Accordingly, incentivizing expanded domestic DRAM production to a level sufficient to offset potential disruptions to U.S. economic and national security is a key Department of Commerce responsibility under the CHIPS Act.

Incentivizing sufficient domestic DRAM production for U.S. economic and national security purposes means that a domestic manufacturing facility must achieve similar scale to global competitors, which can only be accomplished by grouping multiple fabs into a close geographical

location to ensure efficient infrastructure costs and an efficient upstream supply chain. The global DRAM market is highly competitive, with producers competing to supply primarily standardized 6 Id. § 4652(a)(2)(D).

7 Semiconductors are the foundational material used in the manufacturing of chips, such as logic or memory chips, which are then integrated into electronic devices.

8 Micron Technology anticipates that DRAM produced by the Proposed Project would have uses in high bandwidth memory applications supporting AI technology, automotive safety systems such as computerized self -driving safety systems and braking, industrial platforms such as telecommunications, enterprise servers, and drones, and a wide array of consumer products, including PCs and mobile devices. See, e.g., Micron Technology, Markets and Industries, https://www.micron.com/markets-industries. Micron Technology anticipates that the Proposed Project would enable increased DRAM supply for military and defense applications over time by being the sending-site for future technology transferssupplying leading-edge chips for the planned expansion of Micron Virginia’s facility. 1-7 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT DRAM products under high initial fixed production cost constraints. DRAM production viability therefore depends on production at a scale large enough to achieve globally competitive marginal production cost and long-term commercial viability.

According to the National Institute of Standards and Technology (NIST) report titled Vision for Success – Commercial Fabrication Facilities, “[u]nlike logic chips, memory products are standardized and often interoperable: A memory chip from one company can typically substitute for a memory chip from another. These features generally increase the resiliency of the memory market, as memory customers willing to pay the prevailing market price can often source their products from any memory producer in the market. Memory chipmakers must thus compete largely on price and operate at lower margins relative to logic chipmakers. U.S. memory producers will therefore need to reach sufficient scale to benefit from the economies of scale enjoyed by larger clusters in East Asia.” (CPO, 2023b). In keeping with these trends, leading global DRAM competitors in East Asia have announced plans to produce memory chips in multiple fab clusters of increasing scale.9 The complexity of the semiconductor wafer10 manufacturing process is the primary driver of the need for larger logic and memory fab clusters that co-locate larger cleanrooms11 on a single campus to facilitate necessary economies of scale. Fabs require an increasing amount of cleanroom space per wafer over time to accommodate the more sophisticated and larger tools needed for more advanced DRAM production. The cost of producing a wafer also depends on fixed costs of cleanroom and fab supporting infrastructure (e.g., site preparation, utilities, gas and chemical storage, and warehouse and office space) and the average operating cost per wafer (e.g., cost of services, labor and workforce training, warehousing, and upstream supplier service contracts). In general, co-locating more fabs with larger cleanroom spaces on a single site reduces both the fixed cost per wafer produced and the average operating cost per wafer.

Accordingly, viability in the industry depends on the construction of large fab clusters, or megafabs, on single campuses, with average fab sizes sufficient to accommodate necessary cleanroom space for specific technology types. 82 percent of major semiconductor memory campuses have more than two fabs (with fab sizes of 1.2 million sq. ft. or greater and cleanroom sizes of 600,000 sq. ft. or greater), and 55 percent have more than three fabs (1.8 million sq. ft. or greater). 72 percent of such campuses established in the past 20 years were built with more than three fabs to achieve increasingly necessary economies of scale. For additional discussion of the factors that drive semiconductor memory campus sizing and configuration, see Appendix A-1. Currently, Micron Technology manufactures all DRAM produced in the U.S. (less than one percent of global DRAM production). These DRAM chips serve certain industrial markets and cannot support new AI technology use cases. To meet CHIPS Incentives Program objectives, Micron Technology proposed to increase its U.S.-based DRAM production by a factor of 12 (i.e., 9 SK hynix has proposed a 4-fab DRAM cluster in Yongin, South Korea estimated to be completed by 2042 (Shilov, 2024). Samsung has proposed a 6-fab DRAM and advanced logic cluster in Yongin, estimated to be completed by 2047 (Ko, 2024).

10 A wafer is a thin slice of semiconductor material used in fabricating chips.

11 A cleanroom is a highly advanced semiconductor design, manufacturing, or testing space built to extremely precise engineering specifications, including strict filtration, temperature, and humidity controls. 1-8 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT to approximately 12 percent of global DRAM output) over the next two decades, which would also bring Micron Technology’s overall supply in line with industry demand growth trends (Micron Technology, 2023). Figure 1.1-1Figure 1.1-1This production increase is not achievable through modernizations and expansions at existing domestic Micron locations alone and would necessitate the construction of a new semiconductor manufacturing campus. illustrates Micron Technology’s proposal to increase the U.S. share of global DRAM manufacturing capacity to a level that meets the U.S. need for domestically produced memory chips.

Figure 1.1-1 Micron Technology Proposal to Increase U.S. DRAM Production Source: Tech Insights (2024); Micron Technology estimates. Percentages are approximations and account for production at all three Micron domestic sites.

As part of its merits review of Micron’s application, the Department of Commerce determined that Micron’s proposal for the construction of a new semiconductor manufacturing campus would achieve domestic memory production at the scale necessary to offset potential disruptions to U.S. economic and national security from the risks described above. Although the Department of Commerce’s final award to Micron only includes direct funding to support Micron’s construction and operation of Fabs 1 and 2 by 2029 and 2030, respectively, the Department of Commerce based its award decision on Micron’s proposal to establish a full 4-fab cluster by 2041 (which would ramp up to full operational capacity by 2045).

The Department of Commerce’s funding award for the construction of a semiconductor memory facility is based on two factors: (1) the amount of cleanroom space that would be required to achieve an economically viable domestic memory chip output sufficient to meet U.S. economic and national security objectives, based on economic modeling; and (2) by extension, the amount 1-9 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT of total building area and site configuration that would be required to support that cleanroom space, accounting for technological, logistical, and cost considerations.

First, based on Micron’s economic model supporting its CHIPS application, the Department of Commerce determined that Micron would need to construct 2.4 million sq. ft. of cleanroom space capable of producing an average the short-term manufacture of 13,000 DRAM wafers per week starting in 2028 and increasing to 52,000 wafers per week over the life of the projectby 2045 to achieve the level of domestic memory chip output sufficient to meet U.S. economic and national security objectives. This output and associated cleanroom space requirement is based on Micron’s sources and uses information submitted in support of its CHIPS application, including economic modeling and estimates that Micron prepares as part of its annual long-range Sales and Operations Planning (SNOP) process. Micron uses its SNOP process to forecast overall memory sector market growth based on market intelligence, macro trends from new technologies such as AI, virtual reality, 5G wireless proliferation, and many other factors. Based on its product mixes and technological capabilities, such as the number of bits it can manufacture per wafer, Micron then determines how many wafers would be required to meet DRAM market demand, which in turn determines the cleanroom space required to meet that demand.12 Second, the Department of Commerce determined that Micron would need to construct four fabs co-located at a single site with sufficient supporting infrastructure and utility capacity in order to accommodate the 2.4 million sq. ft. of cleanroom space necessary to achieve the required level of domestic DRAM production in a configuration that would be technically and economically practicable. Due to the nature of the technology, infrastructure, and utilities needed to support advanced cleanrooms, semiconductor fabrication facility building space ranks among the most expensive types of real estate globally by cost per square foot. This constraint requires large-scale semiconductor facilities to be simultaneously: (a) large enough to achieve a utilization rate of their expensive facility infrastructure capable of justifying their capital cost, known as the capital asset utilization (CAU) rate; and (b) compact enough with buildings efficiently designed to meet precise sizing, engineering, and interoperability specifications while minimizing overall building, utility, and equipment costs.13 Based on the above considerations and Micron’s sources and uses information submitted in support of its CHIPS application, the Department of Commerce determined that without the 12 AI workloads require high-bandwidth memory (HBM) chips, which take more steps to produce than traditional DRAM chips, such as double-data rate (DDR) 4 and DDR 5 products. HBM products require more manufacturing steps due to their speed requirements, the need to stack HBM chips into modules using Through-Silicon-Via technology, and other performance requirements. Each AI module (i.e., an AI product containing a logic chip plus memory chips) requires dozens of HBM chips. Micron plans to manufacture a mix of t hese products in NY, and the HBM requirements for these products are anticipated to create upward pressure on the amount of cleanroom space required to meet the growing market demand, which is why Micron has announced an additional fab in Idaho (Narasimhan, 2024).

13 Additionally, Micron projects that have been announced for Virginia and Idaho are co-located with Micron’s existing manufacturing and R&D/Headquarters respectively. These expansion projects do not rely on the same efficiencies of scale that are required for the construction of a greenfield site like the Proposed Project. Unlike the Proposed Project, the expansion projects can rely on existing infrastructure, site components and existing cleanroom space.

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT ability to build four co-located fabs, Micron’s proposal would incur prohibitive additional costs and operational inefficiencies, which would likely force Micron to withdraw its application and pursue a memory campus in a lower-cost geography outside of the U.S. Therefore, the Department of Commerce determined that a 4-fab memory campus with an efficient layout at a single location would be required to ensure an economically and commercially viable operation that would meet the Department of Commerce’s economic and national security responsibilities under the CHIPS Act.

Figure 1.1-2Figure 1.1-2 below shows the competitive position the Proposed Project’s fabs would occupy compared to major competitors, based on total campus cleanroom space. The x-axis shows each competitor’s campus location, and the y-axis shows the campus cleanroom space in sq. ft. The figure shows an alternating progression of companies building larger campuses as they work to stay ahead of the competition, reflecting a market trend that has since surpassed 2-fab and 3-fab campuses (1.2-1.8 million sq. ft. of cleanroom space) toward campuses crossing the 4-fab threshold (2.4 million sq. ft. or more of cleanroom space). Competitors also are continuing to add capacity to existing campuses over time.

Figure 1.1-2 Proposed Project and Competitor Campus Cleanroom Space

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Sources: Micron Technology (n.d.);; SEMI World Fab Forecast Report (SEMI, 2025). Note: estimates assume standard large memory campus fab cleanroom sizes of 600,000 sq. ft.

In sum, CPO considered the totality of the specific memory chip factors described above as part of its decision-making process under the CHIPS Act, including the risks to national and economic security posed by a lack of U.S.-based large-scale memory chip production capacity, and the fab cluster and size benchmarks necessary to establish a technologically and economically viable domestic memory chip production capacity.

1.1.2 Micron Purpose and Need

As noted above, this section states Micron’s purpose and need in accordance with SEQRA. Micron’s purpose and need for the Proposed Project are to construct and operate a state-of-the-art, economically viable semiconductor manufacturing facility. In coordination with CPO and OCIDA, and based on its SNOP process, Micron determined that the only feasible method of establishing an economically viable large-scale memory chip production facility in the U.S. would be to develop a 4-fab facility on a single site capable of efficiently increasing Micron’s U.S.-based DRAM production 12-fold from current levels to 52,000 wafers per week, which also would ensure a resilient domestic supply of DRAM chips consistent with CHIPS Incentives Program and New York Green CHIPS Program objectives.

Micron identified the WPCP as a suitable location for the Proposed Project based on the site’s ability to accommodate a 4-fab footprint and its proximity to the utility, transportation, and human resources infrastructure necessary to achieve the economies of scale the Proposed Project would require. Accordingly, Micron proposes to lease and ultimately purchase the WPCP from OCIDA and to construct and operate a 4-fab facility at that location.

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT

1.2 PREPARATION OF THE EIS

CPO and OCIDA jointly prepared this FinalDraft EIS to evaluate the potential environmental effects of the Proposed Project as required under NEPA and SEQRA. Specifically, CPO prepared the EIS to identify and assess the reasonably foreseeable environmental effects of the Proposed Action and a reasonable range of alternatives, facilitate public involvement and informed agency decision-making, and recommend appropriate mitigation measures. OCIDA prepared the EIS to consider the environmental effects of the Proposed Action and alternatives equally with social and economic factors before it or any involved State or local agency may issue SEQRA findings and exercise discretionary decision-making or funding authority with respect to the Proposed Project, and to propose mitigation measures to avoid or minimize adverse environmental effects to the maximum extent practicable.

CPO and OCIDA agreed to act as joint lead agencies under NEPA and SEQRA. The U.S. Army Corps of Engineers (USACE) and the U.S. Environmental Protection Agency (USEPA) agreed to act as cooperating agencies under NEPA based on their jurisdiction by law and special expertise with respect to evaluating the environmental effects of the Proposed Action and alternatives. The FHWA and the U.S. Fish and Wildlife Service (USFWS) agreed to act as participating agencies in the development of the EIS. The Onondaga Nation agreed to be a participating entity in the development of the EIS. OCIDA coordinated input from several State and local agencies into the EIS. The EIS provides a basis for coordinated Federal, State, Tribal, and local input and review in a single document. The following sections describe the specific roles of each entity in the environmental review process.

1.2.1 Lead and Cooperating Agencies

1.2.1.1 CHIPS Program Office

On behalf of the Department of Commerce, CPO is responsible under the CHIPS Act for determining whether to provide Federal funding to Micron to support the Proposed Project. CPO has special expertise in evaluating the environmental effects of semiconductor manufacturing and is the lead Federal agency responsible for preparing this EIS under NEPA. CPO also is the lead agency for purposes of consultations under Section 106 of the National Historic Preservation Act (NHPA) and Section 7 of the Endangered Species Act (ESA).

1.2.1.2 Onondaga County Industrial Development Agency

OCIDA is the lead agency responsible for preparing this EIS under SEQRA, based on its role in the proposed lease and subsequent sale of WPCP to Micron, the potential granting to Micron of financial assistance within the meaning of New York General Municipal Law § 854(14), and the potential undertaking of property condemnation pursuant to the New York EDPL.Eminent Domain Procedure Law. OCIDA is also coordinating input from other State and local agencies. 1.2.1.3 U.S. Army Corps of Engineers USACE has jurisdiction and authority under Section 404 of the Clean Water Act (CWA), which regulates the discharge of dredged or fill material into waters of the U.S., and Section 10 of

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT the Rivers and Harbors Act, which regulates work or structures in, over, or under navigable waters of the U.S. USACE agreed to act as a cooperating agency in the preparation of the EIS so that it may rely on the content of the EIS and its appendices for making permit decisions regarding discharges of dredged or fill material into waters of the U.S. associated with the Proposed Project and the Connected Actions. The Proposed Project would occur within the USACE Great Lakes and Ohio River Division, Buffalo District. Staff from the Buffalo District cooperated with the lead agencies to prepare the EIS.

USACE will obtain the views of Tribal Nations, natural resource agencies, and the public prior to reaching its decisions on the Proposed Project. As an element of its review, USACE must consider whether the Proposed Project represents the least environmentally damaging practicable alternative, which requires the avoidance, minimization, and mitigation of unavoidable impacts on waters of the U.S. The EIS contains information USACE may use to support this review. USACE will decide whether to adopt the EIS based on an independent review of the document and whether it satisfies USACE’s comments. USACE may prepare a separate ROD to formally document its decisions with respect to the Proposed Project, including decisions based on CWA Section 404(b)(1) analyses and environmental mitigation commitments.

1.2.1.4 U.S. Environmental Protection Agency USEPA agreed to act as a cooperating agency in the preparation of the EIS. Pursuant to Section 309 of the Clean Air Act (CAA), USEPA is responsible for reviewing and commenting in writing on the environmental effects of the Proposed Action and alternatives identified in the EIS. USEPA also has regulatory responsibilities under the CWA Section 404 and Section 401 water quality certification processes and is responsible for reviewing Micron’s applications for CAA Title V facility operating permits.

1.2.2 Participating Agencies and Entities

1.2.2.1 Federal Highway Administration

FHWA agreed to act as a participating agency in the preparation of the EIS based on its special expertise in analyzing transportation and traffic studies and analyses.

1.2.2.2 U.S. Fish and Wildlife Service USFWS agreed to act as a participating agency in the development of the EIS based on its special expertise in evaluating effects on aquatic and terrestrial wildlife and their habitats. Pursuant to the ESA Section 7 consultation process, CPO is consulting with USFWS to ensure that the Proposed Action is not likely to jeopardize the continued existence of any Federally listed threatened or endangered species or destroy or adversely modify designated critical habitat. As part of the Section 7 consultation process, USFWS will prepare a Biological Opinion concerning the take of Federally listed species.

1.2.2.3 Onondaga Nation

The Onondaga Nation elected to participate in the development of the EIS as a participating

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT entity, to contribute its Indigenous Knowledge and special expertise in Haudenosaunee and Onondaga culture and the interrelationship of the natural world in this geographic area.

1.2.3 State and Local Agencies

OCIDA determined that the Proposed Project is a Type I action under SEQRA requiring the preparation of an EIS and a coordinated review among all involved and interested State and local agencies.14 As lead agency under SEQRA, OCIDA considered the interests and concerns of all such agencies and coordinated their input in the EIS. Table 1.2-1Table 1.2-1 lists the State and local involved and interested agencies and their roles with respect to the Proposed Project. Table 1.2-1 State and Local Involved and Interested Agencies Agency Role Involved Agencies New York State Department of Responsible for permits and authorizations related to air quality, Environmental Conservation wetlands, threatened and endangered species, water withdrawal, (NYSDEC) coastal erosion management, water discharges from on-site and off- site land disturbance, discharges associated with industrial activity, direct discharge to New York State waters, CWA Section 401 water quality certification, hazardous substance petroleum and chemical bulk storage, and importation of fill material. Empire State Development, Responsible for review and approval Micron’s Green CHIPS and including the New York State Excelsior Jobs Tax Credit Program applications. Department of Economic Development and the New York State Urban Development Corporation (ESD) New York Department of State Responsible for issuing decision on Coastal Zone Management Act (NYSDOS) (CZMA) Federal consistency.

New York State Department of Operates and maintains the State transportation system that would Transportation (NYSDOT) serve the Proposed Project. Responsible for assessing Proposed Project effects on State transportation facilities, evaluating proposed mitigation measures, and issuing permits for work affecting State highways, such as highway work permits and use and occupancy permits.

New York State Office of Serves as the State Historic Preservation Officer for purposes of Parks, Recreation and Historic NHPA Section 106 consultation.

Preservation (OPRHP) New York Office of General Responsible for construction permit and easement to occupy Services (NYSOGS) underwater lands.

New York Power Authority Responsible for approving ReCharge NY program and high-load (NYPA) factor energy allocations for the Proposed Project. 14 See 6 NYCRR § 617.6(b)(3).

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT New York State Canal Responsible for issuing use and occupancy permits, easements, and Corporation work permits related to water line crossings.

Onondaga County Department Operates and maintains the County transportation system that would of Transportation (OCDOT) serve the Proposed Project. Responsible for assessing Proposed Project effects on County transportation facilities, evaluating proposed mitigation measures, and issuing permits for work affecting County highways, such as work permits and use and occupancy permits.

Onondaga County Water Responsible for expanding capacity of and extending potable water Authority (OCWA) lines to serve the Proposed Project.

Considering proposed water supply system upgrades and installation of new water transmission mains to serve the Proposed Project. Onondaga County Department Responsible for development and construction of proposed new of Water Environment industrial wastewater treatment plant (IWWTP) and industrial Protection (OCDWEP) wastewater and reclaimed water conveyance to serve the Proposed Project.

Responsible for submitting application to NYSDEC for modification of OCDWEP Oak OrchardOnondaga Wastewater Treatment Plant (OOWWTPOWWTP) site’s State Pollutant Discharge Elimination System (SPDES) permit, including permit modifications associated with any on-site water reclamation treatment processes. Responsible for decisions pertaining to OCDWEP industrial pretreatment program as approved by USEPA.

Town of Clay Town Board Responsible for zoning amendments, special use permits, and discontinuance of Town road.

Town of Clay Planning Board Responsible for site plan / subdivision approval (re-subdivision of multiple parcels) and municipal separate storm sewer system and Stormwater Pollution Prevention Plan (SWPPP) approval. Town of Cicero Planning Board Responsible for subdivision approval.

Interested Agencies New York State Department of Responsible for approval of Article VII application for proposed Public Service (NYSDPS) / National Grid electric transmission electricity improvements and New York State Public Service 401 water quality certification (see Section 3.3, Water Resources). Commission (NYSPSC) New York State Energy Collaborating with ESD in review of Micron’s Green CHIPS and Research and Development Excelsior Jobs Tax Credit Program applications.

Authority (NYSERDA) Onondaga County Department General consultation.

of Planning City of Syracuse General consultation.

Syracuse Metropolitan General consultation and approval actions to add to official regional Transportation Council transportation plans.

(SMTC)

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Town of Cicero Town Board Referral per General Municipal Law.

1.3 PUBLIC REVIEW AND COMMENT

1.3.1 SEQRA Scoping

After OCIDA received an Application for Financial Assistance from Micron, it held a public meeting and circulated a notice of intent to all involved agencies to serve as SEQRA lead agency on July 28, 2023. No objection to that notice was received during the subsequent 30-day comment period. On September 14, 2023, OCIDA issued a Positive Declaration indicating the need for an EIS and scheduled a public scoping meeting to be held on October 11, 2023. The Notice of SEQRA Positive Declaration, Availability of Draft SEQRA Scope, and Public Scoping Session was published in the Environmental Notice Bulletin on September 20, 2023. Notice of the public scoping meeting was placed in The Post Standard (Syracuse.com), the primary newspaper of general circulation serving the Central New York region, on September 19, 2023. OCIDA posted the Draft SEQRA Scope and information on the Proposed Project on its website (https://ongoved.com/).

The comment period for the SEQRA scoping process was extended beyond the required 30 days from September 20, 2023, to October 31, 2023. During this period, OCIDA held the public scoping meeting at 6:30 p.m. on October 11, 2023, to obtain input from the public. Everyone who registered or asked to speak was given the opportunity to submit a verbal comment. The scoping meeting provided simultaneous Spanish and American Sign Language interpretation; no additional language translation services or special needs assistance were requested. Comments also were accepted during the scoping period via electronic mail to micron@ongov.net and via U.S. Mail, Attn: Micron Project, Onondaga County Industrial Development Agency, 335 Montgomery Street, 2nd Floor, Syracuse, NY 13202.

In total, 39 individuals, organizations, and agencies provided comments during the public comment period, including written comment letters from USFWS and NYSDEC. OCIDA considered each comment received during the SEQRA scoping period to determine the final scope of the Draft EIS under SEQRA and inform the related technical analyses and environmental resources to be evaluated. On December 14, 2023, OCIDA adopted the Final SEQRA Scope, which was made available to the previously noticed agencies and posted on OCIDA’s website. A copy of the Final SEQRA Scope is included in Appendix A-2.

1.3.2 NEPA Scoping

USACE was initially the lead Federal agency for the Proposed Project under NEPA and published a Notice of Intent (NOI) to Prepare an EIS and conduct a public scoping meeting in the Federal Register on March 5, 2024. USACE also mailed 191 scoping letters to interested parties and stakeholders, including: adjacent property owners to the proposed Micron Campus; elected State, County, City, and Town officials; Federal and State agencies; and the Onondaga Nation, the Oneida Indian Nation, the Oneida Nation of Wisconsin, the Wyandotte Nation, the Tuscarora Nation, and the Cayuga Nation. USACE held a public scoping meeting at the Clay Town Hall in Clay, NY on Tuesday, March 19, 2024, with the cooperation of CPO and OCIDA. Approximately 175 individuals participated, and 23 individuals made verbal comments regarding the Proposed

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Project. The public comment period on the NOI and NEPA scoping closed on April 5, 2024. By subsequent agreement with USACE, CPO became the lead Federal agency for the Proposed Project on behalf of the Department of Commerce on April 6, 2024.

CPO considered each comment received during the NEPA scoping period and coordinated with OCIDA and USACE to determine the final scope of the Draft EIS under NEPA and inform the related technical analyses and environmental resources to be evaluated. For a summary of the comments that CPO and USACE received during the NEPA scoping period, see Appendix A-3.

1.3.3 Public Review of Draft EIS

CPO filed the Draft EIS with USEPA for issuance of a Notice of Availability in the Federal Register and mailed the Notice of Availability to the parties on the mailing list (Chapter 8, Distribution List). In addition, on June 25, 2025, OCIDA adopted the Draft EIS as complete for the purposes of commencement of public review and set an August 11, 2025, deadline for the receipt of public comments. On that same date, OCIDA adopted a Public Hearing Resolution andIn addition, OCIDA filed the Draft EIS with the Chief Executive Officer of the Town of Clay and the Town of Cicero and published the Notice of Availability in the Environmental Notice Bulletin and The Post-Standard. The NoticesNotice of Availability explained how to access the Draft EIS on CPO’s and OCIDA’s websites, announced a 45-day period for the public to comment on the Draft EIS, and explained how electronic or written comments can be submitted to CPO and OCIDA. In addition, the NoticesNotice of Availability provided notice thatlisted the date, time, and

location of a public hearing to be held in the vicinity of the Proposed Project area to take verbal comments on the Draft EIS would be held on July 24, 2025, from 10AM – 1PM, 2PM – 5PM and 6PM-9PM at the Liverpool High School Auditorium, 4338 Wetzel Road, Liverpool, New York, 13090.

Comments on the Draft EIS were accepted in writing, either by first class mail or electronic mail, or as part of the July 24, 2025, Public Hearing. In total, there were approximately 1270 comment submissions received from the general public on the Draft EIS, some of which were duplicates, from a total of approximately 1050 commenters, some in support of the Proposed Project and Connected Actions and others opposed, which includes three comments from local elected officials. In addition, comments were received from 12 federal, state and local agencies. CPO and OCIDA will address all comments relating to environmental issues made at the public hearing or timely submitted on the Draft EIS in the Final EIS.

1.4 PERMITS, APPROVALS, AND CONSULTATIONS

Table 1.4-1Table 1.4-1 identifies the major permits, approvals, and consultations required for the Proposed Project and Connected Actions. Micron is responsible for obtaining all permits, approvals, or other authorizations required for the Proposed Project, regardless of whether they appear in Table 1.4-1Table 1.4-1.

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Table 1.4-1 Permits, Approvals, and Consultations Permit / Approval Agency Description Federal CWA Section 404 permit USACE Permit required for the discharge of dredged or fill material into waters of the U.S. (WOTUS), including wetlands (33 U.S.C. § 1344). Rivers and Harbors Act Section 10 permit USACE Permit required for structures and/or work in or affecting navigable

WOTUS (33 U.S.C. §

403). ESACWA Section 7 Consultation401 Water Quality USFWSNYSDEC / Formal consultation with Certification NYSDPS Biological Opinion and potential Incidental Take Statement issued by USFWS authorizing incidental take of endangered species (16

U.S.C. §

1536).Certification that activity will not violate state water quality standards (33 U.S.C. § 1341). NHPA Section 106 ConsultationCAA Title V permit NYSHPONYSDEC Consultation with consulting parties regarding effects of an undertaking on historic properties and development of a programmatic agreement (54 U.S.C. § 306108).Permit required to construct and operate a facility that is considered a major source of air emissions that are at or above certain thresholds (New York Environmental Conservation Law (ECL) Article 19).

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT ESA Section 7 Consultation CPO State and LocalFormal Deleted Cells consultation with Deleted Cells Biological Opinion and potential Incidental Take Statement issued by USFWS authorizing incidental take of endangered species (16 U.S.C. § 1536). Financial assistanceNHPA Section 106 Consultation OCIDACPO Approval of application for certain financial assistance; approval of lease and sale of the WPCP, as authorized under law (General Municipal Law Chapter 24).Consultation with consulting parties regarding effects of an undertaking on historic properties and development of a programmatic agreement (54 U.S.C. § 306108). Financial assistanceState and Local ESD Refundable tax credits Inserted Cells under New York’s Green Inserted Cells CHIPS Excelsior Jobs Tax Credit Program (Green CHIPS Act (S. 9467 / A. 10507)). Authorizations for structures in state-owned lands NYSOGSOCIDA Approval of aapplication under waterFinancial assistance for certain financial assistance; approval of lease, easement, or other interest for structures and appurtenances in, on, or above state-owned landssale of the WPCP, as authorized under water (Public Landslaw (General Municipal Law Articles 2 and 6; 6 NYCRR Part 428Chapter 24).

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Work and/or Occupation PermitFinancial assistance NYS Canal Permits for work in CorporationESD and/or occupancy on Canal property (Public Authorities Law Chapter 43-A, Title 1, Section 1005-B).Refundable tax credits under New York’s Green CHIPS Excelsior Jobs Tax Credit Program (Green CHIPS Act (S. 9467 / A. 10507)). Certificate of Environmental Compatibility and NYSDPS / Approval of applicationa Public NeedAuthorizations for structures in state- NYSPSCNYSOGS lease, easement, or other owned lands under water interest for certificatestructures and appurtenances in, on, or above state-owned lands under water (Public ServiceLands Law

Article 7) (exempt from

SEQRA review; NYSDPS conducts a separate environmental review). Articles 2 and 6; 6 NYCRR Part 428). Incidental TakeWork and/or Occupation Permit NYSDECNYS Permit required for Canal Corporation incidental take of state- listed species (ECL

Article 11; 6 NYCRR

Part 182).Permits for work in and/or occupancy on Canal property (Public Authorities Law Chapter 43-A, Title 1, Section 1005-B).

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Stream Disturbance or Modification NYSDECNYSDPS Permit required for any permitCertificate of Environmental Compatibility / NYSPSC change, modification, or and Public Need disturbance of any protected stream, its bed or banks, or to remove from its bed or banks sand, gravel, or other material (ECL Article 15;

6 NYCRR §

608.2).Approval of application for certificate (Public Service Law

Article 7) (exempt from

SEQRA review; NYSDPS conducts a separate environmental review). Protection of Waters permitIncidental Take Permit NYSDEC Permit required to excavate or place fill in waters protected by the Statefor incidental take of state-listed species (ECL Article 1511; 6 NYCRR § 608.5Part 182). Water Supply / Withdrawal PermitStream NYSDEC Permit required for the Disturbance or Modification permit construction, operationany change, modification, or maintenancedisturbance of a water withdrawal systemany protected stream, its bed or banks, or to remove from its bed or banks sand, gravel, or other material (ECL

Article 15; 6 NYCRR

Part 601§ 608.2).

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT SPDES Discharge PermitProtection of Waters NYSDEC SPDES permitPermit permit required to dischargeexcavate or cause a surface or groundwater discharge of any pollutant from any outlet or point source into theplace fill in waters ofprotected by the State (ECL Article 1715; 6 NYCRR Part 750§ 608.5). SPDES Multi-Sector GeneralWater Supply / NYSDEC Permit required for Withdrawal Permit (MSGP) industrial activities that discharge stormwater to surface watersthe construction, operation, or maintenance of the state must obtain coverage under MSGPa water withdrawal system (ECL Article 1715; 6 NYCRR Part 750601). SPDES GeneralDischarge Permit for Construction NYSDEC Construction activities Activities with soil disturbanceSPDES permit required to discharge or cause a surface or groundwater discharge of one or more acres must obtain coverage under the General Permit for Stormwater Dischargesany pollutant from Construction Activitiesany outlet or point source into the waters of the State (ECL

Article 17; 6 NYCRR

Part 750).

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Reclaimed water registration NYSDEC Registration SPDES Multi-Sector General Permit (MSGP) requiredPermit for useindustrial activities that discharge stormwater to surface waters of reclaimed wastewater or greywaterthe state must obtain coverage under MSGP (ECL Article 1517; 6 NYCRR Part 750). SPDES DischargeGeneral Permit, Septic System NYSDEC SPDES permit to Approval for Construction Activities dischargeConstruction activities with soil disturbance of one or cause a surface or groundwater discharge, and approval of plansmore acres must obtain coverage under the General Permit for septic disposal systemStormwater Discharges from Construction Activities (ECL Article 17; 6 NYCRR Part 750). CWA Section 401 Water Quality NYSDEC / Certification that activity CertificationReclaimed water registration NYSDPS will not violate state water quality standards (33 U.S.C. § 1341).Registration required for use of reclaimed wastewater or greywater (ECL Article 15).

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT CAA Title V permitSPDES Discharge Permit, NYSDEC Permit required to Septic System Approval construct and operate a facility that is considered a major source of air emissions that are at or above certain thresholds (New York Environmental Conservation Law (ECL)

Article 19).SPDES

permit to discharge or cause a surface or groundwater discharge, and approval of plans for septic disposal system (ECL Article 17; 6 NYCRR Part 750). Activities on wetland and adjacent areas NYSDEC Permit or letter of permission required to conduct activities on wetlands or adjacent areas not specifically exempted from regulation (ECL Article 24; 6 NYCRR Parts 663- 664). Collection, Disposal and Treatment of Refuse and NYSDEC Permit for generators and Other Solid Wastes transporters of hazardous wastes (ECL Article 27; 6 NYCRR Part 373). Beneficial Use Determination NYSDEC Permit for the beneficial use of large quantities of imported excavated materials that are not mined or purchased (ECL Article 27; 6 NYCRR Parts 360-365). Hazardous Substances and Petroleum Bulk Storage NYSDEC Registrations or license Permits for facilities that store hazardous substances or petroleum above threshold quantities (ECL Articles 17 and 40; 6 NYCRR Parts 597, 598, 610, 613).

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT State air facility permit / registration NYSDEC State air facility permits are required for facilities with potential air emissions that are below major source thresholds, but above 50% of the level that would make them a major source. Air facility registrations are required for facilities with regulated air emissions that are below criteria for either State facility permits or Title V permits (ECL Article 19; 6 NYCRR Part 201). Temporary Roadway Access permit NYSDOT Permit for new or temporary access to a state highway or for activities conducted within the right of way of a NYS highway (NYS Highway Law Article III, § 52). Access or Right-of-Way permit OCDOT Permit for construction or modification of buildings, driveway, and means of access related to County roads (NYS Highway Law Article VI, § 136).

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT County wastewaterwater discharge permit OCDWEP Waste discharge permit to connect to or discharge into the County sewer system (Onondaga County Administrative Code Article XXII,

Section 22, et seq.;

Appendix 11-A, Sections

1153 g, j, 11.67, 11.68, 11.79) and pursuant to

Article IV, Section 4.01

of the Rules and Regulations Relating to the Use of the Public Sewer System issued by the County of Onondaga, Department of Water Environment Protection.). County Planning Review and Recommendation Onondaga County Review and Planning recommendation by the Department Onondaga County Planning Department relative to the discretionary approvals required by the Towns of Clay and Cicero (General Municipal Law Section 239). Zoning Amendment Town of Clay Approval by Town Board Town Board of a Petition for Change of Zone, amending the zoning ordinance, and to reclassify the zoning district (Town of Clay Code Section 230). Subdivision approval Town of Clay Review and approval of Planning Board applications for subdivision of land (Town of Clay Code

Chapter 200, Chapter 230

§ 230-26.B.(2) (Subdivision of Land). Site Plan Review Town of Clay Review and approval of Planning Board site plans (Town of Clay Code § 230-26.B.(4)).

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Special Use Permit Town of Clay Review and approval of Planning Board applications for special use permits (Town of Clay Code § 230- 26.B.(3); §§ 230-27, generally). Subdivision of Land Town of Cicero Review and approval of Planning Board applications for subdivision of land (Chapter 185, Code of the Town of Cicero).

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT

2.0 PROPOSED ACTION AND ALTERNATIVES

This EIS evaluates the Proposed Action and a No Action Alternative. The Proposed Action is identified and referred to in this EIS as the Preferred Action Alternative because it is the alternative that would best meet CPO’s purpose and need under NEPA and Micron’s purpose and need under SEQRA. The Preferred Action Alternative would encompass the Proposed Project and Connected Actions described in Section 2.1 below. The No Action Alternative, as well as three alternatives that were considered but dismissed from further consideration, are discussed in Section 2.2. The WPCP was selected as the site for the proposed Micron Campus following independent site selection processes conducted over time by the State of New York, Onondaga County, and Micron. For a summary of these site selection processes, see Appendix B-1.

2.1 PROPOSED PROJECT AND CONNECTED ACTIONS

The Preferred Action Alternative would consist of: (1) the Proposed Project, which would include the construction and operation by Micron of the Micron Campus, the Rail Spur Site, and the Childcare Site, and the leasing and operation by Micron of the Warehouse Site; and (2) the Connected Actions, which would include the expansion of certain existing utility properties and the construction and operation of various utility improvements by National Grid, OCWA, OCDWEP, and others to support the electricity, natural gas, water supply, wastewater, and telecommunication needs of the Proposed Project.15 The build-out of the Proposed Project and Connected Actions would occur over a 16-year period, based around the construction of the four fabs at the Micron Campus. Although some components of the Preferred Action Alternative have undergone extensive planning, the details of some of the later Connected Actions are still in the planning stages. For additional information and analysis of the estimated resource demands of the Proposed Project and Connected Actions, see Section 3.10 (Utilities and Supporting Infrastructure).

Figure 2.1-1Figure 2.1-1 on the next page shows a map of the components of the Proposed Project and Connected Actions. On the following pages, Source: Light Gray Canvas (Esri, 2025a): Esri, TomTom, Garmin, FAO, NOAA, USGS, © OpenStreetMap contributors, and the GIS User Community.

15 For purposes of this EIS, the term “Connected Action” (synonymous with the term “related action” under SEQRA) refers to a Federal, State, or local activity that would not proceed without construction and operation of the Proposed Project and is therefore considered in this EIS along with the Proposed Project.

2-1 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-2Figure 2.1-2 shows the boundary of the proposed Micron Campus, which would total approximately 1,377 acres, including the 1,339-acre WPCP, a 28-acre South Finger area, the nine-acre Burnet Road right-of-way (ROW), and a one-acre jack and bore site,16 and Figure 2.1-3Figure 2.1-3 shows the construction timeline for the Proposed Project and Connected Actions.

Table 2.1-1Table 2.1-1, following the figures, briefly describes the Proposed Project and Connected Action components, which are described in detail in Sections 2.1.1 through 2.1.9. 16 Although the discussion of the Affected Environment in the EIS generally refers to the WPCP to describe the existing location where the proposed Micron Campus would be built, the Micron Campus also would include the additional properties and acreages adjacent to the current WPCP as described above. 2-1 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-1 Proposed Project and Connected Actions17 Source: Light Gray Canvas (Esri, 2025a): Esri, TomTom, Garmin, FAO, NOAA, USGS, © OpenStreetMap contributors, and the GIS User Community.

17 Disturbance areas that overlap between different project components are only counted a single time for the environmental analyses in Chapter 3.

2-2 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-2 Proposed Micron Campus Boundary Source: Light Gray Canvas (Esri, 2025a): Esri, TomTom, Garmin, FAO, NOAA, USGS, © OpenStreetMap contributors, and the GIS User Community.

2-1 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-3 Proposed Project and Connected Actions Construction Timeline SourcesSource: Micron Technology (n.d.); National Grid (n.d.); OCWA (n.d.); and OCDWEP (n.d.).. Note: Phases 1 and 2 of the OCWA improvements and Stages 1 and 2 of the OCDWEP improvements would be timed to serve Phase 1 (Fabs 1-2) and Phase 2 (Fabs 3-4) of the Micron Campus. The Warehouse Site is not shown but Micron would anticipate leasing warehouse space for a 7-10-year term beginning in April 2026. 2-2 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Table 2.1-1 Proposed Project and Connected Actions Component Description Approx. Area Timing Proposed Project Micron Campus Micron proposes to lease and ultimately purchase from OCIDA the 1,339- 1,377 acres 2025-2029 (Fab 1) acre WPCP located at 5171 NYS Route 31 in Clay, NY. The WPCP, 2028-2030 (Fab 2) together with the approximately 28-acre South Finger (part of Town of 2033-2035 (Fab 3) Cicero tax parcel 091.-01-02.1), which would provide access from U.S. 2039-2041 (Fab 4) Route 11, and the approximately nine-acre Burnet Road ROW, would form the central component of the Micron Campus, which also would 2041-2045 (ramp-up include an approximately one-acre jack and bore site (Town of Clay tax to full production) parcel 048.-01-02.1), which would be solely used for utility lines. The proposed Micron Campus (1,377 total acres) would consist of a semiconductor manufacturing facility with four DRAM production fabs, ancillary support facilities, driveways, parking, and ingress and egress roads with access from NYS Route 31, U.S. Route 11, and Caughdenoy Road and would be constructed in phases over a 16-year period. The facility would reach full production in 20 years.

Rail Spur Site Micron proposes to construct a rail spur and conveyance facility from late 38 acres Q4 2025 to 2025 to the middle of 2026 on approximately 38 acres west of 8625 Q2 2026 Caughdenoy Road, Clay, NY (Town of Clay tax parcel 046.-02-03.2) to convey fill and other aggregate construction material to the Micron Campus.

Childcare Site Micron proposes to construct a childcare center from 2026-2028 and a 31 acres 2026-2028 healthcare center and a recreation center from 2030-2031 on an (Childcare) approximately 31-acre parcel at 9100 Caughdenoy Road, Brewerton, NY 2030-2031 (Town of Clay tax parcel 042-01-13.0). (Healthcare Micron would plan to construct an expansion of the childcare center within and Recreation) a portion of the proposed Childcare Site from 2037-2038. 2037-2038 (Childcare Expansion) Warehouse Site Micron proposes to lease 360,000-500,000 sq. ft. (8.3-11.5 acres) of 8-11 acres Lease in April 2026 existing warehouse space in an industrially zoned area at a to-be- (expected) determined location within 20 miles of the Micron Campus.

2-3 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Connected Actions Electricity National Grid proposes to expand the existing Clay Substation and 39 acres Q4 2025 to construct new 345kV electric transmission lines and eight new Q4 2027 underground duct banks to connect to the Micron Campus.

Natural Gas National Grid proposes to expand an existing gas regulator station (GRS) 3.1-mile gas line Q4 2025 to and construct a new natural gas distribution line from the regulator station Q4 2028 to the Micron Campus.

Water Supply OCWA proposes to undertake two phases of water system capacity and 2.5-mile raw water 2026-2034 (Phase 1 / transmission upgrades to supply water to the Micron Campus. Phase 1 transmission main to serve Fabs 1-2) would involve upgrades to the Lake Ontario Water Treatment Plant 22-mile clear water 2034-2040 (Phase 2 / (LOWTP), Raw Water Pump Station (RWPS),, and Terminal Campus in transmission main to serve Fabs 3-4) Clay, plus construction of an approximately 2.5-mile raw water 5-mile eastern branch transmission main from the pump station to the LOWTP for water supply transmission main redundancy, an approximately 22-mile clear water transmission main and upgrades to running parallel to the existing transmission main from the LOWTP to the existing OCWA Terminal Campus, and an approximately 5-mile transmission main parallel utility properties to the existing Eastern Branch Transmission Main. Phase 2 would involve additional upgrades and potential transmission lines based on need. Wastewater OCDWEP proposes to undertake two stages of wastewater treatment 36 acres (existing 2026-2029 (Stage 1 / system capacity and conveyance upgrades to serve the Micron Campus. utility property) to serve Fabs 1-2) Stage 1 would involve a bridging project at the existing 2033-2035 (Stage 2 / OOWWTPOWWTP to receive sanitary wastewater and temporarily to serve Fabs 3-4) accommodate startup industrial wastewater from the Micron Campus as OCDWEP constructs a new IWWTP and water reuse facilities on 36 acres of its existing 76-acre Oak Orchard site, plus construction of a new industrial wastewater conveyance from the Oak Orchard site to the Micron Campus. Stage 2 would expand and upgrade the IWWTP to serve additional campus industrial wastewater flows.

Telecomm. Fiber optic telecommunication lines would be re-routed to serve the 1-2 miles (cable 2026 Micron Campus. extensions) Sources: Micron Technology (n.d.);; National Grid (n.d.);; OCWA (n.d.);; OCDWEP (n.d.).. 2-4 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT

2.1.1 Micron Campus

2.1.1.1 Overview

The Micron Campus is the primary component of the Proposed Project. Micron proposes to construct a semiconductor manufacturing facility on 1,377 acres, which includes the WPCP, the Burnet Road ROW, the South Finger, and the one-acre jack and bore site for utility lines. The facility would include four fabs built in phases over an approximatelya 16-year period as shown in Table 2.1-1Table 2.1-1. The construction period (2025-2041) would conclude with completion of the Fab 4 buildings.

Table 2.1-2 Micron Campus Fab Construction Schedule Building Construction Ready for Operations Phase Fab Construction Start Equipment Start End Phase 1A Fab 1 Q4 2025 Q2 2028 Q2 2028 Q1 2029 Phase 1B Fab 2 Q3 2028 Q3 2030 Q4 2030 Q4 2030 Phase 2A Fab 3 Q3 2033 Q3 2035 Q4 2035 Q4 2035 Phase 2B Fab 4 Q2 2039 Q2 2041 Q3 2041 Q3 2041 Source: Micron Technology. Note: Fab 4 building construction would end in Q3 2041, with final site work continuing into late 2041, internal equipment fit out continuing in 2042, and ramp up to full production by 2045. In Table 2.1-2Table 2.1-2, “Construction Startconstruction start” refers to when large scale site preparation and construction of the external fab building or “shell” would begin; the “ready for equipment” dates are when semiconductor manufacturing equipment and tools would be installed inside the fab buildings; “Building Construction Endconstruction end” refers to the completion and of the fab building; fab operations would then start soon after. The fabs would be built sequentially from west to east. When external construction of a fab building is completed, internal construction would continue as semiconductor manufacturing equipment and tools are installed inside. While internal construction begins on one fab, external construction of the next fab would begin. This process would result in continuous construction activity on the Micron Campus from 2025 to 2041. For schematics showing the sequential build-out of the four phases, see Appendix B-2.

For a visual rendering of the final Micron Campus, see Figure 2.1-4Figure 2.1-4 on the next page. Following the rendering, Sections 2.1.1.2 through 2.1.1.5 provide additional information on Micron Campus site preparation, foundation work, and building erection; the main components of the campus; and its estimated construction and operational labor force requirements.

For a more detailed description of the site preparation process, see Section 3.2 (Geology, Soils, and Topography). For more detailed information on the anticipated effects of site preparation and construction work for the Micron Campus relating to transportation, traffic, noise, and other aspects of the surrounding local community, see Sections 3.11 (Transportation and Traffic), 3.12 (Noise and Vibration), 3.13 (Visual Effects and Community Character), and 3.14 (Community 2-5 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Facilities, Open Space, and Recreation).

2-6 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-4 Micron Campus Visual Rendering Source: Micron Technology (n.d.)..

2-7 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT

2.1.1.2 Site Preparation

Preparing the proposed Micron Campus for construction would require approximately 997 acres of ground disturbance, including 445 acres of tree clearing and grubbing. Site preparation activities for Fab 1 at the western limits of the WPCP would start first and would include tree clearing, grubbing, soil excavation and removal, import of fill material, installation of erosion and sediment control, and grading. When tree clearing and site preparation occurs sequentially, the process below would occur over a continuous period of time. However, there will be periods when tree clearing and limited site preparation will occur followed by a pause before more intensive site preparation (see Fab 3 and 4).

In general, siteSite preparation also would incorporate the following activities: • Mobilizing contractors to commence the work within the site boundary and prepare contractor areas for future activity.

• Identifying the limits of tree clearing and flagging and staking all buffer areas, sensitive areas, and wetlands prior to the start of construction.

• Installing temporary erosion and sediment controls, stormwater management areas, and stormwater infrastructure.

• Establishing site access points and installing perimeter fencing for security. • Setting up infrastructure at the site, including contractor offices, laydown areas, precast yards, and personnel parking.

• Constructing haul roads into and out of the site and setting up traffic arrangements. • Performing site clearing and landscape grubbing work.

• Installing cut-and-fill earthworks to create the necessary level platform areas before foundation work commences.

In general, site preparation and construction activity for the Micron Campus would take place seven days a week between the hours of 6 a.m. and 10 p.m.18 For more detailed information on construction dates, times, and restrictions, see Section 3.12 (Noise and Vibration).

2.1.1.3 Foundation Work

Foundation work, also described in further detail in Section 3.2 (Geology, Soils, and Topography), would require installation of drilled piers into bedrock followed by concrete work to pour and form slabs or “pads” for the fab buildings. At this stage, Micron also would perform any necessary dewatering work and install underground utility lines. After completing foundations 18 Applicable Town of Clay requirements currently do not authorize construction activities during these extended times. Micron is in discussions with the Town of Clay to either modify or obtain a variance from the applicable requirements to facilitate timely construction of the Proposed Project as presented in this EIS and will comply with all applicable noise ordinances. See Section 3.12 (Noise and Vibration) for more information. 2-8 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT and any necessary fill and grading, Micron would place topsoil and seed disturbed areas for regrowth.

2.1.1.4 Building Erection

At the fab building erection stage, Micron would install pre-cast concrete superstructures (either produced on or off-site) and install enclosures beginning from the lower floors and continuing up to the top of the buildings. Interior partitions and dividing walls would be framed concurrently with building enclosure installation. Following the enclosure of each floor, mechanical, electrical, plumbing, and process system rough-ins would be installed. Finally, Micron would complete interior work, including interior finishes, painting, cabinetry, and installation of plumbing fixtures and appliances.

Final sitework would include completing the building rooftops and installing surrounding landscapes, as well as paving work, site lighting work, and remaining landscaping activity. At full build-out in 2041, the Micron Campus would include 645 acres of new impervious surface, 58 acres of semi-pervious area, and 278 acres of green space within the 997-acre construction disturbance footprint.

For each fab, the foundation work, erection of building shells, and other exterior construction would span roughly a 1-year period. A significant portion of the construction activities during the 16-year construction period would occur inside the fab building shells and, with the exception of equipment deliveries, would not be visible or exposed to surrounding residents or the general public.

2.1.1.5 Components

Figure 2.1-5Figure 2.1-5 below provides a site plan of the Micron Campus. Following the site plan, Table 2.1-3Table 2.1-3 provides descriptions of the main components of the campus. 2-9 MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Figure 2.1-5 Micron Campus Site Plan Source: Micron Technology (n.d.)..

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Table 2.1-3 Micron Campus Components Component Plan Marker Area Description Fabrication FAB 4.8 million Micron proposes to construct four fabs, each with an identical footprint of approximately 27.5 Buildings (4) sq. ft. acres or 1.2 million sq. ft. (600,000 sq. ft. of cleanroom space and 600,000 sq. ft. for the supporting building infrastructure and utilities needed to operate the fab), for a total footprint for all four fabs of 4.8 million sq. ft. at full build-out in 2041. By constructing the fabs sequentially in phases, Micron would be able to begin chip manufacturing at the Micron Campus as soon as Fab 1 becomes operational. The four fabs would be constructed in close proximity to each other with the same layout, orientation, and finished floor elevation, and would be successively connected as they are constructed to form the “spine” of the manufacturing facility, to maximize efficiencies and flows across the fabs and the production efficiency of the facility as a whole. Each fab would have a typical height of approximately 148 ft., with the tallest small individual roof penthouses reaching a height of 160 ft. Operations at each fab would include raw material receiving, memory chip manufacturing, and final product storage and shipping. Manufacturing operations would commence upon completion of construction and equipment installation and testing. Administration A 478,000 Four administration buildings to the south of the probe buildings (see below), each approximately Buildings (4) sq. ft. 105 ft. tall with a 119,500 sq. ft. footprint, would provide office space supporting the estimated 2,000 manufacturing employees at each fab. Probe B 730,400 Four probe buildings to conduct electrical testing on manufactured chips before they are shipped Buildings (4) sq. ft. would each have an approximately 182,600 sq. ft. (4.2 acre) footprint and approximately 85,000 sq. ft. of cleanroom space on the upper floor (for a total 340,000 sq. ft. of cleanroom space). These buildings also include a small number of emergency generators. Central C 1.8 million Four central utility buildings (CUBs), one dedicated to each fab, would house the systems Utilities sq. ft. required to deliver the utilities necessary to produce the chips, including HVAC, electrical Buildings (4) transmission equipment, water purification and recycling, and chemical/specialty gas delivery systems. Each CUB would be 73 ft. tall with a 441,210 sq. ft. (10.1 acre) footprint consisting of multiple individual utility plant modules to house the heating, cooling, compressed air, electrical equipment, and emergency generators (approximately 60 per CUB) serving the surrounding buildings associated with each fab. A small number of emergency generators would also be located outside the CUB at other locations on campus, including emergency fire pump engines.

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Electrical D 700,000 Four electrical yards and substations, one for each fab, each with a 175,000 sq. ft. (4-acre) Yards and sq. ft. footprint, would be constructed on the north sides of the fabs, and would supply the electrical Substations (4) needs for full fab operations.

Hazardous E 2.1 million Eight hazardous process materials buildings, each with a 525,000 sq. ft. (12 acre) footprint, would Process sq ft. store and dispense specialized chemicals and gases for manufacturing and would be arranged as Materials four groupings of two buildings each, with identical footprints and configurations, located Buildings (8) between Fabs 1 and 2 and Fabs 3 and 4.

Water and F 2.46 million Six WWT facilities would be constructed in four identified WWT locations, each with a 615,000 Wastewater sq. ft. sq. ft. (14.1 acre) footprint, one for each fab and biological treatment (BIO) facility (see below), Treatment and would ensure that incoming water meets Micron’s high-purity specifications for (WWT) manufacturing, provide treatment for on-site reuse, and ensure that outgoing wastewater meets Facilities (6) quality requirements for treatment at the wastewater treatment and renewal facility. Bulk Gas G 1.88 million Four bulk gas yards, each with an approximately 455,000 sq. ft. (10.5 acre) footprint, 170 ft. tall Yards (4) sq. ft. columns, and cold box units, would be constructed north of the fab buildings. The gas yards would be used to isolate oxygen, argon, and nitrogen from the ambient air for use in the fabrication process, which is more efficient than trucking in gases. Industrial H 216,554 An on-site industrial wastewater facility and pump station would provide an alternative collection Pretreatment sq. ft. area for incoming treated and reclaimed water from the OCDWEP IWWTP that does not meet Wastewater specifications or if outgoing water chemistry or volume exceeds Micron’s standards for delivery Facility (1) to the IWWTP.

Biological I 731,808 Four biological treatment (BIO) facilities, each with a 182,952 sq. ft. (4.2 acre) footprint, would Wastewater sq. ft. remove dissolved organic contaminants and nutrients from wastewater prior to sending the Treatment wastewater to the IWWTP.

Facility (4) Backflow J 15,000 Two 7,500 sq. ft. backflow prevention buildings would ensure that site water could not flow back Prevention sq. ft. into the OCWA water mains. One would be located at the southwest corner where the water Building (2) mains enter the site near the intersection of NYS Route 31 and Caughdenoy Road, supporting Fabs 1 and 2, and the second would be located on the southeast corner to support Fabs 3 and 4.

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MICRON SEMICONDUCTOR MANUFACTURING PROJECT, CLAY, NY, FINALDRAFT ENVIRONMENTAL IMPACT STATEMENT Surface K 1.36 million 11,600 parking spaces,19 four bus stops, and seven access roads would be constructed on the Parking (4), sq. ft. campus, including four 500-space surface parking lots south of the administration and probe Structured buildings and four 2,400-space structured parking areas (indicated with a diagonal hatch on Parking (4), Figure 2.1-5Figure 2.1-5), totaling 8.19 million sq. ft. (188 acres) of new impervious area and Access associated with paved surface parking and site access roadways. Roads (7) Three of the access roads would enter the campus from Caughdenoy Road near the Rail Spur Site, three from NYS Route 31, and one from U.S. Route 11 on the east side of the campus, traversing land area within the Town of Cicero. As the construction phases progress from west to east and fab operations begin, the use of the access roads would shift from construction to permanent employee access. Micron would implement site traffic plans to ensure safety during construction phases of the campus build-out. Rooftop Solar N/A N/A Micron would install approximately 4 megawatt (MW) of solar panels on the roofs of the parking Energy garages, WWT buildings, and BIO buildings. Stormwater SMP (#) 2.9 million Stormwater management practice (SMP) areas would be constructed throughout the campus to Management sq. ft. detain and treat stormwater runoff from its approximately 645 acres of newly created impervious Practice Areas surfaces. SMPs would include wet extended detention ponds (SMPs 01, 03, 11, 12, 13, 14, 15, (15) and 17 in Figure 2.1-5Figure 2.1-5) and filtration bioretention (SMPs 02, 05, 07, 08, 09, 10, and 16).20 The SMPs would be built in phases along with the campus construction phases and would be sized according to hydrologic and hydraulic modeling conducted for the site. Source: Micron Technology (n.d.)..